Modeling of thermally induced skew variations in clock distribution network

Clock distribution network is sensitive to large thermal gradients on the die as the performance of both clock buffers and interconnects are affected by temperature. A robust clock network design relies on the accurate analysis of clock skew subject to temperature variations. In this work, we address the problem of thermally induced clock skew modeling in nanometer CMOS technologies. The complex thermal behavior of both buffers and interconnects are taken into account. In addition, our characterization of the temperature effect on buffers and interconnects provides valuable insight to designers about the potential impact of thermal variations on clock networks. The use of industrial standard data format in the interface allows our tool to be easily integrated into existing design flow

Parametric Macromodels of Digital I/O Ports

This paper addresses the development of macromodels for input and output ports of a digital device. The proposed macromodels consist of parametric representations that can be obtained from port transient waveforms at the device ports via a well established procedure. The models are implementable as SPICE subcircuits and their accuracy and efficiency are verified by applying the approach to the characterization of transistor-level models of commercial devices

Locally-Stable Macromodels of Integrated Digital Devices for Multimedia Applications

This paper addresses the development of accurate and efficient behavioral models of digital integrated circuits for the assessment of high-speed systems. Device models are based on suitable parametric expressions estimated from port transient responses and are effective at system level, where the quality of functional signals and the impact of supply noise need to be simulated. A potential limitation of some state-of-the-art modeling techniques resides in hidden instabilities manifesting themselves in the use of models, without being evident in the building phase of the same models. This contribution compares three recently-proposed model structures, and selects the local-linear state-space modeling technique as an optimal candidate for the signal integrity assessment of data links. In fact, this technique combines a simple verification of the local stability of models with a limited model size and an easy implementation in commercial simulation tools. An application of the proposed methodology to a real problem involving commercial devices and a data-link of a wireless device demonstrates the validity of this approac

Interconnect research influenced

This article shows that Rent's rule can be viewed as a fundamental law of nature with respect to electronic circuits. As there are many interpretations of the rule, this article will shed some light on the core of Rent's rule and the research that has been built on it

Transient simulation of lossy multiconductor interconnects

The transient simulation of electrically-long low-loss multiconductor interconnects is considered from a practical point of view. The importance of frequency dependent losses in these interconnects is discussed and a simple transmission line characterization procedure allowing for such losses is proposed. The characterization obtained yields simple and efficient interconnect models, that the user can include, without programming, in any simulator accepting differential operator