Power supply noise in delay testing

As technology scales into the Deep Sub-Micron (DSM) regime, circuit designs have become more and more sensitive to power supply noise. Excessive noise can significantly affect the timing performance of DSM designs and cause non-trivial additional delay. In delay test generation, test compaction and test fill techniques can produce excessive power supply noise. This will eventually result in delay test overkill. To reduce this overkill, we propose a low-cost pattern-dependent approach to analyze noise-induced delay variation for each delay test pattern applied to the design. Two noise models have been proposed to address array bond and wire bond power supply networks, and they are experimentally validated and compared. Delay model is then applied to calculate path delay under noise. This analysis approach can be integrated into static test compaction or test fill tools to control supply noise level of delay tests. We also propose an algorithm to predict transition count of a circuit, which can be applied to control switching activity during dynamic compaction. Experiments have been performed on ISCAS89 benchmark circuits. Results show that compacted delay test patterns generated by our compaction tool can meet a moderate noise or delay constraint with only a small increase in compacted test set size. Take the benchmark circuit s38417 for example: a 10% delay increase constraint only results in 1.6% increase in compacted test set size in our experiments. In addition, different test fill techniques have a significant impact on path delay. In our work, a test fill tool with supply noise analysis has been developed to compare several test fill techniques, and results show that the test fill strategy significant affect switching activity, power supply noise and delay. For instance, patterns with minimum transition fill produce less noise-induced delay than random fill. Silicon results also show that test patterns filled in different ways can cause as much as 14% delay variation on target paths. In conclusion, we must take noise into consideration when delay test patterns are generated

Low Cost Power and Supply Noise Estimation and Control in Scan Testing of VLSI Circuits

Test power is an important issue in deep submicron semiconductor testing. Too much power supply noise and too much power dissipation can result in excessive temperature rise, both leading to overkill during delay test. Scan-based test has been widely adopted as one of the most commonly used VLSI testing method. The test power during scan testing comprises shift power and capture power. The power consumed in the shift cycle dominates the total power dissipation. It is crucial for IC manufacturing companies to achieve near constant power consumption for a given timing window in order to keep the chip under test (CUT) at a near constant temperature, to make it easy to characterize the circuit behavior and prevent delay test over kill. To achieve constant test power, first, we built a fast and accurate power model, which can estimate the shift power without logic simulation of the circuit. We also proposed an efficient and low power X-bit Filling process, which could potentially reduce both the shift power and capture power. Then, we introduced an efficient test pattern reordering algorithm, which achieves near constant power between groups of patterns. The number of patterns in a group is determined by the thermal constant of the chip. Experimental results show that our proposed power model has very good correlation. Our proposed X-Fill process achieved both minimum shift power and capture power. The algorithm supports multiple scan chains and can achieve constant power within different regions of the chip. The greedy test pattern reordering algorithm can reduce the power variation from 29-126 percent to 8-10 percent or even lower if we reduce the power variance threshold. Excessive noise can significantly affect the timing performance of Deep Sub-Micron (DSM) designs and cause non-trivial additional delay. In delay test generation, test compaction and test fill techniques can produce excessive power supply noise. This can result in delay test overkill. Prior approaches to power supply noise aware delay test compaction are too costly due to many logic simulations, and are limited to static compaction. We proposed a realistic low cost delay test compaction flow that guardbands the delay using a sequence of estimation metrics to keep the circuit under test supply noise more like functional mode. This flow has been implemented in both static compaction and dynamic compaction. We analyzed the relationship between delay and voltage drop, and the relationship between effective weighted switching activity (WSA) and voltage drop. Based on these correlations, we introduce the low cost delay test pattern compaction framework considering power supply noise. Experimental results on ISCAS89 circuits show that our low cost framework is up to ten times faster than the prior high cost framework. Simulation results also verify that the low cost model can correctly guardband every path‟s extra noise-induced delay. We discussed the rules to set different constraints in the levelized framework. The veto process used in the compaction can be also applied to other constraints, such as power and temperature