ATLASPIX3 Modules for Experiments at Electron-Positron Colliders

High-voltage CMOS detectors are being developed for application in High-Energy Physics. ATLASPIX3 is a full-reticle size monolithic pixel detector, consisting of 49000 pixels of dimension 50×150 μm$^2$. It has been realized in in TSI 180 nm HVCMOS technology. In view of applications at future electron-positron colliders, multi-chip-modules are built. The module design and its characterization by electrical test and radiation sources will be illustrated, including characterization of shunt regulators for serial chain powering. Lightweight long structure to support and to cool multiple-module chain are also being realized. The multi-chip-modules performance shows no degradation with respect to single-chip devices and the level of integration achieved is suitable for tracking at future e+e- accelerators

Miniaturizing microvias for multi-chip modules

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008.Includes bibliographical references (p. 63-64).Electronics packaging is continually migrating toward denser packaging. This encompasses a push toward multilevel die, denser metallization, and smaller microvias. In this thesis we investigate the miniaturization of laser-drilled microvias in polyimide dielectric for chips-first multi-chip module (MCM) technology. The challenge is to produce increasingly smaller microvias and package more microvias into a given area without sacrificing electrical performance. Principally, this means a microvia must maintain certain minimum electrical resistance and mechanical adhesion to the conducting layers. The thesis encompasses the following research: 1. Investigating the state of the art in laser-drilled polyimide microvias. 2. Designing and fabricating test structures with microvias, in which the state of the art is pushed in microvia size and/or aspect ratio. 3. Measuring the contact resistances of laser-drilled microvias in a Kelvin structure configuration. 4. Developing finite element models of Kelvin structures to estimate the contact resistance of miniature microvias.The experimental results of this thesis prove that microvias with approximately 19 pm diameter and 10 mQ contact resistance can be reliably fabricated for chips-first MCM technology.by Paul Gerard Puskarich.M.Eng

System, Circuit, And Method For Testing An Interconnect In A Multi-chip Substrate

A system for testing interconnects in multi-chip modules including a radio frequency resonator having a resonant circuit with a relatively high quality factor, the output of the resonant circuit being attached to a probe. Electrically coupled to the resonant circuit output is an apparatus to analyze the voltage signal output. The probe is applied to one end of an interconnect. When the probe is applied, the resonant frequency of the resonant circuit and the magnitude of the frequency response are altered due to the additional loading created by the interconnect. Due to the relatively high quality factor of the resonant circuit, the magnitude of the frequency response of the altered resonant circuit is measurably distinct from a predetermined reference magnitude at a predetermined reference frequency, thus indicating the existence of a defect. Additionally, the type of defect that exists is ascertainable by determining whether the resonant frequency of the altered resonant circuit is greater or less than the reference frequency by examining, for example, the phase response.Georgia Tech Research Corporatio

MRSI-605 AP die bonder

AbstractNewport Corporation has introduced the MRSI-605 AP Advanced Packaging Die Bonder, providing advanced assembly solutions for epoxy die attach, eutectic, and flip chip bonding. The system is designed for end users in the semiconductor and electronic packaging markets, including manufacturers of MEMS, advanced semiconductor packages, multi-chip modules, military and defence hybrids, microwave and RF circuits, and photonics packages.This is a short news story only. Visit www.three-fives.com for the latest advanced semiconductor industry news

The integration of optical interconnections on ceramic substrates

High heat conductivity and high heat capacity make ceramic substrates indispensable to the manufacture of Multi-Chip Modules (MCM) and power electronics. In this paper a detailed description of the integration process of optical lines on to ceramic substrates is presented. The manufacturing of microgrooves in ceramic substrates and the process of integration of optical fibres and active elements is described. Coupling active elements to optical fibre is also presented. Through such an integrated optical line a 4 Gbps signal was transmitted. © 2016 Elsevier B.V. All rights reserved

Simulation of Crosstalk in High-Speed Multi-Chip Modules

Simulation results of the electrical performance at 1 GBits/sec of a number of different off-chip interconnection architectures are presented with emphasis given to the dependence of crosstalk and signal delay on the geometries and dielectric constants of the insulating layers as well as on the widths and separations of the conductors. The results indicate that signal delay and crosstalk may be reduced by using low εr values for the dielectrics and that crosstalk may be also reduced by reducing the conductor-to-ground wire separation which simultaneously neutralises the role of εr value on crosstalk and line impedance

Achievements of the ATLAS Upgrade Planar Pixel Sensors R&D Project

To extend the physics reach of the LHC, accelerator upgrades are planned which will increase the integrated luminosity to beyond 3000 fb^-1 and the pile-up per bunch-crossing by a factor 5 to 10. To cope with the increased occupancy and radiation damage, the ATLAS experiment plans to introduce an all-silicon inner tracker with the HL-LHC upgrade. To investigate the suitability of pixel sensors using the proven planar technology for the upgraded tracker, the ATLAS Upgrade Planar Pixel Sensor R&D Project (PPS) was established comprising 19 institutes and more than 80 scientists. Main areas of research are the performance assessment of planar pixel sensors with different designs and substrate thicknesses up to the HL-LHC fluence, the achievement of slim or active edges to provide low geometric inefficiencies without the need for shingling of modules and the exploration of possibilities for cost reduction to enable the instrumentation of large areas. This paper gives an overview of recent accomplishments and ongoing work of the R&D project

Measurement of the Coefficient of Thermal Expansion of Superconducting Thin Films Using Powder X-Ray Diffraction

The High Density Electronics Center (HiDEC) at the University of Arkansas, Fayetteville is developing the technology for High Temperature Superconductor Multi-Chip Modules (HTSC-MCM\u27s). As part of this work, we are looking at the mechanical properties of HTSC materials. An important mechanical property which influences the mechanical integrity of the hybrid MCMis the coefficient of thermal expansion (CTE) of the HTSC films. As a first step in developing a procedure for the determination of the CTE of HTSC materials, the lattice parameters and the CTE of an alpha-alumina substrate have been determined by powder x-ray diffraction technique. An extension of this technique applicable to HTSC materials is presented