The design and fabrication of miniature microwave bandpass filters using multilayer liquid crystal polymer technology

This thesis presents the design and fabrication techniques for miniature microwave bandpass filters using multilayer liquid crystal polymer (LCP) technology. As a multilayer technology for microwave devices, LCP is of low cost and light weight. It also has excellent electrical properties across a wide frequency range. These characteristics make it promising for the development of next generation microwave devices for applications across commercial, defence and civil sectors. However, very limited work has been found in the open literature to apply this technology to the design of miniature bandpass filters, especially at low microwave frequencies. In addition, the reported work shows lack of fabrication techniques, which limits the size reduction of multilayer LCP devices. To address these problems, this thesis develops advanced fabrication techniques for sophisticated LCP structures, such as multilayer capacitors, via connections and cavities. These techniques are then used to support the design of novel miniature bandpass filters for wideband and narrowband applications. For the design of miniature wideband bandpass filters, a cascaded approach, which combines highpass and lowpass filters, is presented first to provide a flexible design solution. This is followed by another novel ultra-wideband bandpass filter which produces extra transmission zeroes with minimum number of elements. It does not only have high performance but also a compact structure for high yield fabrication. For narrowband applications, two types of advanced coupled-resonator filters are developed. One type produces a very good selectivity at the upper passband edge, and its spurious-free stopband is extremely wide and of high interference attenuation. The other type, based on novel mixed-couplings approaches developed in this thesis, provides a solution to produce almost the same response as the coupling matrix prototype. This type is used to generate arbitrarily-located transmission zeroes. All designs presented in this thesis are simulated using CAD design tools and then validated by measurements of fabricated samples. Good agreements between simulations and measurements are shown in the thesis

Layout-level Circuit Sizing and Design-for-manufacturability Methods for Embedded RF Passive Circuits

The emergence of multi-band communications standards, and the fast pace of the consumer electronics markets for wireless/cellular applications emphasize the need for fast design closure. In addition, there is a need for electronic product designers to collaborate with manufacturers, gain essential knowledge regarding the manufacturing facilities and the processes, and apply this knowledge during the design process. In this dissertation, efficient layout-level circuit sizing techniques, and methodologies for design-for-manufacturability have been investigated. For cost-effective fabrication of RF modules on emerging technologies, there is a clear need for design cycle time reduction of passive and active RF modules. This is important since new technologies lack extensive design libraries and layout-level electromagnetic (EM) optimization of RF circuits become the major bottleneck for reduced design time. In addition, the design of multi-band RF circuits requires precise control of design specifications that are partially satisfied due to manufacturing variations, resulting in yield loss. In this work, a broadband modeling and a layout-level sizing technique for embedded inductors/capacitors in multilayer substrate has been presented. The methodology employs artificial neural networks to develop a neuro-model for the embedded passives. Secondly, a layout-level sizing technique for RF passive circuits with quasi-lumped embedded inductors and capacitors has been demonstrated. The sizing technique is based on the circuit augmentation technique and a linear optimization framework. In addition, this dissertation presents a layout-level, multi-domain DFM methodology and yield optimization technique for RF circuits for SOP-based wireless applications. The proposed statistical analysis framework is based on layout segmentation, lumped element modeling, sensitivity analysis, and extraction of probability density functions using convolution methods. The statistical analysis takes into account the effect of thermo-mechanical stress and process variations that are incurred in batch fabrication. Yield enhancement and optimization methods based on joint probability functions and constraint-based convex programming has also been presented. The results in this work have been demonstrated to show good correlation with measurement data.Ph.D.Committee Chair: Swaminathan, Madhavan; Committee Member: Fathianathan, Mervyn; Committee Member: Lim, Sung Kyu; Committee Member: Peterson, Andrew; Committee Member: Tentzeris, Mano

RF MEMS Based Tunable Bowtie Shaped Substrate Integrated Waveguide Filter

A tunable bandpass filter based on a technique that utilizes substrate integrated waveguide (SIW) and double coupling is presented. The SIW based bandpass filter is implemented using a bowtie shaped resonator structure. The bowtie shaped filter exhibits similar performance as found in rectangular and circular shaped SIW based bandpass filters. This concept reduces the circuit foot print of SIW; along with miniaturization high quality factor is maintained by the structure. The design methodology for single-pole triangular resonator structure is presented. Two different inter-resonator couplings of the resonators are incorporated in the design of the two-pole bowtie shaped SIW bandpass filter, and switching between the two couplings using a packaged RF MEMS switch delivers the tunable filter. A tunning of 1 GHz is achieved for two frequency states of 6.3 and 7.3 GHz. The total size of the circuit is 70mm x 36mm x 0.787 mm (LxWxH)

Millimeter-wave passive bandpass filters

Abstract: This paper presents a comprehensive review of millimeter-wave (mm-wave) passive bandpass filters (BPFs). A detailed discussion is provided on different topologies and architectures, performance comparison, design challenges, and process technologies. Passive BPFs offer the advantages of high operating frequency, good linearity, low noise figure (NF), and no power dissipation. Careful consideration of available process technologies is required for the implementation of high performance mm-wave circuits. Gallium arsenide (GaAs) and indium phosphide (InP) (group III-V) processes provide high cutoff frequencies (fT), good noise performance, and high quality on-chip passives. Complementary metal oxide semiconductor (CMOS) process has the prominent advantages of low cost, a high degree of integration, and high reliability, while silicon germanium bipolar CMOS (SiGe BiCMOS) process demonstrates high fT, a high level of integration, and better noise and power performance

Development of turnable and miniature microwave filters for modern wireless communication

Due to the increasing demand for new wireless services and applications, the high level of integration and the coexistence of multi-standard (MS) or multi-band operations into a single device are becoming defining trends in designing microwave filters. This has driven considerable technological advances in reconfigurable/tunable and miniaturized filters. More specifically, reconfigurable/tunable filters that tune to different frequency bands instead of classical filter banks have great potential to significantly reduce the system size and complexity; while reducing the filter size becomes essential to achieve the highest degree of integration density in compact and portable wireless devices. In the light of this scenario, the objective of this dissertation is to develop the new design technologies, concepts and filtering configurations for tunable microstrip filters and compact passive microwave filters. To this aim, this dissertation is divided into two main parts. The first part (Part I) focuses on the designs of novel varactor-tuned microstrip filters with advanced performances. In this aspect, new topologies for realizing tunable lowpass and highpass filters are firstly developed. State-of-the-art performances, including wide tuning range, high selectivity with multiple transmission zeros, low insertion loss and compact size for all the tuning states are obtained in both of these filters. Secondly, two novel classes of tunable bandpass filters are presented. One of them is designed based on varactor-loaded parallel-coupled microstrip lines (PCML) and short-circuited stubs, which allows the lower passband edge together with two transmission zeros located around the lower passband skirt to be reconfigured separately. While the other tunable bandpass filter is iii constructed by the combination of tunable bandpass and lowpass filters, featuring both centre frequency and bandwidth tunabilities, as well as high selectivity with abundant transmission zeros. Furthermore, a new concept of tunable lossy filter is demonstrated, which attempts to achieve an equivalent high-Q tunable performance by using low-Q resonators. This concept makes the presented tunable combline filter interesting for some frequency-agile applications in which the low in-band loss variation and high selectivity are much desired while the absolute insertion loss can be a tradeoff. The second part (Part II) is devoted to the design of miniaturized passive microwave filters with improved characteristics. For this, the concept of artificial right-handed and left-handed transmission lines are applied to the signal interference filtering topology, which results in a compact circuit size and good out-of-band performance. In particular, for a further size reduction, such filter is implemented in the forms of multilayered structure by using liquid crystal polymer (LCP) technology. Additionally, another two types of miniaturized bandpass filters using stepped impedance resonators are demonstrated, which are implemented based on different fabrication processes (i.e. LCP bonded multilayer PCB technology and a standard planar PCB technology). Among their main features, the compact size, wide passband, broad stopband with multiple transmission zeros and circuit simplicity are highlighted. For all the proposed design techniques and filtering structures, exhaustive theoretical analyses are done, and design equations and guide rules are provided. Furthermore, all the proposed schemes and/or ideas have been experimentally validated through the design, implementation and measurement of different filters. The fabrication processes of multilayer technology utilized: liquid crystal polymer (LCP) technology and liquid crystal polymer (LCP) bonded multilayer printed circuit board (PCB) technology, are also demonstrated for reference. All of the results achieved in this dissertation make the proposed filters very attractive for their use in modern wireless communication systems.MultiWaves Project (PIRSES-GA-2010-247532) of the Seventh Framework Programme (FP7), European Commission

Development of tunable and miniature microwave filters for modern wireless communications

Due to the increasing demand for new wireless services and applications, the high level of integration and the coexistence of multi-standard (MS) or multi-band operations into a single device are becoming defining trends in designing microwave filters. This has driven considerable technological advances in reconfigurable/tunable and miniaturized filters. More specifically, reconfigurable/tunable filters that tune to different frequency bands instead of classical filter banks have great potential to significantly reduce the system size and complexity; while reducing the filter size becomes essential to achieve the highest degree of integration density in compact and portable wireless devices. In the light of this scenario, the objective of this dissertation is to develop the new design technologies, concepts and filtering configurations for tunable microstrip filters and compact passive microwave filters. To this aim, this dissertation is divided into two main parts. The first part (Part I) focuses on the designs of novel varactor-tuned microstrip filters with advanced performances. In this aspect, new topologies for realizing tunable lowpass and highpass filters are firstly developed. State-of-the-art performances, including wide tuning range, high selectivity with multiple transmission zeros, low insertion loss and compact size for all the tuning states are obtained in both of these filters. Secondly, two novel classes of tunable bandpass filters are presented. One of them is designed based on varactor-loaded parallel-coupled microstrip lines (PCML) and short-circuited stubs, which allows the lower passband edge together with two transmission zeros located around the lower passband skirt to be reconfigured separately. While the other tunable bandpass filter is constructed by the combination of tunable bandpass and lowpass filters, featuring both centre frequency and bandwidth tunabilities, as well as high selectivity with abundant transmission zeros. Furthermore, a new concept of tunable lossy filter is demonstrated, which attempts to achieve an equivalent high-Q tunable performance by using low-Q resonators. This concept makes the presented tunable combline filter interesting for some frequency-agile applications in which the low in-band loss variation and high selectivity are much desired while the absolute insertion loss can be a tradeoff. The second part (Part II) is devoted to the design of miniaturized passive microwave filters with improved characteristics. For this, the concept of artificial right-handed and left-handed transmission lines are applied to the signal interference filtering topology, which results in a compact circuit size and good out-of-band performance. In particular, for a further size reduction, such filter is implemented in the forms of multilayered structure by using liquid crystal polymer (LCP) technology. Additionally, another two types of miniaturized bandpass filters using stepped impedance resonators are demonstrated, which are implemented based on different fabrication processes (i.e. LCP bonded multilayer PCB technology and a standard planar PCB technology). Among their main features, the compact size, wide passband, broad stopband with multiple transmission zeros and circuit simplicity are highlighted. For all the proposed design techniques and filtering structures, exhaustive theoretical analyses are done, and design equations and guide rules are provided. Furthermore, all the proposed schemes and/or ideas have been experimentally validated through the design, implementation and measurement of different filters. The fabrication processes of multilayer technology utilized: liquid crystal polymer (LCP) technology and liquid crystal polymer (LCP) bonded multilayer printed circuit board (PCB) technology, are also demonstrated for reference. All of the results achieved in this dissertation make the proposed filters very attractive for their use in modern wireless communication systems

Self-packaged miniature microwave filters based on multilayer liquid crystal polymer technology

The following thesis is concerned with the development of fabrication techniques and novel designs for self-packaged, multilayer circuits using liquid crystal polymer (LCP) materials exclusively, given the favourable characteristics this material has for microwave circuits. Fabrication techniques are aimed at the production of miniature, low-profile filters. Advanced techniques for production of interlayer via connections are investigated and new methods proposed, with special attention at the lamination process and production of vertical, inter-layer transitions. Results obtained demonstrate the fabrication process is reliable for producing multilayer filters, with up to four metal layers, and via transitions in the region of 0.2 mm diameter. The fabrication process has been developed during this work is applied to novel filter designs, covering dual-band filters and lowpass filters. A new structure for dual- band filter is proposed, using folded multimode resonators (FMSIR). This structure is validated through the fabrication of two different filters with passbands 1.2/2.4 GHz, and 2.4/5 GHz, showing deep off-band rejection. Low pass structure covered in this thesis is based on the principle of destructive interference and aims at low insertion loss and out-of-band rejection higher than 40 dB. Fabricated samples validate the design showing a rejection in the region of 42 dB, with a cuto frequency of 3 GHz. Its small footprint and low insertion loss allows this type of lters to be used as cleanup filters. All the designs covered in this work are simulated using CAD tools and then validated by measurements on fabricated samples

Advanced RF/microwave filtering circuits for wireless communications and radar applications.

The recent rapid development in modern communication systems has presented some constraints caused by the introduced noises, as well as further requirements of low costs and miniature designs. Such noises are overcome using efficient designs of filtering devices which are essential components in many satellite, radar and mobile communication systems. As a result, balanced or differential filtering components have recently received increasing attention. A wideband microstrip balanced bandpass filter based on modified stub line approach is presented in here. The proposed idea of extended transmission lines (TLs) at the input and output (I/O) ports enables for very good stopband rejection and common-mode suppression. On the other hand, the recently introduced multilayer liquid crystal polymer (LCP) material and fabrication technique are exclusively applied in this work for adapting the potential solutions offered within. Therefore, a comprehensive in-house fabrication process has been developed and extensively illustrated in this thesis starting from mask preparation covering the entire procedure up to producing the final piece of output. As a demonstrator of the potential capability of multilayer LCP technology, a novel miniaturized ultra-wideband (UWB) balun with self-packaging is introduced in this study. The broadside coupled stripline structure is adopted in this work to realize UWB performance and TEM mode which results in excellent amplitude and phase balances. In turn, a novel compact UWB multilayer balanced bandpass filter using LCP technology is also presented in this thesis. The design utilizes the transversal signal-interference concept for realizing an outstanding common-mode suppression while constructed in a stripline configuration. All of the designs covered in this thesis are initially simulated using CAD tools to be then validated by measurements of fabricated prototypes