Elastomer-based pneumatic switch for radio frequency microdevices

This paper reports the realization and characterization of a pneumatic microswitch integrated with a high-frequency radio frequency (RF) transmission line on an elastomer substrate. A process for the fabrication of low-loss RF coplanar transmission lines on flexible elastomeric polydimethylsiloxane (PDMS) substrates was developed, and devices realized using this process were used to determine the characteristics of PDMS as an RF substrate with uniform low loss and low dielectric constant being measure

Ultra-thin chips for high-performance flexible electronics

Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics

Development of optical MEMS-based micromirror arrays on flexible substrate for curvilinear surfaces

Gefördert im Rahmen des Projekts DEA

New materials and advances in making electronic skin for interactive robots

Flexible electronics has huge potential to bring revolution in robotics and prosthetics as well as to bring about the next big evolution in electronics industry. In robotics and related applications, it is expected to revolutionise the way with which machines interact with humans, real-world objects and the environment. For example, the conformable electronic or tactile skin on robot’s body, enabled by advances in flexible electronics, will allow safe robotic interaction during physical contact of robot with various objects. Developing a conformable, bendable and stretchable electronic system requires distributing electronics over large non-planar surfaces and movable components. The current research focus in this direction is marked by the use of novel materials or by the smart engineering of the traditional materials to develop new sensors, electronics on substrates that can be wrapped around curved surfaces. Attempts are being made to achieve flexibility/stretchability in e-skin while retaining a reliable operation. This review provides insight into various materials that have been used in the development of flexible electronics primarily for e-skin applications

MEMS tunable infrared metamaterial and mechanical sensors

Sub-wavelength resonant structures open the path for fine controlling the near-field at the nanoscale dimension. They constitute into macroscopic “metamaterials” with macroscale properties such as transmission, reflection, and absorption being tailored to exhibit a particular electromagnetic response. The properties of the resonators are often fixed at the time of fabrication wherein the tunability is demanding to overcome fabrication tolerances and afford fast signal processing. Hybridizing dynamic components such as optically active medium into the device makes tunable devices. Microelectromechanical systems (MEMS) compatible integrated circuit fabrication process is a promising platform that can be merged with photonics or novel 2D materials. The prospect of enormous freedom in integrating nanophotonics, MEMS actuators and sensors, and microelectronics into a single platform has driven the rapid development of MEMS-based sensing devices. This thesis describes the design and development of four tunable plasmonic structures based on active media or MEMS, two graphene-based MEMS sensors and a novel tape-based cost-effective nanotransfer printing techniques. First of all, we present two tunable plasmonic devices with the use of two active medium, which are electrically controlled liquid crystals and temperature-responsive hydrogels, respectively. By incorporating a nematic liquid crystal layer into quasi-3D mushroom plasmonic nanostructures and thanks to the unique coupling between surface plasmon polariton and Rayleigh anomaly, we have achieved the electrical tuning of the properties of plasmonic crystal at a low operating electric field. We also present another tunable plasmonic device with the capability to sense environmental temperature variations. The device is bowtie nanoantenna arrays coated with a submicron-thick, thermos-responsive hydrogel. The favorable scaling of plasmonic dimers at the nanometer scale and ionic diffusion at the submicron scale is leveraged to achieve strong optical resonance and rapid hydrogel response, respectively. Secondly, we present two MEMS -based tunable near-to-mid infrared metamaterials on a silicon-on-insulator wafer via electrically and thermally actuating the freestanding nanocantilevers. The two devices are developed on the basis of the same fabrication process and are easy-to-implement. The electrostatically driven metamaterial affords ultrahigh mechanical modulation (several tens of MHz) of an optical signal while the thermo-mechanically tunable metamaterial provides up to 90% optical signal modulation at a wavelength of 3.6 õm. Next, we present MEMS graphene-based pressure and gas flow sensors realized by transferring a large area and few-layered graphene onto a suspended silicon nitride thin membrane perforated with micro-through-holes. Due to the increased strain in the through-holes, the pressure sensor exhibits a very high sensitivty outperformed than most existing MEMS-based pressure sensors using graphene, silicon, and carbon nanotubes. An air flow sensor is also demonstrated via patterning graphene sheets with flow-through microholes. The flow rate of the air is measured by converting the mechanically deflection of the membrane into the electrical readout due to the graphene piezeroresistors. Finally, we present a tape-based multifunctional nanotransfer printing process based on a simple stick-and-peel procedure. It affords fast production of large-area metallic and dielectric nanophotonic sensing devices and metamaterials using Scotch tape

The role of printed electronics and related technologies in the development of smart connected products

The emergence of novel materials with flexible and stretchable characteristics, and the use of new processing technologies, have allowed for the development of new connected devices and applications. Using printed electronics, traditional electronic elements are being combined with flexible components and allowing for the development of new smart connected products. As a result, devices that are capable of sensing, actuating, and communicating remotely while being low-cost, lightweight, conformable, and easily customizable are already being developed. Combined with the expansion of the Internet of Things, artificial intelligence, and encryption algorithms, the overall attractiveness of these technologies has prompted new applications to appear in almost every sector. The exponential technological development is currently allowing for the ‘smartification’ of cities, manufacturing, healthcare, agriculture, logistics, among others. In this review article, the steps towards this transition are approached, starting from the conceptualization of smart connected products and their main markets. The manufacturing technologies are then presented, with focus on printing-based ones, compatible with organic materials. Finally, each one of the printable components is presented and some applications are discussed.This work has been supported by NORTE-06-3559- FSE-000018, integrated in the invitation NORTE59-2018-41, aiming the Hiring of Highly Qualified Human Resources, co-financed by the Regional Operational Programme of the North 2020, thematic area of Competitiveness and Employment, through the European Social Fund (ESF), and by the scope of projects with references UIDB/05256/2020 and UIDP/05256/2020, financed by FCT—Fundação para a Ciência e Tecnologia, Portugal

Ultra-thin and flexible CMOS technology: ISFET-based microsystem for biomedical applications

A new paradigm of silicon technology is the ultra-thin chip (UTC) technology and the emerging applications. Very thin integrated circuits (ICs) with through-silicon vias (TSVs) will allow the stacking and interconnection of multiple dies in a compact format allowing a migration towards three-dimensional ICs (3D-ICs). Also, extremely thin and therefore mechanically bendable silicon chips in conjunction with the emerging thin-film and organic semiconductor technologies will enhance the performance and functionality of large-area flexible electronic systems. However, UTC technology requires special attention related to the circuit design, fabrication, dicing and handling of ultra-thin chips as they have different physical properties compared to their bulky counterparts. Also, transistors and other active devices on UTCs experiencing variable bending stresses will suffer from the piezoresistive effect of silicon substrate which results in a shift of their operating point and therefore, an additional aspect should be considered during circuit design. This thesis tries to address some of these challenges related to UTC technology by focusing initially on modelling of transistors on mechanically bendable Si-UTCs. The developed behavioural models are a combination of mathematical equations and extracted parameters from BSIM4 and BSIM6 modified by a set of equations describing the bending-induced stresses on silicon. The transistor models are written in Verilog-A and compiled in Cadence Virtuoso environment where they were simulated at different bending conditions. To complement this, the verification of these models through experimental results is also presented. Two chips were designed using a 180 nm CMOS technology. The first chip includes nMOS and pMOS transistors with fixed channel width and two different channel lengths and two different channel orientations (0° and 90°) with respect to the wafer crystal orientation. The second chip includes inverter logic gates with different transistor sizes and orientations, as in the previous chip. Both chips were thinned down to ∼20m using dicing-before-grinding (DBG) prior to electrical characterisation at different bending conditions. Furthermore, this thesis presents the first reported fully integrated CMOS-based ISFET microsystem on UTC technology. The design of the integrated CMOS-based ISFET chip with 512 integrated on-chip ISFET sensors along with their read-out and digitisation scheme is presented. The integrated circuits (ICs) are thinned down to ∼30m and the bulky, as well as thinned ICs, are electrically and electrochemically characterised. Also, the thesis presents the first reported mechanically bendable CMOS-based ISFET device demonstrating that mechanical deformation of the die can result in drift compensation through the exploitation of the piezoresistive nature of silicon. Finally, this thesis presents the studies towards the development of on-chip reference electrodes and biodegradable and ultra-thin biosensors for the detection of neurotransmitters such as dopamine and serotonin

Flexible stretchable electronics for sport and wellbeing applications

Wearable electronics are becoming increasingly widespread in modern society. Though these devices are intended to be worn, integrated into clothing and other everyday objects, the technologies and processes used to manufacture them is no different than those that manufacture laptops and mobile phones. Many of these devices are intended to monitor the user’s health, activity and general wellbeing, within clinical, recreational and assistive environments. Consequently, the inherent incompatibility of these rigid devices with the soft, elastic structure of the human body can in some cases can be uncomfortable and inconvenient for everyday life. For devices to take the step from a ‘wearable’ to an ‘invisible’, a drastic rethinking of electronics manufacturing is required.The fundamental aim of this research is to establish parameters of usefulness and an array of materials with complimentary processes that would assist in transitioning devices to long term almost invisible items that can assist in improving the health of the wearer. In order to approach this problem, a novel architecture was devised that utilised PDMS as a substrate and microfluid channels of Galinstan liquid alloy for interconnects. CO2 laser machining was investigated as a means of creating channels and vias on PDMS substrates. Trace speeds and laser power outputs were investigated in order to find an optimal combination. The results displayed upper limits for power densities; where surpassing this limit resulted in poor repeatability and surface finish. It was found that there was an optimal set of trace speeds that ranged from approximately 120mm/s to 190mm/s that resulted in the most reliable and repeatable performance. Due to the complex nature of a materials variable energy absorption properties, it is not possible to quantify a single optimal parameter set.To understand the performance of these devices in situ, finite element analysis was employed to model deformations that such a device could experience. The aims here were to investigate the bond strength required to prevent delamination, between the silicon-PDMS and PDMS-PDMS bonds, in addition to the stress applied to the silicone die during these deformations. Based upon the applied loads the required bond strengths would need to be at least ~65kPa to maintain PDMS-PDMS adhesion during these tests, while stress on the silicone-PDMS adhesion required an expected v higher ~160kPa, both of which are within the reach of existing bonding techniques that are capable of withstanding a pressure of ~600kPa before failure occurs. Stress on the silicon die did not exceed ~7.8 MPa during simulation, which is well below the fracture stress.By developing knowledge about how various components of such a system will respond during use and under stress, it allows future engineers to make informed design decisions and develop better more resilient products.</div

Flexible and Stretchable Electronics

Flexible and stretchable electronics are receiving tremendous attention as future electronics due to their flexibility and light weight, especially as applications in wearable electronics. Flexible electronics are usually fabricated on heat sensitive flexible substrates such as plastic, fabric or even paper, while stretchable electronics are usually fabricated from an elastomeric substrate to survive large deformation in their practical application. Therefore, successful fabrication of flexible electronics needs low temperature processable novel materials and a particular processing development because traditional materials and processes are not compatible with flexible/stretchable electronics. Huge technical challenges and opportunities surround these dramatic changes from the perspective of new material design and processing, new fabrication techniques, large deformation mechanics, new application development and so on. Here, we invited talented researchers to join us in this new vital field that holds the potential to reshape our future life, by contributing their words of wisdom from their particular perspective