Practical Techniques for Improving Performance and Evaluating Security on Circuit Designs

As the modern semiconductor technology approaches to nanometer era, integrated circuits (ICs) are facing more and more challenges in meeting performance demand and security. With the expansion of markets in mobile and consumer electronics, the increasing demands require much faster delivery of reliable and secure IC products. In order to improve the performance and evaluate the security of emerging circuits, we present three practical techniques on approximate computing, split manufacturing and analog layout automation. Approximate computing is a promising approach for low-power IC design. Although a few accuracy-configurable adder (ACA) designs have been developed in the past, these designs tend to incur large area overheads as they rely on either redundant computing or complicated carry prediction. We investigate a simple ACA design that contains no redundancy or error detection/correction circuitry and uses very simple carry prediction. The simulation results show that our design dominates the latest previous work on accuracy-delay-power tradeoff while using 39% less area. One variant of this design provides finer-grained and larger tunability than that of the previous works. Moreover, we propose a delay-adaptive self-configuration technique to further improve the accuracy-delay-power tradeoff. Split manufacturing prevents attacks from an untrusted foundry. The untrusted foundry has front-end-of-line (FEOL) layout and the original circuit netlist and attempts to identify critical components on the layout for Trojan insertion. Although defense methods for this scenario have been developed, the corresponding attack technique is not well explored. Hence, the defense methods are mostly evaluated with the k-security metric without actual attacks. We develop a new attack technique based on structural pattern matching. Experimental comparison with existing attack shows that the new attack technique achieves about the same success rate with much faster speed for cases without the k-security defense, and has a much better success rate at the same runtime for cases with the k-security defense. The results offer an alternative and practical interpretation for k-security in split manufacturing. Analog layout automation is still far behind its digital counterpart. We develop the layout automation framework for analog/mixed-signal ICs. A hierarchical layout synthesis flow which works in bottom-up manner is presented. To ensure the qualified layouts for better circuit performance, we use the constraint-driven placement and routing methodology which employs the expert knowledge via design constraints. The constraint-driven placement uses simulated annealing process to find the optimal solution. The packing represented by sequence pairs and constraint graphs can simultaneously handle different kinds of placement constraints. The constraint-driven routing consists of two stages, integer linear programming (ILP) based global routing and sequential detailed routing. The experiment results demonstrate that our flow can handle complicated hierarchical designs with multiple design constraints. Furthermore, the placement performance can be further improved by using mixed-size block placement which works on large blocks in priority

Novel CMOS RFIC Layout Generation with Concurrent Device Placement and Fixed-Length Microstrip Routing

With advancing process technologies and booming IoT markets, millimeter-wave CMOS RFICs have been widely developed in re- cent years. Since the performance of CMOS RFICs is very sensi- tive to the precision of the layout, precise placement of devices and precisely matched microstrip lengths to given values have been a labor-intensive and time-consuming task, and thus become a major bottleneck for time to market. This paper introduces a progressive integer-linear-programming-based method to gener- ate high-quality RFIC layouts satisfying very stringent routing requirements of microstrip lines, including spacing/non-crossing rules, precise length, and bend number minimization, within a given layout area. The resulting RFIC layouts excel in both per- formance and area with much fewer bends compared with the simulation-tuning based manual layout, while the layout gener- ation time is significantly reduced from weeks to half an hour.Comment: ACM/IEEE Design Automation Conference (DAC), 201

Analog layout design automation: ILP-based analog routers

The shrinking design window and high parasitic sensitivity in the advanced technology have imposed special challenges on the analog and radio frequency (RF) integrated circuit design. In this thesis, we propose a new methodology to address such a deficiency based on integer linear programming (ILP) but without compromising the capability of handling any special constraints for the analog routing problems. Distinct from the conventional methods, our algorithm utilizes adaptive resolutions for various routing regions. For a more congested region, a routing grid with higher resolution is employed, whereas a lower-resolution grid is adopted to a less crowded routing region. Moreover, we strengthen its speciality in handling interconnect width control so as to route the electrical nets based on analog constraints while considering proper interconnect width to address the acute interconnect parasitics, mismatch minimization, and electromigration effects simultaneously. In addition, to tackle the performance degradation due to layout dependent effects (LDEs) and take advantage of optical proximity correction (OPC) for resolution enhancement of subwavelength lithography, in this thesis we have also proposed an innovative LDE-aware analog layout migration scheme, which is equipped with our special routing methodology. The LDE constraints are first identified with aid of a special sensitivity analysis and then satisfied during the layout migration process. Afterwards the electrical nets are routed by an extended OPC-inclusive ILP-based analog router to improve the final layout image fidelity while the routability and analog constraints are respected in the meantime. The experimental results demonstrate the effectiveness and efficiency of our proposed methods in terms of both circuit performance and image quality compared to the previous works

A Pre-Search Assisted ILP Approach to Analog Integrated Circuit Routing

The routing of analog integrated circuits (IC) has long been a challenge due to numerous constraints (such as symmetry and topology-matching) that matter for overall circuit performance. Existing automatic analog IC routing algorithms can be broadly categorized into two approaches: sequential approach that heuristically routes one net after another and constructive ILP (Integer Linear Programming). The former approach is usually fast but may miss opportunities of finding good solutions. The constructive ILP provides optimal solutions but can be very time consuming. We propose a simple yet efficient method that combines the advantages of both existing approaches. First, sequential routing is performed to obtain a set of candidate routing paths for each net. Then, an ILP is applied to commit each net to only one of its candidate routes. Experiments on two op-amp designs show that the post-layout performance (such as gain and phase margin) from our method is close to that of manual design. Our method also outperforms a previous work of automated analog IC routing

Automated Placement Of A Transistor Pair For Analogue

The performances of analogue circuits are affected by surrounding parameters such as levels of noise, thermal gradients of a circuit, and parasitic effects from both resistive and capacitive part. As there are no effective approaches to handle these analogue constraints as mentioned above, the focuses to develop IC design tools are bended towards digital circuits. The purpose of this research is to introduce a complete methodology for transistor pair placement for analogue layout using a concept of cells and arrays based on migration and reuse. The entire process consists of Standard Cell Generation to produce standard cell for analogue circuits, Matching Generator with array alignment to generate transistor matching of common-centroid arrangement, and Auto Routing for global routing. The methodology is translated into automation by a graphical user interface to render a fully functional layout designs in a few steps and fraction of time. This research describes such a system in obtaining a layout that can be configured like a set of building blocks that meets all design specifications. In comparison to all the different approaches that have been discussed and analysed prior to this research, a new design flow for analogue layout combined with automation is constructed by considering transistor matching as a constraint

Practical Techniques for Improving Performance and Evaluating Security on Circuit Designs

As the modern semiconductor technology approaches to nanometer era, integrated circuits (ICs) are facing more and more challenges in meeting performance demand and security. With the expansion of markets in mobile and consumer electronics, the increasing demands require much faster delivery of reliable and secure IC products. In order to improve the performance and evaluate the security of emerging circuits, we present three practical techniques on approximate computing, split manufacturing and analog layout automation. Approximate computing is a promising approach for low-power IC design. Although a few accuracy-configurable adder (ACA) designs have been developed in the past, these designs tend to incur large area overheads as they rely on either redundant computing or complicated carry prediction. We investigate a simple ACA design that contains no redundancy or error detection/correction circuitry and uses very simple carry prediction. The simulation results show that our design dominates the latest previous work on accuracy-delay-power tradeoff while using 39% less area. One variant of this design provides finer-grained and larger tunability than that of the previous works. Moreover, we propose a delay-adaptive self-configuration technique to further improve the accuracy-delay-power tradeoff. Split manufacturing prevents attacks from an untrusted foundry. The untrusted foundry has front-end-of-line (FEOL) layout and the original circuit netlist and attempts to identify critical components on the layout for Trojan insertion. Although defense methods for this scenario have been developed, the corresponding attack technique is not well explored. Hence, the defense methods are mostly evaluated with the k-security metric without actual attacks. We develop a new attack technique based on structural pattern matching. Experimental comparison with existing attack shows that the new attack technique achieves about the same success rate with much faster speed for cases without the k-security defense, and has a much better success rate at the same runtime for cases with the k-security defense. The results offer an alternative and practical interpretation for k-security in split manufacturing. Analog layout automation is still far behind its digital counterpart. We develop the layout automation framework for analog/mixed-signal ICs. A hierarchical layout synthesis flow which works in bottom-up manner is presented. To ensure the qualified layouts for better circuit performance, we use the constraint-driven placement and routing methodology which employs the expert knowledge via design constraints. The constraint-driven placement uses simulated annealing process to find the optimal solution. The packing represented by sequence pairs and constraint graphs can simultaneously handle different kinds of placement constraints. The constraint-driven routing consists of two stages, integer linear programming (ILP) based global routing and sequential detailed routing. The experiment results demonstrate that our flow can handle complicated hierarchical designs with multiple design constraints. Furthermore, the placement performance can be further improved by using mixed-size block placement which works on large blocks in priority

High-Performance Fpaa Design For Hierarchical Implementation Of Analog And Mixed-Signal Systems

The design complexity of today's IC has increased dramatically due to the high integration allowed by advanced CMOS VLSI process. A key to manage the increased design complexity while meeting the shortening time-to-market is design automation. In digital world, the field-programmable gate arrays (FPGAs) have evolved to play a very important role by providing ASIC-compatible design methodologies that include design-for-testability, design optimization and rapid prototyping. On the analog side, the drive towards shorter design cycles has demanded the development of high performance analog circuits that are configurable and suitable for CAD methodologies. Field-programmable analog arrays (FPAAs) are intended to achieve the benefits for analog system design as FPGAs have in the digital field. Despite of the obvious advantages of hierarchical analog design, namely short time-to-market and low non-recurring engineering (NRE) costs, this approach has some apparent disadvantages. The redundant devices and routing resources for programmability requires extra chip area, while switch and interconnect parasitics cause considerable performance degradation. To deliver a high-performance FPAA, effective methodologies must be developed to minimize those adversary effects. In this dissertation, three important aspects in the FPAA design are studied to achieve that goal: the programming technology, the configurable analog block (CAB) design and the routing architecture design. Enabled by the Laser MakelinkTM technology, which provides nearly ideal programmable switches, channel segmentation algorithms are developed to improve channel routability and reduce interconnect parasitics. Segmented routing are studied and performance metrics accounting for interconnect parasitics are proposed for performance-driven analog routing. For large scale arrays, buffer insertions are considered to further reduce interconnection delay and cross-coupling noise. A high-performance, highly flexible CAB is developed to realized both continuous-mode and switched-capacitor circuits. In the end, the implementation of an 8-bit, 50MSPS pipelined A/D converter using the proposed FPAA is presented as an example of the hierarchical analog design approach, with its key performance specifications discussed

Circuit Design and Routing For Field Programmable Analog Arrays

Accurate, low-cost, rapid-prototyping techniques for analog circuits have been a long awaited dream for analog designers. However, due to the inherent nature of analog system, design automation in analog domain is very difficult to realize, and field programmable analog arrays (FPAA) have not achieved the same success as FPGAs in the digital domain. This results from several factors, including the lack of supporting CAD tools, small circuit density, low speed and significant parasitic effect from the fixed routing wires. These factors are all related to each other, making the design of a high performance FPAA a multi-dimension problem. Among others, a critical reason behind these difficulties is the non-ideal programming technology, which contributes a large portion of parasitics into the sensitive analog system, thus degrades the system performance. This work is trying to attack these difficulties with development of a laser field programmable analog array (LFPAA). There are two parts of work involved, routing for FPAA and analog IC building block design. To facilitate the router development and provide a platform for FPAA application development, a generic arrayed based FPAA architecture and a flexible CAB topology were proposed. The routing algorithm was based on a modified and improved pathfinder negotiated routing algorithm, and was implemented in C for a prototype FPAA. The parasitic constraints for performance analog routing were also investigated and solutions were proposed. In the area of analog circuit design, a novel differential difference op amp was invented as the core building block. Two bandgap circuits including a low voltage version were developed to generate a stable reference voltage for the FPAA. Based on the proposed FPAA architecture, several application examples were demonstrated. The results show the flexible functionality of the FPAA. Moreover, various laser Makelink test structures were studied on different CMOS processes and BiCMOS copper process. Laser Makelink proves to be a powerful programming technology for analog IC design. A novel laser Makelink trimming method was invented to reduce the op amp offset. The application of using laser Makelink to reconfigure the analog circuit blocks was presented

Design automation and analysis of three-dimensional integrated circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2004.Includes bibliographical references (p. 165-176).This dissertation concerns the design of circuits and systems for an emerging technology known as three-dimensional integration. By stacking individual components, dice, or whole wafers using a high-density electromechanical interconnect, three-dimensional integration can achieve scalability and performance exceeding that of conventional fabrication technologies. There are two main contributions of this thesis. The first is a computer-aided design flow for the digital components of a three-dimensional integrated circuit (3-D IC). This flow primarily consists of two software tools: PR3D, a placement and routing tool for custom 3-D ICs based on standard cells, and 3-D Magic, a tool for designing, editing, and testing physical layout characteristics of 3-D ICs. The second contribution of this thesis is a performance analysis of the digital components of 3-D ICs. We use the above tools to determine the extent to which 3-D integration can improve timing, energy, and thermal performance. In doing so, we verify the estimates of stochastic computational models for 3-D IC interconnects and find that the models predict the optimal 3-D wire length to within 20% accuracy. We expand upon this analysis by examining how 3-D technology factors affect the optimal wire length that can be obtained. Our ultimate analysis extends this work by directly considering timing and energy in 3-D ICs. In all cases we find that significant performance improvements are possible. In contrast, thermal performance is expected to worsen with the use of 3-D integration. We examine precisely how thermal behavior scales in 3-D integration and determine quantitatively how the temperature may be controlled during the circuit placement process. We also show how advanced packaging(cont.) technologies may be leveraged to maintain acceptable die temperatures in 3-D ICs. Finally, we explore two issues for the future of 3-D integration. We determine how technology scaling impacts the effect of 3-D integration on circuit performance. We also consider how to improve the performance of digital components in a mixed-signal 3-D integrated circuit. We conclude with a look towards future 3-D IC design tools.by Shamik Das.Ph.D