Monte Carlo Modeling of Spin FETs Controlled by Spin-Orbit Interaction

A method for Monte Carlo simulation of 2D spin-polarized electron transport in III-V semiconductor heterojunction FETs is presented. In the simulation, the dynamics of the electrons in coordinate and momentum space is treated semiclassically. The density matrix description of the spin is incorporated in the Monte Carlo method to account for the spin polarization dynamics. The spin-orbit interaction in the spin FET leads to both coherent evolution and dephasing of the electron spin polarization. Spin-independent scattering mechanisms, including optical phonons, acoustic phonons and ionized impurities, are implemented in the simulation. The electric field is determined self-consistently from the charge distribution resulting from the electron motion. Description of the Monte Carlo scheme is given and simulation results are reported for temperatures in the range 77-300 K.Comment: 18 pages, 7 figure

3-D TCAD Monte Carlo device simulator : state-of-the-art FinFET simulation

This work presents a comprehensive description of an in-house 3D Monte Carlo device simulator for physical mod-eling of FinFETs. The simulator was developed to consider var-iability effects properly and to be able to study deeply scaled devices operating in the ballistic and quasi-ballistic regimes. The impact of random dopants and trapped charges in the die-lectric is considered by treating electron-electron and electron-ion interactions in real-space. Metal gate granularity is in-cluded through the gate work functionvariation. The capability to evaluate these effects in nanometer3D devices makes the pre-sented simulator unique, thus advancing the state-of-the-art. The phonon scattering mechanisms, used to model the transport of electrons in puresilicon material system, were validated by comparing simulated drift velocities withavailable experi-mental data. The proper behavior of the device simulator is dis-played in a series of studies of the electric potentialin the device, the electron density, the carrier's energy and velocity, and the Id-Vg and Id-Vd curves

A Multicarrier Technique for Monte Carlo Simulation of Electrothermal Transport in Nanoelectronics

The field of microelectronics plays an important role in many areas of engineering and science, being ubiquitous in aerospace, industrial manufacturing, biotechnology, and many other fields. Today, many micro- and nanoscale electronic devices are integrated into one package. e capacity to simulate new devices accurately is critical to the engineering design process, as device engineers use simulations to predict performance characteristics and identify potential issues before fabrication. A problem of particular interest is the simulation of devices which exhibit exotic behaviors due to non-equilibrium thermodynamics and thermal effects such as self-heating. Frequently, it is desirable to predict the level of heat generation, the maximum temperature and its location, and the impact of these thermal effects on the current-voltage (IV) characteristic of a device. is problem is furthermore complicated by nanoscale device dimensions. As the ratio of surface area to volume increases, boundary effects tend to dominate the transfer of energy through a device. Effects such as quantum confinement begin to play a role for nanoscale devices as geometric feature sizes approach the wavelength of the particles involved. Classical approaches to charge transport and heat transfer simulation such as the drift-diffusion approach and Fourier’s law, respectively, do not provide accurate results at these length scales. Instead, the transport processes are governed by the semi-classical Boltzmann transport equation (BTE) with quantum corrections derived from the Schrodinger equation ̈ (SE). In this work, a technique is presented for coupling a 3D phonon Monte Carlo (MC) simulation to an electron multi-subband Monte Carlo (MSBMC) simulation. Both carrier species are first examined separately. An electron MC simulation of bulk silicon, a silicon n-i-n diode, and an intrinsic-channel fin-field effect transistor (FinFET) structure are also presented. A 3D phonon MC algorithm is demonstrated in bulk silicon, a silicon thin film, and a silicon nanoconstriction. These tests verify the correctness of the MC framework. Finally, a novel carrier scattering system which directly accounts for the interaction be- tween the two particle populations inside a nanoscale device is shown. e tool developed supports quantum size effects and is shown to be capable of modeling the exchange of energy between thermal and electronic particle systems in a silicon FinFET

Asymptotic-Preserving Monte Carlo methods for transport equations in the diffusive limit

We develop a new Monte Carlo method that solves hyperbolic transport equations with stiff terms, characterized by a (small) scaling parameter. In particular, we focus on systems which lead to a reduced problem of parabolic type in the limit when the scaling parameter tends to zero. Classical Monte Carlo methods suffer of severe time step limitations in these situations, due to the fact that the characteristic speeds go to infinity in the diffusion limit. This makes the problem a real challenge, since the scaling parameter may differ by several orders of magnitude in the domain. To circumvent these time step limitations, we construct a new, asymptotic-preserving Monte Carlo method that is stable independently of the scaling parameter and degenerates to a standard probabilistic approach for solving the limiting equation in the diffusion limit. The method uses an implicit time discretization to formulate a modified equation in which the characteristic speeds do not grow indefinitely when the scaling factor tends to zero. The resulting modified equation can readily be discretized by a Monte Carlo scheme, in which the particles combine a finite propagation speed with a time-step dependent diffusion term. We show the performance of the method by comparing it with standard (deterministic) approaches in the literature

Monte Carlo study of current variability in UTB SOI DG MOSFETs

The scaling of conventional silicon based MOSFETs is increasingly difficult into the nanometer regime due to short channel effects, tunneling and subthreshold leakage current. Ultra-thin body silicon-on-insulator based architectures offer a promising alternative, alleviating these problems through their geometry. However, the transport behaviour in these devices is more complex, especially for silicon thicknesses below 10 nm, with enhancement from band splitting and volume inversion competing with scattering from phonons, Coulomb interactions, interface roughness and body thickness fluctuation. Here, the effect of the last scattering mechanism on the drive current is examined as it is considered a significant limitation to device performance for body thicknesses below 5 nm. A simulation technique that properly captures non-equilibrium transport, includes quantum effects and maintains computational efficiency is essential for the study of this scattering mechanism. Therefore, a 3D Monte Carlo simulator has been developed which includes this scattering effect in an ab initio fashion, and quantum corrections using the Density Gradient formalism. Monte Carlo simulations using `frozen field' approximation have been carried out to examine the dependence of mobility on silicon thickness in large, self averaging devices. This approximation is then used to carry out statistical studies of uniquely different devices to examine the variability of on-current. Finally, Monte Carlo simulations self consistent with Poisson's equation have been carried out to further investigate this mechanism