Electromagnetic Wave Theory and Applications

Contains table of contents for Section 3, reports on six research projects and a list of publications and conference papers.Joint Services Electronics Program Contract DAAL03-89-C-0001National Science Foundation Grant ECS 86-20029Schlumberger- Doll ResearchU.S. Army Research Office Contract DAAL03 88-K-0057U.S. Navy - Office of Naval Research Contract N00014-90-J-1002National Aeronautics and Space Administration Grant NAGW-1617U.S. Navy - Office of Naval Research Grant N00014-89-J-1107National Aeronautics and Space Administration Grant NAGW-1272National Aeronautics and Space Administration Agreement 958461U.S. Army - Corps of Engineers Contract DACA39-87-K-0022U.S. Air Force - Electronic Systems Division Contract F19628-88-K-0013U.S. Navy - Office of Naval Research Grant N00014-89-J-1019Digital Equipment CorporationIBM CorporationU.S. Department of Transportation Contract DTRS-57-88-C-00078Defence Advanced Research Projects Agency Contract MDA972-90-C-002

Analysis and Application of Transmission Line Conductors

Skin effect is usually a concern reserved for radio frequency design and for high current conductors used in utility power distribution. Proximity effect between adjacent conductors has traditionally been a concern for the design of magnetic windings and other applications involving wire bundles. The rise in the ubiquity of high speed bit streams and other signals of very wide bandwidth has broadened the range of applicable contexts and increased the need to account for such effects. This is especially true for transmission lines used to interconnect critical signal paths in applications ranging from microelectronic devices to the signal integrity of printed circuit traces and implementation of system cabling. Optimal conductor design is obviously fundamental to transmission line performance. Researchers have paid considerable attention to the topic but the results are scattered throughout the literature. This thesis collected information on extant conductor designs, and the theoretical considerations behind each solution. A detailed analysis of current fl‡ow in a conducting half-space was included as a foundation. The conductor types discussed were solid cylindrical, rectangular, ribbonoid, bimetallic, tubular, laminated, litz, and stranded constructions. Discussions of the performance of stranded shields and conductor roughness e¤ects were included for completeness of understanding

Electromagnetic Wave Theory and Applications

Contains table of contents for Section 3 and reports on seven research projects.Joint Services Electronics Program Contract DAAL03-89-C-0001National Science Foundation Contract ECS 86-20029Schlumberger- Doll ResearchU.S. Army Research Office Contract DAAL03 88-K-0057National Aeronautics and Space Administration Contract NAGW-1617U.S. Navy - Office of Naval Research Contract N00014-89-J-1107National Aeronautics and Space Administration Contract NAGW-1272National Aeronautics and Space Administration Contract 958461Simulation Technologies Contract DAAH01-87-C-0679U.S. Army Corp of Engineers Contract DACA39-87-K-0022WaveTracer, Inc.U.S. Navy - Office of Naval Research Contract N00014-89-J-1019U.S. Air Force Systems - Electronic Systems Division Contract F19628-88-K-0013Digital Equipment CorporationInternational Business Machines CorporationU.S. Department of Transportation Contract DTRS-57-88-C-0007

Multi-chip module interconnections at microwave frequencies: electromagnetic simulation and material characterisation

In this work both the interconnections and materials used in multi-chip modules (MCMs) at microwave frequencies have been investigated. The electrical behaviour of the interconnections was studied using commercially available 2.SD and 3D electromagnetic simulators (HFSSTM, MDSTM and Momentum™). State-of-the-art conductive and dielectric film materials used in the fabrication of multi-layer MCM structures were characterized using microstrip/wave guide resonator techniques. The models chosen for simulation of interconnections are commensurate with those in current use in MCM technology. Crosstalk between microstrip conductors in multi-layer MCM structures was simulated and new knowledge leading to new design rules was obtained.Typical elements in MCM interconnect structures, such as vias, bends and airbridges were also investigated. The principal features of these elements were simulated and the results were obtained in S-parameter form. Based on the simulated results, these parasitic elements were modelled in terms of their equivalent circuits which can be used in circuit simulators to aid more rigorous MCM circuit design. A microstrip ring resonator, fabricated using the newly developed conductive material from Heraeus, was employed to measure the line loss. New techniques have been developed to measure the permittivity and loss tangent of thin dielectric films. In the previous methods for the measurement of these films, the accuracy in measuring the relative permittivity is limited and there is no available technique to measure the loss tangent. A novel cavity perturbation method was developed to accurately measure both the relative permittivity and loss tangent of the films deposited on a supporting substrate. An additional independent technique, derived from transmission line theory, for measuring the relative permittivity of dielectric film was also established. A particular feature of the new teclmiques, which led to high accuracy in measuring dielectric constant and loss tangent was the positioning of the dielectric film in the region of maximum electric field strength, thereby ensuring maximum interaction between the electric field and the film material. A rigorous error analysis was performed on the new techniques, which led to the establishment of practical measurement correction factors. A simple and rigorous method has also been developed to accurately measure the loss tangent of dielectrics with known dielectric constant using a resonant cavity. The novel method eliminates the need for any physical measurement of the dielectric sample. The new technique should permit the development of techniques for very high frequency characterisation of dielectric materials

Skin-Effect Loss Models for Time- and Frequency-Domain PEEC Solver

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Application of Maxwell-Wagner polarisation in monolithic technologies

Imperial Users onl

Advanced Electromagnetic Numerical Modeling Techniques for Various Periodic and Quasi-Periodic Systems

This dissertation is mainly concerned with several advanced electromagnetic modeling techniques for practical complex systems, which involve periodic analyses. The focus is to reveal the physics of the electromagnetic wave interaction with the complex structures, and also to arrive at improved computational algorithms. This dissertation consists of three self-contained parts, each discussing one modeling technique. Examples presented in this dissertation include (a) an analysis of conductor surface-roughness effects, (b) a novel model for vertical interconnects (vias) and (c) a leaky-wave study of a Fabry-Perot resonant cavity antenna. The first part investigates conductor surface roughness effects for stripline. An equivalent rough-surface-impedance is extracted using a periodic full-wave analysis and is then used for the modification of the transmission line per-unit-length parameter. The second part proposes a semi-analytical analysis for massively-coupled vias with arbitrarily-shaped antipads, based on the reciprocity theorem. The use of reciprocity yields simple design formulas and is seen to greatly improve the computational efficiency, due to the fast-converging mode-matching calculation. The third part presents a leaky-wave study of a Fabry-Perot cavity antenna made from a patch array. The patch current densities are calculated using the array scanning method. Based on this, a "leaky-wave current" is defined and calculated using residue integration. In addition, the radiation properties of a large finite-size array (truncation effects) are evaluated. All three proposed models are verified by full-wave simulations and/or measurements. Numerical results prove the effectiveness and accuracy of these models.Electrical and Computer Engineering, Department o

Worst-Case Analysis of Electrical and Electronic Equipment via Affine Arithmetic

In the design and fabrication process of electronic equipment, there are many unkown parameters which significantly affect the product performance. Some uncertainties are due to manufacturing process fluctuations, while others due to the environment such as operating temperature, voltage, and various ambient aging stressors. It is desirable to consider these uncertainties to ensure product performance, improve yield, and reduce design cost. Since direct electromagnetic compatibility measurements impact on both cost and time-to-market, there has been a growing demand for the availability of tools enabling the simulation of electrical and electronic equipment with the inclusion of the effects of system uncertainties. In this framework, the assessment of device response is no longer regarded as deterministic but as a random process. It is traditionally analyzed using the Monte Carlo or other sampling-based methods. The drawback of the above methods is large number of required samples to converge, which are time-consuming for practical applications. As an alternative, the inherent worst-case approaches such as interval analysis directly provide an estimation of the true bounds of the responses. However, such approaches might provide unnecessarily strict margins, which are very unlikely to occur. A recent technique, affine arithmetic, advances the interval based methods by means of handling correlated intervals. However, it still leads to over-conservatism due to the inability of considering probability information. The objective of this thesis is to improve the accuracy of the affine arithmetic and broaden its application in frequency-domain analysis. We first extend the existing literature results to the efficient time-domain analysis of lumped circuits considering the uncertainties. Then we provide an extension of the basic affine arithmetic to the frequency-domain simulation of circuits. Classical tools for circuit analysis are used within a modified affine framework accounting for complex algebra and uncertainty interval partitioning for the accurate and efficient computation of the worst case bounds of the responses of both lumped and distributed circuits. The performance of the proposed approach is investigated through extensive simulations in several case studies. The simulation results are compared with the Monte Carlo method in terms of both simulation time and accuracy

Electromagnetic Wave Theory and Applications

Contains table of contents for Section 3, research summary and reports on six research projects.Joint Services Electronics Program (Contract DAAL 03-86-K-0002)Joint Services Electronics Program (Contract DAAL 03-89-C-0001)U.S. Navy - Office of Naval Research (Contract N00014-86-K-0533)National Science Foundation (Contract ECS 86-20029)U.S. Army Research Office (Contract DAAL03 88-K-0057)International Business Machine CorporationSchlumberger-Doll ResearchNational Aeronautics and Space Administration (Contract NAG 5-270)U.S. Navy - Office of Naval Research (Contract N00014-83-K-0258)National Aeronautics and Space Administration (Contract NAG 5-769)U.S. Army Corps of Engineers - Waterways Experimental Station (Contract DACA39-87-K-0022)Simulation TechnologiesU.S. Air Force - Rome Air Development Center (Contract F19628-88-K-0013)U.S. Navy - Office of Naval Research (Contract N00014-89-J-1107)Digital Equipment Corporatio