34 research outputs found

    Overview of emerging nonvolatile memory technologies

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    Emerging physical unclonable functions with nanotechnology

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    Physical unclonable functions (PUFs) are increasingly used for authentication and identification applications as well as the cryptographic key generation. An important feature of a PUF is the reliance on minute random variations in the fabricated hardware to derive a trusted random key. Currently, most PUF designs focus on exploiting process variations intrinsic to the CMOS technology. In recent years, progress in emerging nanoelectronic devices has demonstrated an increase in variation as a consequence of scaling down to the nanoregion. To date, emerging PUFs with nanotechnology have not been fully established, but they are expected to emerge. Initial research in this area aims to provide security primitives for emerging integrated circuits with nanotechnology. In this paper, we review emerging nanotechnology-based PUFs

    Gestión de jerarquías de memoria híbridas a nivel de sistema

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    Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

    Emerging embedded nonvolatile memory solution for ultra low power microcontroller systems

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    13301甲第4810号博士(工学)金沢大学博士論文本文Full 以下に掲載および掲載予定:1.IEEE Journal of Solid-State Circuits 27(4) pp.569-573 1992. IEEE. 共著者:M. Hayashikoshi, H. Hidaka, K. Arimoto, K. Fujishima 2.IEEE Transactions on Multi-Scale Computing Systems IEEE. 共著者:M. Hayashikoshi, H. Noda, H. Kawai, Y. Murai, S. Otani, K. Nii, Y. Matsuda, H. Kond

    Special Topics in Information Technology

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    This open access book presents thirteen outstanding doctoral dissertations in Information Technology from the Department of Electronics, Information and Bioengineering, Politecnico di Milano, Italy. Information Technology has always been highly interdisciplinary, as many aspects have to be considered in IT systems. The doctoral studies program in IT at Politecnico di Milano emphasizes this interdisciplinary nature, which is becoming more and more important in recent technological advances, in collaborative projects, and in the education of young researchers. Accordingly, the focus of advanced research is on pursuing a rigorous approach to specific research topics starting from a broad background in various areas of Information Technology, especially Computer Science and Engineering, Electronics, Systems and Control, and Telecommunications. Each year, more than 50 PhDs graduate from the program. This book gathers the outcomes of the thirteen best theses defended in 2019-20 and selected for the IT PhD Award. Each of the authors provides a chapter summarizing his/her findings, including an introduction, description of methods, main achievements and future work on the topic. Hence, the book provides a cutting-edge overview of the latest research trends in Information Technology at Politecnico di Milano, presented in an easy-to-read format that will also appeal to non-specialists

    Nano-intrinsic security primitives for internet of everything

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    With the advent of Internet-enabled electronic devices and mobile computer systems, maintaining data security is one of the most important challenges in modern civilization. The innovation of physically unclonable functions (PUFs) shows great potential for enabling low-cost low-power authentication, anti-counterfeiting and beyond on the semiconductor chips. This is because secrets in a PUF are hidden in the randomness of the physical properties of desirably identical devices, making it extremely difficult, if not impossible, to extract them. Hence, the basic idea of PUF is to take advantage of inevitable non-idealities in the physical domain to create a system that can provide an innovative way to secure device identities, sensitive information, and their communications. While the physical variation exists everywhere, various materials, systems, and technologies have been considered as the source of unpredictable physical device variation in large scales for generating security primitives. The purpose of this project is to develop emerging solid-state memory-based security primitives and examine their robustness as well as feasibility. Firstly, the author gives an extensive overview of PUFs. The rationality, classification, and application of PUF are discussed. To objectively compare the quality of PUFs, the author formulates important PUF properties and evaluation metrics. By reviewing previously proposed constructions ranging from conventional standard complementary metal-oxide-semiconductor (CMOS) components to emerging non-volatile memories, the quality of different PUFs classes are discussed and summarized. Through a comparative analysis, emerging non-volatile redox-based resistor memories (ReRAMs) have shown the potential as promising candidates for the next generation of low-cost, low-power, compact in size, and secure PUF. Next, the author presents novel approaches to build a PUF by utilizing concatenated two layers of ReRAM crossbar arrays. Upon concatenate two layers, the nonlinear structure is introduced, and this results in the improved uniformity and the avalanche characteristic of the proposed PUF. A group of cell readout method is employed, and it supports a massive pool of challenge-response pairs of the nonlinear ReRAM-based PUF. The non-linear PUF construction is experimentally assessed using the evaluation metrics, and the quality of randomness is verified using predictive analysis. Last but not least, random telegraph noise (RTN) is studied as a source of entropy for a true random number generation (TRNG). RTN is usually considered a disadvantageous feature in the conventional CMOS designs. However, in combination with appropriate readout scheme, RTN in ReRAM can be used as a novel technique to generate quality random numbers. The proposed differential readout-based design can maintain the quality of output by reducing the effect of the undesired noise from the whole system, while the controlling difficulty of the conventional readout method can be significantly reduced. This is advantageous as the differential readout circuit can embrace the resistance variation features of ReRAMs without extensive pre-calibration. The study in this thesis has the potential to enable the development of cost-efficient and lightweight security primitives that can be integrated into modern computer mobile systems and devices for providing a high level of security

    Design of Logic-Compatible Embedded Flash Memories for Moderate Density On-Chip Non-Volatile Memory Applications

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    University of Minnesota Ph.D. dissertation. December 2013. Major: Electrical Engineering. Advisor: Chris H. Kim. 1 computer file (PDF); xx, 129 pages.An on-chip embedded NVM (eNVM) enables a zero-standby power system-on-a-chip with a smaller form factor, faster access speed, lower access power, and higher security than an off-chip NVM. Differently from the high density eNVM technologies such as dual-poly eflash, FeRAM, STT-MRAM, and RRAM that typically require process overhead beyond standard logic process, the moderate density eNVM technologies such as e-fuse, anti-fuse, and single-poly embedded flash (eflash) can be fabricated in a standard logic process with no process overhead. Among them, a single-poly eflash is a unique multiple-time programmable moderate density eNVM, while it is expected to play a key role in mitigating variability and reliability issues of the future VLSI technologies; however, the challenges such as a high voltage disturbance, an implementation of logic compatible High Voltage Switch (HVS), and a limited sensing margin are required to be solved for its implementation using a standard I/O device. This thesis focuses on alleviating such challenges of the single-poly eflash memory with three single-poly eflash designs proposed in a generic logic process for moderate density eNVM applications. Firstly, the proposed 5T eflash features a WL-by-WL accessible architecture with no disturbance issue of the unselected WL cells, an overstress-free multi-story HVS expanding the cell sensing margin, and a selective WL refresh scheme for the higher cell endurance. The most favorable eflash cell configuration is also studied when the performance, endurance, retention, and disturbance characteristics are all considered. Secondly, the proposed 6T eflash features the bit-by-bit re-write capability for the higher overall cell endurance, while not disturbing the unselected WL cells. The logic compatible on-chip charge pump to provide the appropriate high voltages for the proposed eflash operations is also discussed. Finally, the proposed 10T eflash features a multi-configurable HVS that does not require the boosted read supplies, and a differential cell architecture with improved retention time. All these proposed eflash memories were implemented in a 65nm standard logic process, and the test chip measurement results confirmed the functionality of the proposed designs with a reasonable retention margin, showing the competitiveness of the proposed eflash memories compared to the other moderate density eNVM candidates

    Swordfish: A Framework for Evaluating Deep Neural Network-based Basecalling using Computation-In-Memory with Non-Ideal Memristors

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    Basecalling, an essential step in many genome analysis studies, relies on large Deep Neural Networks (DNNs) to achieve high accuracy. Unfortunately, these DNNs are computationally slow and inefficient, leading to considerable delays and resource constraints in the sequence analysis process. A Computation-In-Memory (CIM) architecture using memristors can significantly accelerate the performance of DNNs. However, inherent device non-idealities and architectural limitations of such designs can greatly degrade the basecalling accuracy, which is critical for accurate genome analysis. To facilitate the adoption of memristor-based CIM designs for basecalling, it is important to (1) conduct a comprehensive analysis of potential CIM architectures and (2) develop effective strategies for mitigating the possible adverse effects of inherent device non-idealities and architectural limitations. This paper proposes Swordfish, a novel hardware/software co-design framework that can effectively address the two aforementioned issues. Swordfish incorporates seven circuit and device restrictions or non-idealities from characterized real memristor-based chips. Swordfish leverages various hardware/software co-design solutions to mitigate the basecalling accuracy loss due to such non-idealities. To demonstrate the effectiveness of Swordfish, we take Bonito, the state-of-the-art (i.e., accurate and fast), open-source basecaller as a case study. Our experimental results using Sword-fish show that a CIM architecture can realistically accelerate Bonito for a wide range of real datasets by an average of 25.7x, with an accuracy loss of 6.01%.Comment: To appear in 56th IEEE/ACM International Symposium on Microarchitecture (MICRO), 202
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