Large-Scale Integration of Nanoelectromechanical Systems for Gas Sensing Applications

We have developed arrays of nanomechanical systems (NEMS) by large-scale integration, comprising thousands of individual nanoresonators with densities of up to 6 million NEMS per square centimeter. The individual NEMS devices are electrically coupled using a combined series-parallel configuration that is extremely robust with respect to lithographical defects and mechanical or electrostatic-discharge damage. Given the large number of connected nanoresonators, the arrays are able to handle extremely high input powers (>1 W per array, corresponding to <1 mW per nanoresonator) without excessive heating or deterioration of resonance response. We demonstrate the utility of integrated NEMS arrays as high-performance chemical vapor sensors, detecting a part-per-billion concentration of a chemical warfare simulant within only a 2 s exposure period

Building Blocks for Large-scale Integration of Logic Circuits

Large scale integration of logic circuit

The Impact of LSI (Large Scale Integration) on System Packaging

System packaging of LSI circuit

Design Methodology of Very Large Scale Integration

Very Large Scale Integration (VLSI) deals with systems complexity rather than transistor size or circuit performance. VLSI design methodology is supported by Computer Aided Design (CAD) and Design Automation (DA) tools, which help VLSI designers to implement more complex and guaranteed designs. The increasing growth in VLSI complexity dictates a hierarchical design approach and the need for hardware DA tools. This paper discusses the generalized Design Procedure for CAD circuit design; the commercial CADs offered by CALMA and the Caesar System, supported by the Berkeley design tools. A complete design of a Content Addressable Memory (CAM) cell, using the Caesar system, supported by Berkeley CAD tools, is illustrated

The development of quality standards for bipolar LSI, volume 2 Final report, 15 Apr. 1968 - 15 Apr. 1969

Quality standard development for bipolar large scale integration device

Establishing an electrical test philosophy for LSI microcircuits, volume 2 Final report, 15 May 1970 - 15 Feb. 1971

Large scale integration microelectronic wafer and package testing including parametric and functional tests of combinatorial and sequential logic circuit