High-level services for networks-on-chip

Future technology trends envision that next-generation Multiprocessors Systems-on- Chip (MPSoCs) will be composed of a combination of a large number of processing and storage elements interconnected by complex communication architectures. Communication and interconnection between these basic blocks play a role of crucial importance when the number of these elements increases. Enabling reliable communication channels between cores becomes therefore a challenge for system designers. Networks-on-Chip (NoCs) appeared as a strategy for connecting and managing the communication between several design elements and IP blocks, as required in complex Systems-on-Chip (SoCs). The topic can be considered as a multidisciplinary synthesis of multiprocessing, parallel computing, networking, and on- chip communication domains. Networks-on-Chip, in addition to standard communication services, can be employed for providing support for the implementation of system-level services. This dissertation will demonstrate how high-level services can be added to an MPSoC platform by embedding appropriate hardware/software support in the network interfaces (NIs) of the NoC. In this dissertation, the implementation of innovative modules acting in parallel with protocol translation and data transmission in NIs is proposed and evaluated. The modules can support the execution of the high-level services in the NoC at a relatively low cost in terms of area and energy consumption. Three types of services will be addressed and discussed: security, monitoring, and fault tolerance. With respect to the security aspect, this dissertation will discuss the implementation of an innovative data protection mechanism for detecting and preventing illegal accesses to protected memory blocks and/or memory mapped peripherals. The second aspect will be addressed by proposing the implementation of a monitoring system based on programmable multipurpose monitoring probes aimed at detecting NoC internal events and run-time characteristics. As last topic, new architectural solutions for the design of fault tolerant network interfaces will be presented and discussed

Fault-tolerant networks-on-chip routing with coarse and fine-grained look-ahead

Fault tolerance and adaptive capabilities are challenges for modern networks-on-chip (NoC) due to the increase in physical defects in advanced manufacturing processes. Two novel adaptive routing algorithms, namely coarse and fine-grained (FG) look-ahead algorithms, are proposed in this paper to enhance 2-D mesh/torus NoC system fault-tolerant capabilities. These strategies use fault flag codes from neighboring nodes to obtain the status or conditions of real-time traffic in an NoC region, then calculate the path weights and choose the route to forward packets. This approach enables the router to minimize congestion for the adjacent connected channels and also to bypass a path with faulty channels by looking ahead at distant neighboring router paths. The novelty of the proposed routing algorithms is the weighted path selection strategies, which make near-optimal routing decisions to maintain the NoC system performance under high fault rates. Results show that the proposed routing algorithms can achieve performance improvement compared to other state of the art works under various traffic loads and high fault rates. The routing algorithm with FG look-ahead capability achieves a higher throughput compared with the coarse-grained approach under complex fault patterns. The hardware area/power overheads of both routing approaches are relatively low which does not prohibit scalability for large-scale NoC implementations

Toward Reliable, Secure, and Energy-Efficient Multi-Core System Design

Computer hardware researchers have perennially focussed on improving the performance of computers while stipulating the energy consumption under a strict budget. While several innovations over the years have led to high performance and energy efficient computers, more challenges have also emerged as a fallout. For example, smaller transistor devices in modern multi-core systems are afflicted with several reliability and security concerns, which were inconceivable even a decade ago. Tackling these bottlenecks happens to negatively impact the power and performance of the computers. This dissertation explores novel techniques to gracefully solve some of the pressing challenges of the modern computer design. Specifically, the proposed techniques improve the reliability of on-chip communication fabric under a high power supply noise, increase the energy-efficiency of low-power graphics processing units, and demonstrate an unprecedented security loophole of the low-power computing paradigm through rigorous hardware-based experiments

Energy-Efficient and Reliable Computing in Dark Silicon Era

Dark silicon denotes the phenomenon that, due to thermal and power constraints, the fraction of transistors that can operate at full frequency is decreasing in each technology generation. Moore’s law and Dennard scaling had been backed and coupled appropriately for five decades to bring commensurate exponential performance via single core and later muti-core design. However, recalculating Dennard scaling for recent small technology sizes shows that current ongoing multi-core growth is demanding exponential thermal design power to achieve linear performance increase. This process hits a power wall where raises the amount of dark or dim silicon on future multi/many-core chips more and more. Furthermore, from another perspective, by increasing the number of transistors on the area of a single chip and susceptibility to internal defects alongside aging phenomena, which also is exacerbated by high chip thermal density, monitoring and managing the chip reliability before and after its activation is becoming a necessity. The proposed approaches and experimental investigations in this thesis focus on two main tracks: 1) power awareness and 2) reliability awareness in dark silicon era, where later these two tracks will combine together. In the first track, the main goal is to increase the level of returns in terms of main important features in chip design, such as performance and throughput, while maximum power limit is honored. In fact, we show that by managing the power while having dark silicon, all the traditional benefits that could be achieved by proceeding in Moore’s law can be also achieved in the dark silicon era, however, with a lower amount. Via the track of reliability awareness in dark silicon era, we show that dark silicon can be considered as an opportunity to be exploited for different instances of benefits, namely life-time increase and online testing. We discuss how dark silicon can be exploited to guarantee the system lifetime to be above a certain target value and, furthermore, how dark silicon can be exploited to apply low cost non-intrusive online testing on the cores. After the demonstration of power and reliability awareness while having dark silicon, two approaches will be discussed as the case study where the power and reliability awareness are combined together. The first approach demonstrates how chip reliability can be used as a supplementary metric for power-reliability management. While the second approach provides a trade-off between workload performance and system reliability by simultaneously honoring the given power budget and target reliability

Decompose and Conquer: Addressing Evasive Errors in Systems on Chip

Modern computer chips comprise many components, including microprocessor cores, memory modules, on-chip networks, and accelerators. Such system-on-chip (SoC) designs are deployed in a variety of computing devices: from internet-of-things, to smartphones, to personal computers, to data centers. In this dissertation, we discuss evasive errors in SoC designs and how these errors can be addressed efficiently. In particular, we focus on two types of errors: design bugs and permanent faults. Design bugs originate from the limited amount of time allowed for design verification and validation. Thus, they are often found in functional features that are rarely activated. Complete functional verification, which can eliminate design bugs, is extremely time-consuming, thus impractical in modern complex SoC designs. Permanent faults are caused by failures of fragile transistors in nano-scale semiconductor manufacturing processes. Indeed, weak transistors may wear out unexpectedly within the lifespan of the design. Hardware structures that reduce the occurrence of permanent faults incur significant silicon area or performance overheads, thus they are infeasible for most cost-sensitive SoC designs. To tackle and overcome these evasive errors efficiently, we propose to leverage the principle of decomposition to lower the complexity of the software analysis or the hardware structures involved. To this end, we present several decomposition techniques, specific to major SoC components. We first focus on microprocessor cores, by presenting a lightweight bug-masking analysis that decomposes a program into individual instructions to identify if a design bug would be masked by the program's execution. We then move to memory subsystems: there, we offer an efficient memory consistency testing framework to detect buggy memory-ordering behaviors, which decomposes the memory-ordering graph into small components based on incremental differences. We also propose a microarchitectural patching solution for memory subsystem bugs, which augments each core node with a small distributed programmable logic, instead of including a global patching module. In the context of on-chip networks, we propose two routing reconfiguration algorithms that bypass faulty network resources. The first computes short-term routes in a distributed fashion, localized to the fault region. The second decomposes application-aware routing computation into simple routing rules so to quickly find deadlock-free, application-optimized routes in a fault-ridden network. Finally, we consider general accelerator modules in SoC designs. When a system includes many accelerators, there are a variety of interactions among them that must be verified to catch buggy interactions. To this end, we decompose such inter-module communication into basic interaction elements, which can be reassembled into new, interesting tests. Overall, we show that the decomposition of complex software algorithms and hardware structures can significantly reduce overheads: up to three orders of magnitude in the bug-masking analysis and the application-aware routing, approximately 50 times in the routing reconfiguration latency, and 5 times on average in the memory-ordering graph checking. These overhead reductions come with losses in error coverage: 23% undetected bug-masking incidents, 39% non-patchable memory bugs, and occasionally we overlook rare patterns of multiple faults. In this dissertation, we discuss the ideas and their trade-offs, and present future research directions.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147637/1/doowon_1.pd

Ethernet - a survey on its fields of application

During the last decades, Ethernet progressively became the most widely used local area networking (LAN) technology. Apart from LAN installations, Ethernet became also attractive for many other fields of application, ranging from industry to avionics, telecommunication, and multimedia. The expanded application of this technology is mainly due to its significant assets like reduced cost, backward-compatibility, flexibility, and expandability. However, this new trend raises some problems concerning the services of the protocol and the requirements for each application. Therefore, specific adaptations prove essential to integrate this communication technology in each field of application. Our primary objective is to show how Ethernet has been enhanced to comply with the specific requirements of several application fields, particularly in transport, embedded and multimedia contexts. The paper first describes the common Ethernet LAN technology and highlights its main features. It reviews the most important specific Ethernet versions with respect to each application field’s requirements. Finally, we compare these different fields of application and we particularly focus on the fundamental concepts and the quality of service capabilities of each proposal

Security of Electrical, Optical and Wireless On-Chip Interconnects: A Survey

The advancement of manufacturing technologies has enabled the integration of more intellectual property (IP) cores on the same system-on-chip (SoC). Scalable and high throughput on-chip communication architecture has become a vital component in today's SoCs. Diverse technologies such as electrical, wireless, optical, and hybrid are available for on-chip communication with different architectures supporting them. Security of the on-chip communication is crucial because exploiting any vulnerability would be a goldmine for an attacker. In this survey, we provide a comprehensive review of threat models, attacks, and countermeasures over diverse on-chip communication technologies as well as sophisticated architectures.Comment: 41 pages, 24 figures, 4 table