Statistical Power Supply Dynamic Noise Prediction in Hierarchical Power Grid and Package Networks

One of the most crucial high performance systems-on-chip design challenge is to front their power supply noise sufferance due to high frequencies, huge number of functional blocks and technology scaling down. Marking a difference from traditional post physical-design static voltage drop analysis, /a priori dynamic voltage drop/evaluation is the focus of this work. It takes into account transient currents and on-chip and package /RLC/ parasitics while exploring the power grid design solution space: Design countermeasures can be thus early defined and long post physical-design verification cycles can be shortened. As shown by an extensive set of results, a carefully extracted and modular grid library assures realistic evaluation of parasitics impact on noise and facilitates the power network construction; furthermore statistical analysis guarantees a correct current envelope evaluation and Spice simulations endorse reliable result

Modeling of thermally induced skew variations in clock distribution network

Clock distribution network is sensitive to large thermal gradients on the die as the performance of both clock buffers and interconnects are affected by temperature. A robust clock network design relies on the accurate analysis of clock skew subject to temperature variations. In this work, we address the problem of thermally induced clock skew modeling in nanometer CMOS technologies. The complex thermal behavior of both buffers and interconnects are taken into account. In addition, our characterization of the temperature effect on buffers and interconnects provides valuable insight to designers about the potential impact of thermal variations on clock networks. The use of industrial standard data format in the interface allows our tool to be easily integrated into existing design flow

Mixed-signal CNN array chips for image processing

Due to their local connectivity and wide functional capabilities, cellular nonlinear networks (CNN) are excellent candidates for the implementation of image processing algorithms using VLSI analog parallel arrays. However, the design of general purpose, programmable CNN chips with dimensions required for practical applications raises many challenging problems to analog designers. This is basically due to the fact that large silicon area means large development cost, large spatial deviations of design parameters and low production yield. CNN designers must face different issues to keep reasonable enough accuracy level and production yield together with reasonably low development cost in their design of large CNN chips. This paper outlines some of these major issues and their solutions

An Electromigration and Thermal Model of Power Wires for a Priori High-Level Reliability Prediction

In this paper, a simple power-distribution electrothermal model including the interconnect self-heating is used together with a statistical model of average and rms currents of functional blocks and a high-level model of fanout distribution and interconnect wirelength. Following the 2001 SIA roadmap projections, we are able to predict a priori that the minimum width that satisfies the electromigration constraints does not scale like the minimum metal pitch in future technology nodes. As a consequence, the percentage of chip area covered by power lines is expected to increase at the expense of wiring resources unless proper countermeasures are taken. Some possible solutions are proposed in the paper

Limits on Fundamental Limits to Computation

An indispensable part of our lives, computing has also become essential to industries and governments. Steady improvements in computer hardware have been supported by periodic doubling of transistor densities in integrated circuits over the last fifty years. Such Moore scaling now requires increasingly heroic efforts, stimulating research in alternative hardware and stirring controversy. To help evaluate emerging technologies and enrich our understanding of integrated-circuit scaling, we review fundamental limits to computation: in manufacturing, energy, physical space, design and verification effort, and algorithms. To outline what is achievable in principle and in practice, we recall how some limits were circumvented, compare loose and tight limits. We also point out that engineering difficulties encountered by emerging technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl

SIRENA: A CAD environment for behavioural modelling and simulation of VLSI cellular neural network chips

This paper presents SIRENA, a CAD environment for the simulation and modelling of mixed-signal VLSI parallel processing chips based on cellular neural networks. SIRENA includes capabilities for: (a) the description of nominal and non-ideal operation of CNN analogue circuitry at the behavioural level; (b) performing realistic simulations of the transient evolution of physical CNNs including deviations due to second-order effects of the hardware; and, (c) evaluating sensitivity figures, and realize noise and Monte Carlo simulations in the time domain. These capabilities portray SIRENA as better suited for CNN chip development than algorithmic simulation packages (such as OpenSimulator, Sesame) or conventional neural networks simulators (RCS, GENESIS, SFINX), which are not oriented to the evaluation of hardware non-idealities. As compared to conventional electrical simulators (such as HSPICE or ELDO-FAS), SIRENA provides easier modelling of the hardware parasitics, a significant reduction in computation time, and similar accuracy levels. Consequently, iteration during the design procedure becomes possible, supporting decision making regarding design strategies and dimensioning. SIRENA has been developed using object-oriented programming techniques in C, and currently runs under the UNIX operating system and X-Windows framework. It employs a dedicated high-level hardware description language: DECEL, fitted to the description of non-idealities arising in CNN hardware. This language has been developed aiming generality, in the sense of making no restrictions on the network models that can be implemented. SIRENA is highly modular and composed of independent tools. This simplifies future expansions and improvements.Comisión Interministerial de Ciencia y Tecnología TIC96-1392-C02-0

PowerPack: Energy Profiling and Analysis of High-Performance Systems and Applications

Energy efficiency is a major concern in modern high-performance computing system design. In the past few years, there has been mounting evidence that power usage limits system scale and computing density, and thus, ultimately system performance. However, despite the impact of power and energy on the computer systems community, few studies provide insight to where and how power is consumed on high-performance systems and applications. In previous work, we designed a framework called PowerPack that was the first tool to isolate the power consumption of devices including disks, memory, NICs, and processors in a high-performance cluster and correlate these measurements to application functions. In this work, we extend our framework to support systems with multicore, multiprocessor-based nodes, and then provide in-depth analyses of the energy consumption of parallel applications on clusters of these systems. These analyses include the impacts of chip multiprocessing on power and energy efficiency, and its interaction with application executions. In addition, we use PowerPack to study the power dynamics and energy efficiencies of dynamic voltage and frequency scaling (DVFS) techniques on clusters. Our experiments reveal conclusively how intelligent DVFS scheduling can enhance system energy efficiency while maintaining performance