Dependability Assessment of NAND Flash-memory for Mission-critical Applications

It is a matter of fact that NAND flash memory devices are well established in consumer market. However, it is not true that the same architectures adopted in the consumer market are suitable for mission critical applications like space. In fact, USB flash drives, digital cameras, MP3 players are usually adopted to store "less significant" data which are not changing frequently (e.g., MP3s, pictures, etc.). Therefore, in spite of NAND flash's drawbacks, a modest complexity is usually needed in the logic of commercial flash drives. On the other hand, mission critical applications have different reliability requirements from commercial scenarios. Moreover, they are usually playing in a hostile environment (e.g., the space) which contributes to worsen all the issues. We aim at providing practical valuable guidelines, comparisons and tradeoffs among the huge number of dimensions of fault tolerant methodologies for NAND flash applied to critical environments. We hope that such guidelines will be useful for our ongoing research and for all the interested reader

Dependability Assessment of NAND Flash-memory for Mission-critical Applications

It is a matter of fact that NAND flash memory devices are well established in consumer market. However, it is not true that the same architectures adopted in the consumer market are suitable for mission critical applications like space. In fact, USB flash drives, digital cameras, MP3 players are usually adopted to store "less significant" data which are not changing frequently (e.g., MP3s, pictures, etc.). Therefore, in spite of NAND flash’s drawbacks, a modest complexity is usually needed in the logic of commercial flash drives. On the other hand, mission critical applications have different reliability requirements from commercial scenarios. Moreover, they are usually playing in a hostile environment (e.g., the space) which contributes to worsen all the issues. We aim at providing practical valuable guidelines, comparisons and tradeoffs among the huge number of dimensions of fault tolerant methodologies for NAND flash applied to critical environments. We hope that such guidelines will be useful for our ongoing research and for all the interested readers

Investigating ferroelectric and metal-insulator phase transition devices for neuromorphic computing

Neuromorphic computing has been proposed to accelerate the computation for deep neural networks (DNNs). The objective of this thesis work is to investigate the ferroelectric and metal-insulator phase transition devices for neuromorphic computing. This thesis proposed and experimentally demonstrated the drain erase scheme in FeFET to enable the individual cell program/erase/inhibition for in-situ training in 3D NAND-like FeFET array. To achieve multi-level states for analog in-memory computing, the ferroelectric thin film needs to be partially switched. This thesis identified a new challenge of ferroelectric partial switching, namely “history effect” in minor loop dynamics. The experimental characterization of both FeCap and FeFET validated the history effect, suggesting that the intermediate states programming condition depends on the prior states that the device has gone through. A phase-field model was constructed to understand the origin. Such history effect was then modelled into the FeFET based neural network simulation and analyze its negative impact on the training accuracy and then propose a possible mitigation strategy. Apart from using FeFET as synaptic devices, using metal-insulator phase transition device, as neuron was also explored experimentally. A NbOx metal-insulator phase transition threshold switch was integrated at the edge of the crossbar array as an oscillation neuron. One promising application for FeFET+NbOx neuromorphic system is to implement quantum error correction (QEC) circuitry at 4K. Cryo-NeuroSim, a device-to-system modeling framework that calibrates data at cryogenic temperature was developed to benchmark the performance of the FeFET+NbOx neuromorphic system.Ph.D

ELECTRICAL CHARACTERIZATION, PHYSICS, MODELING AND RELIABILITY OF INNOVATIVE NON-VOLATILE MEMORIES

Enclosed in this thesis work it can be found the results of a three years long research activity performed during the XXIV-th cycle of the Ph.D. school in Engineering Science of the Università degli Studi di Ferrara. The topic of this work is concerned about the electrical characterization, physics, modeling and reliability of innovative non-volatile memories, addressing most of the proposed alternative to the floating-gate based memories which currently are facing a technology dead end. Throughout the chapters of this thesis it will be provided a detailed characterization of the envisioned replacements for the common NOR and NAND Flash technologies into the near future embedded and MPSoCs (Multi Processing System on Chip) systems. In Chapter 1 it will be introduced the non-volatile memory technology with direct reference on nowadays Flash mainstream, providing indications and comments on why the system designers should be forced to change the approach to new memory concepts. In Chapter 2 it will be presented one of the most studied post-floating gate memory technology for MPSoCs: the Phase Change Memory. The results of an extensive electrical characterization performed on these devices led to important discoveries such as the kinematics of the erase operation and potential reliability threats in memory operations. A modeling framework has been developed to support the experimental results and to validate them on projected scaled technology. In Chapter 3 an embedded memory for automotive environment will be shown: the SimpleEE p-channel memory. The characterization of this memory proven the technology robustness providing at the same time new insights on the erratic bits phenomenon largely studied on NOR and NAND counterparts. Chapter 4 will show the research studies performed on a memory device based on the Nano-MEMS concept. This particular memory generation proves to be integrated in very harsh environment such as military applications, geothermal and space avionics. A detailed study on the physical principles underlying this memory will be presented. In Chapter 5 a successor of the standard NAND Flash will be analyzed: the Charge Trapping NAND. This kind of memory shares the same principles of the traditional floating gate technology except for the storage medium which now has been substituted by a discrete nature storage (i.e. silicon nitride traps). The conclusions and the results summary for each memory technology will be provided in Chapter 6. Finally, on Appendix A it will be shown the results of a recently started research activity on the high level reliability memory management exploiting the results of the studies for Phase Change Memories

DESTINY: A Comprehensive Tool with 3D and Multi-Level Cell Memory Modeling Capability

To enable the design of large capacity memory structures, novel memory technologies such as non-volatile memory (NVM) and novel fabrication approaches, e.g., 3D stacking and multi-level cell (MLC) design have been explored. The existing modeling tools, however, cover only a few memory technologies, technology nodes and fabrication approaches. We present DESTINY, a tool for modeling 2D/3D memories designed using SRAM, resistive RAM (ReRAM), spin transfer torque RAM (STT-RAM), phase change RAM (PCM) and embedded DRAM (eDRAM) and 2D memories designed using spin orbit torque RAM (SOT-RAM), domain wall memory (DWM) and Flash memory. In addition to single-level cell (SLC) designs for all of these memories, DESTINY also supports modeling MLC designs for NVMs. We have extensively validated DESTINY against commercial and research prototypes of these memories. DESTINY is very useful for performing design-space exploration across several dimensions, such as optimizing for a target (e.g., latency, area or energy-delay product) for a given memory technology, choosing the suitable memory technology or fabrication method (i.e., 2D v/s 3D) for a given optimization target, etc. We believe that DESTINY will boost studies of next-generation memory architectures used in systems ranging from mobile devices to extreme-scale supercomputers. The latest source-code of DESTINY is available from the following git repository: https://bitbucket.org/sparsh_mittal/destiny_v2

Design of Logic-Compatible Embedded Flash Memories for Moderate Density On-Chip Non-Volatile Memory Applications

University of Minnesota Ph.D. dissertation. December 2013. Major: Electrical Engineering. Advisor: Chris H. Kim. 1 computer file (PDF); xx, 129 pages.An on-chip embedded NVM (eNVM) enables a zero-standby power system-on-a-chip with a smaller form factor, faster access speed, lower access power, and higher security than an off-chip NVM. Differently from the high density eNVM technologies such as dual-poly eflash, FeRAM, STT-MRAM, and RRAM that typically require process overhead beyond standard logic process, the moderate density eNVM technologies such as e-fuse, anti-fuse, and single-poly embedded flash (eflash) can be fabricated in a standard logic process with no process overhead. Among them, a single-poly eflash is a unique multiple-time programmable moderate density eNVM, while it is expected to play a key role in mitigating variability and reliability issues of the future VLSI technologies; however, the challenges such as a high voltage disturbance, an implementation of logic compatible High Voltage Switch (HVS), and a limited sensing margin are required to be solved for its implementation using a standard I/O device. This thesis focuses on alleviating such challenges of the single-poly eflash memory with three single-poly eflash designs proposed in a generic logic process for moderate density eNVM applications. Firstly, the proposed 5T eflash features a WL-by-WL accessible architecture with no disturbance issue of the unselected WL cells, an overstress-free multi-story HVS expanding the cell sensing margin, and a selective WL refresh scheme for the higher cell endurance. The most favorable eflash cell configuration is also studied when the performance, endurance, retention, and disturbance characteristics are all considered. Secondly, the proposed 6T eflash features the bit-by-bit re-write capability for the higher overall cell endurance, while not disturbing the unselected WL cells. The logic compatible on-chip charge pump to provide the appropriate high voltages for the proposed eflash operations is also discussed. Finally, the proposed 10T eflash features a multi-configurable HVS that does not require the boosted read supplies, and a differential cell architecture with improved retention time. All these proposed eflash memories were implemented in a 65nm standard logic process, and the test chip measurement results confirmed the functionality of the proposed designs with a reasonable retention margin, showing the competitiveness of the proposed eflash memories compared to the other moderate density eNVM candidates