3,385,846 research outputs found
Low temperature stimulates spatial molecular reprogramming of the Arabidopsis seed germination programme
The timing of the germination of seeds is highly responsive to inputs from the environment. Temperature plays a key role in the control of germination, with low temperatures acting to stimulate this developmental transition in many species. In Arabidopsis, extensive gene expression changes have been reported at the whole seed level in response to cold, while much less is known about their spatial distribution across the diverse cell types of the embryo. In this study we examined the spatiotemporal patterns of promoter activity and protein abundance for key gibberellic acid (GA) and abscisic acid (ABA) factors which regulate the decision to germinate both during a time course of germination and in response to cold. Low temperature stimulated the spatial relocalization of these factors to the vasculature. The response of these seeds to dormancy-breaking stratification treatments therefore stimulates the distribution of both positive (GA) and negatively acting (ABA) components to this same cell type. This altered spatial pattern persisted following the transfer of seeds to 22°C, as well as after their rehydration, indicating that this alteration is persistent. These observations suggest that the vasculature plays a role in the low temperature-mediated stimulation of germination in this species, while novel cell types are recruited to promote germination in response to stratification
Low-temperature performance of semiconducting asymmetric nanochannel diodes
We present our studies on fabrication and electrical and optical characterization of
semiconducting asymmetric nanochannel diodes (ANCDs), focusing mainly on the temperature dependence of their current–voltage (I–V) characteristics in the range from room temperature to
77 K. These measurements enable us to elucidate the electron transport mechanism in a nanochannel. Our test devices were fabricated in a GaAs/AlGaAs heterostructure with a twodimensional
electron gas layer and were patterned using electron-beam lithography. The 250-nmwide, 70-nm-deep trenches that define the nanochannel were ion-beam etched using the photoresist as a mask, so the resulting nanostructure consisted of approximately ten ANCDs
connected in parallel with 2-μm-long, 230-nm-wide nanochannels. The ANCD I–V curves
collected in the dark exhibited nonlinear, diode-type behavior at all tested temperatures. Their
forward-biased regions were fitted to the classical diode equation with a thermionic barrier, with the ideality factor n and the saturation current as fitting parameters. We have obtained very good
fits, but with n as large as ~50, suggesting that there must be a substantial voltage drop likely at
the contact pads. The thermionic energy barrier was determined to be 56 meV at high temperatures. We have also observed that under optical illumination our ANCDs at low temperatures exhibited, at low illumination powers, a very strong photoresponse enhancement that exceeded that at room temperature. At 78 K, the responsivity was of the order of 104 A/W at the nW-level light excitation
Low Temperature Opacities
Previous computations of low temperature Rosseland and Planck mean opacities
from Alexander & Ferguson (1994) are updated and expanded. The new computations
include a more complete equation of state with more grain species and updated
optical constants. Grains are now explicitly included in thermal equilibrium in
the equation of state calculation, which allows for a much wider range of grain
compositions to be accurately included than was previously the case. The
inclusion of high temperature condensates such as AlO and CaTiO
significantly affects the total opacity over a narrow range of temperatures
before the appearance of the first silicate grains.
The new opacity tables are tabulated for temperatures ranging from 30000 K to
500 K with gas densities from 10 g cm to 10 g cm.
Comparisons with previous Rosseland mean opacity calculations are discussed. At
high temperatures, the agreement with OPAL and Opacity Project is quite good.
Comparisons at lower temperatures are more divergent as a result of differences
in molecular and grain physics included in different calculations. The
computation of Planck mean opacities performed with the opacity sampling method
are shown to require a very large number of opacity sampling wavelength points;
previously published results obtained with fewer wavelength points are shown to
be significantly in error. Methods for requesting or obtaining the new tables
are provided.Comment: 39 pages with 12 figures. To be published in ApJ, April 200
Selective low temperature chemical looping combustion of higher alkanes with Cu- and Mn- oxides
Chemical looping combustion (CLC) of n-hexadecane and n-heptane with copper and manganese oxides (CuO and Mn2O3) has been investigated in a fixed bed reactor to reveal the extent to which low temperature CLC can potentially be applicable to hydrocarbons. The effects of fuel to oxygen carrier ratio, fuel feed flow rate, and fuel residence time on the extent of combustion are reported. Methane did not combust, while near complete conversion was achieved for both n-hexadecane and n-heptane with excess oxygen carrier for CuO. For Mn2O3, complete reduction to Mn3O4 occurred, but the extent of combustion was controlled by the much slower reduction to MnO. Although the extent of cracking is relatively small in the absence of cracking catalysts, for the mechanism to be selective for higher hydrocarbons suggests that the reaction with oxygen involves radicals or carbocations arising from bond scission. Sintering of pure CuO occurred after repeated cycles, but this can easily be avoided using a support, such as alumina. The fact that higher hydrocarbons can be combusted selectively at 500 °C and below, offers the possibility of using CLC to remove these hydrocarbons and potentially other organics from hot gas streams
Low temperature fluid blender
Blender supplies hydrogen at temperatures from 289 deg K to 367 deg K. Hydrogen temperature is controlled by using blender to combine flow from liquid hydrogen tank /276 deg K/ and gaseous hydrogen cylinder /550 deg K/. Blenders are applicable where flow of controlled low-temperature fluid is desired
Low temperature latching solenoid
A magnetically latching solenoid includes a pull-in coil and a delatching coil. Each of the coils is constructed with a combination of wire materials, including material of low temperature coefficient of resistivity to enable the solenoid to be operated at cryogenic temperatures while maintaining sufficient coil resistance. An armature is spring-based toward a first position, that may extend beyond the field of force of a permanent magnet. When voltage is temporarily applied across the pull-in magnet, the induced electromagnetic forces overcome the spring force and pulls the armature to a second position within the field of the permanent magnet, which latches the armature in the pulled-in position. Application of voltage across the delatching coil induces electromagnetic force which at least partially temporarily nullifies the field of the permanent magnet at the armature, thereby delatching the armature and allowing the spring to move the armature to the first position
Low-temperature saw damage gettering to improve minority carrier lifetime in multicrystalline silicon
The minority carrier lifetime in multicrystalline silicon − a material used in the majority of today's manufactured solar cells − is limited by defects within the material, including metallic impurities which are relatively mobile at low temperatures (≤700 °C). Addition of an optimised thermal process which can facilitate impurity diffusion to the saw damage at the wafer surfaces can result in permanent removal of the impurities when the saw damage is etched away. We demonstrate that this saw damage gettering is effective at 500 to 700 °C and, when combined with subsequent low-temperature processing, lifetimes are improved by a factor of more than four relative to the as-grown state. The simple method has the potential to be a low thermal budget process for the improvement of low-lifetime “red zone” wafers
Low-temperature bonding of temperature-resistant electronic connections
Bonding of flat metal surfaces utilizes low temperature melting intermediate material, pulse heating, and pressure application to produce strong, electrically conductive bond resistant to melting at temperatures well above melting point of intermediate material. Little or no intermediate material remains at the interface
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