Improving Reliability of High Power Quasi-CW Laser Diode Arrays for Pumping Solid State Lasers

Most Lidar applications rely on moderate to high power solid state lasers to generate the required transmitted pulses. However, the reliability of solid state lasers, which can operate autonomously over long periods, is constrained by their laser diode pump arrays. Thermal cycling of the active regions is considered the primary reason for rapid degradation of the quasi-CW high power laser diode arrays, and the excessive temperature rise is the leading suspect in premature failure. The thermal issues of laser diode arrays are even more drastic for 2-micron solid state lasers which require considerably longer pump pulses compared to the more commonly used pump arrays for 1-micron lasers. This paper describes several advanced packaging techniques being employed for more efficient heat removal from the active regions of the laser diode bars. Experimental results for several high power laser diode array devices will be reported and their performance when operated at long pulsewidths of about 1msec will be described

Improving Reliability of High Power Quasi-CW Laser Diode Arrays Operating in Long Pulse Mode

Operating high power laser diode arrays in long pulse regime of about 1 msec, which is required for pumping 2-micron thulium and holmium-based lasers, greatly limits their useful lifetime. This paper describes performance of laser diode arrays operating in long pulse mode and presents experimental data of the active region temperature and pulse-to-pulse thermal cycling that are the primary cause of their premature failure and rapid degradation. This paper will then offer a viable approach for determining the optimum design and operational parameters leading to the maximum attainable lifetime

Diode laser modules based on laser-machined, multi-layer ceramic substrates with integrated water cooling and micro-optics

This thesis presents a study on the use of low temperature co-fired ceramic (LTCC) material as a new platform for the packaging of multiple broad area single emitter diode lasers. This will address the recent trend in the laser industry of combining multiple laser diodes in a common package to reach the beam brightness and power required for pumping fibre lasers and for direct-diode industrial applications, such as welding, cutting, and etching. Packages based on multiple single emitters offer advantages over those derived from monolithic diode bars such as higher brightness, negligible thermal crosstalk between neighbouring emitters and protection against cascading failed emitters. In addition, insulated sub-mounted laser diodes based on telecommunication standards are preferred to diode bars and stacks because of the degree of assembly automation, and improved lifetime. At present, lasers are packaged on Cu or CuW platforms, whose high thermal conductivities allow an efficient passive cooling. However, as the number of emitters per package increases and improvements in the laser technology enable higher output power, the passive cooling will become insufficient. To overcome this problem, a LTCC platform capable of actively removing the heat generated by the lasers through impingement jet cooling was developed. It was provided with an internal water manifold capable to impinge water at 0.15 lmin-1 flow rate on the back surface of each laser with a variation of less than 2 °C in the temperature between the diodes. The thermal impedance of 2.7°C/W obtained allows the LTCC structure to cool the latest commercial broad area single emitter diode lasers which deliver up to 13 W of optical power. Commonly, the emitters are placed in a “staircase” formation to stack the emitters in the fast-axis, maintaining the brightness of the diode lasers. However, due to technical difficulties of machining the LTCC structure with a staircase-shaped face, a novel out-plane beam shaping method was proposed to obtain an elegant and compact free space combination of the laser beam on board using inexpensive optics. A compact arrangement was obtained using aligned folding mirrors, which stacked the beams on top of each other in the fast direction with the minimum dead space

Improving Lifetime of Quasi-CW Laser Diode Arrays for Pumping 2-Micron Solid State Lasers

Operating high power laser diode arrays in long pulse regime of about 1 msec, which is required for pumping 2-micron thulium and holmium-based lasers, greatly limits their useful lifetime. This paper describes performance of laser diode arrays operating in long pulse mode and presents experimental data on the active region temperature and pulse-to-pulse thermal cycling that are the primary cause of their premature failure and rapid degradation. This paper will then offer a viable approach for determining the optimum design and operational parameters leading to the maximum attainable lifetime

Modeling and Characterization of High-Power Electronic Devices: System Analysis of Laser Diodes with Flash Boiling and GaN HEMT Reliability Modeling

Modern electronics are increasingly more capable of high-power density operation, which presents important thermal challenges. High-power laser diode bars have proliferated in recent years, and while they can generate high optical powers, slope efficiencies are theoretically limited, resulting in high excess heat loads and consequent temperature shifts that can impair many applications. As a result, managing the ensuing heat flux and temperature changes has become increasingly important. Although traditional single-phase cooling solutions are limited by their convection coefficient to a certain temperature difference, two-phase solutions have potential for significantly higher convective coefficients. Flash boiling is a cooling method that can facilitate high levels of transient convective heat transfer, while allowing active control of coolant temperature. The transient nature of a flash cooling event is compatible with the heat load generated during operation of a high-power laser diode bar. Here, optical properties including spectral shift, spectral broadening, optical power, and beam quality are characterized over time. System inputs and outputs are correlated and evaluated via a statistical surrogate model. In certain cases, flash boiling is demonstrated to be a viable means of regulating laser diode bar temperature to achieve desirable optical output characteristics. In parallel, GaN HEMTs have seen rapid adoption in electronics applications due to their capability to operate at high powers at quick switching rates. As power levels rise, thermal management becomes crucial to avoid long-term degradation of the device. Spatial thermal modeling can help improve long-term reliability by linking local temperatures with various temperature dependent failure mechanisms such as hot-carrier injection

COMPREHENSIVE ELECTRICAL/OPTICAL/THERMAL CHARACTERIZATIONS OF HIGH POWER LIGHT EMITTING DIODES AND LASER DIODES

Thermal characterizations of high power light emitting diodes (LEDs) and laser diodes (LDs) are one of the most critical issues to achieve optimal performance such as center wavelength, spectrum, power efficiency, and reliability. Unique electrical/optical/thermal characterizations are proposed to analyze the complex thermal issues of high power LEDs and LDs. First, an advanced inverse approach, based on the transient junction temperature behavior, is proposed and implemented to quantify the resistance of the die-attach thermal interface (DTI) in high power LEDs. A hybrid analytical/numerical model is utilized to determine an approximate transient junction temperature behavior, which is governed predominantly by the resistance of the DTI. Then, an accurate value of the resistance of the DTI is determined inversely from the experimental data over the predetermined transient time domain using numerical modeling. Secondly, the effect of junction temperature on heat dissipation of high power LEDs is investigated. The theoretical aspect of junction temperature dependency of two major parameters – the forward voltage and the radiant flux – on heat dissipation is reviewed. Actual measurements of the heat dissipation over a wide range of junction temperatures are followed to quantify the effect of the parameters using commercially available LEDs. An empirical model of heat dissipation is proposed for applications in practice. Finally, a hybrid experimental/numerical method is proposed to predict the junction temperature distribution of a high power LD bar. A commercial water-cooled LD bar is used to present the proposed method. A unique experimental setup is developed and implemented to measure the average junction temperatures of the LD bar. After measuring the heat dissipation of the LD bar, the effective heat transfer coefficient of the cooling system is determined inversely. The characterized properties are used to predict the junction temperature distribution over the LD bar under high operating currents. The results are presented in conjunction with the wall-plug efficiency and the center wavelength shift

Development of effective thermal management strategies for LED luminaires

The efficacy, reliability and versatility of the light emitting diode (LED) can outcompete most established light source technologies. However, they are particularly sensitive to high temperatures, which compromises their efficacy and reliability, undermining some of the technology s key benefits. Consequently, effective thermal management is essential to exploit the technology to its full potential. Thermal management is a well-established subject but its application in the relatively new LED lighting industry, with its specific constraints, is currently poorly defined. The question this thesis aims to answer is how can LED thermal management be achieved most effectively? This thesis starts with a review of the current state of the art, relevant thermal management technologies and market trends. This establishes current and future thermal management constraints in a commercial context. Methods to test and evaluate the thermal management performance of a luminaire system follow. The defined test methods, simulation benchmarks and operational constraints provide the foundation to develop effective thermal management strategies. Finally this work explores how the findings can be implemented in the development and comparison of multiple thermal management designs. These are optimised to assess the potential performance enhancement available when applied to a typical commercial system. The outcomes of this research showed that thermal management of LEDs can be expected to remain a key requirement but there are hints it is becoming less critical. The impacts of some common operating environments were studied, but appeared to have no significant effect on the thermal behaviour of a typical system. There are some active thermal management devices that warrant further attention, but passive systems are inherently well suited to LED luminaires and are readily adopted so were selected as the focus of this research. Using the techniques discussed in this thesis the performance of a commercially available component was evaluated. By optimising its geometry, a 5 % decrease in absolute thermal resistance or a 20 % increase in average heat transfer coefficient and 10 % reduction in heatsink mass can potentially be achieved . While greater lifecycle energy consumption savings were offered by minimising heatsink thermal resistance the most effective design was considered to be one optimised for maximum average heat transfer coefficient. Some more radical concepts were also considered. While these demonstrate the feasibility of passively manipulating fluid flow they had a detrimental impact on performance. Further analysis would be needed to conclusively dismiss these concepts but this work indicates there is very little potential in pursuing them further

Application of advanced on-board processing concepts to future satellite communications systems

An initial definition of on-board processing requirements for an advanced satellite communications system to service domestic markets in the 1990's is presented. An exemplar system architecture with both RF on-board switching and demodulation/remodulation baseband processing was used to identify important issues related to system implementation, cost, and technology development

NASA SBIR abstracts of 1990 phase 1 projects

The research objectives of the 280 projects placed under contract in the National Aeronautics and Space Administration (NASA) 1990 Small Business Innovation Research (SBIR) Phase 1 program are described. The basic document consists of edited, non-proprietary abstracts of the winning proposals submitted by small businesses in response to NASA's 1990 SBIR Phase 1 Program Solicitation. The abstracts are presented under the 15 technical topics within which Phase 1 proposals were solicited. Each project was assigned a sequential identifying number from 001 to 280, in order of its appearance in the body of the report. The document also includes Appendixes to provide additional information about the SBIR program and permit cross-reference in the 1990 Phase 1 projects by company name, location by state, principal investigator, NASA field center responsible for management of each project, and NASA contract number

MScMS-II: an innovative IR-based indoor coordinate measuring system for large-scale metrology applications

According to the current great interest concerning large-scale metrology applications in many different fields of manufacturing industry, technologies and techniques for dimensional measurement have recently shown a substantial improvement. Ease-of-use, logistic and economic issues, as well as metrological performance are assuming a more and more important role among system requirements. This paper describes the architecture and the working principles of a novel infrared (IR) optical-based system, designed to perform low-cost and easy indoor coordinate measurements of large-size objects. The system consists of a distributed network-based layout, whose modularity allows fitting differently sized and shaped working volumes by adequately increasing the number of sensing units. Differently from existing spatially distributed metrological instruments, the remote sensor devices are intended to provide embedded data elaboration capabilities, in order to share the overall computational load. The overall system functionalities, including distributed layout configuration, network self-calibration, 3D point localization, and measurement data elaboration, are discussed. A preliminary metrological characterization of system performance, based on experimental testing, is also presente