HIGH PERFORMANCE CLOCK DISTRIBUTION FOR HIGH-SPEED VLSI SYSTEMS

Tohoku University堀口 進課

Delay Extraction Based Equivalent Elmore Model For RLC On-Chip Interconnects

As feature sizes for VLSI technology is shrinking, associated with higher operating frequency, signal integrity analysis of on-chip interconnects has become a real challenge for circuit designers. For this purpose, computer-aided-design (CAD) tools are necessary to simulate signal propagation of on-chip interconnects which has been an active area for research. Although SPICE models exist which can accurately predict signal degradation of interconnects, they are computationally expensive. As a result, more effective and analytic models for interconnects are required to capture the response at the output of high speed VLSI circuits. This thesis contributes to the development of efficient and closed form solution models for signal integrity analysis of on-chip interconnects. The proposed model uses a delay extraction algorithm to improve the accuracy of two-pole Elmore based models used in the analysis of on-chip distributed RLC interconnects. In the proposed scheme, the time of fight signal delay is extracted without increasing the number of poles or affecting the stability of the transfer function. This algorithm is used for both unit step and ramp inputs. From the delay rational approximation of the transfer function, analytic fitted expressions are obtained for the 50% delay and rise time for unit step input. The proposed algorithm is tested on point to point interconnections and tree structure networks. Numerical examples illustrate improved 50% delay and rise time estimates when compared to traditional Elmore based two-pole models

Performance and power optimization in VLSI physical design

As VLSI technology enters the nanoscale regime, a great amount of efforts have been made to reduce interconnect delay. Among them, buffer insertion stands out as an effective technique for timing optimization. A dramatic rise in on-chip buffer density has been witnessed. For example, in two recent IBM ASIC designs, 25% gates are buffers. In this thesis, three buffer insertion algorithms are presented for the procedure of performance and power optimization. The second chapter focuses on improving circuit performance under inductance effect. The new algorithm works under the dynamic programming framework and runs in provably linear time for multiple buffer types due to two novel techniques: restrictive cost bucketing and efficient delay update. The experimental results demonstrate that our linear time algorithm consistently outperforms all known RLC buffering algorithms in terms of both solution quality and runtime. That is, the new algorithm uses fewer buffers, runs in shorter time and the buffered tree has better timing. The third chapter presents a method to guarantee a high fidelity signal transmission in global bus. It proposes a new redundant via insertion technique to reduce via variation and signal distortion in twisted differential line. In addition, a new buffer insertion technique is proposed to synchronize the transmitted signals, thus further improving the effectiveness of the twisted differential line. Experimental results demonstrate a 6GHz signal can be transmitted with high fidelity using the new approaches. In contrast, only a 100MHz signal can be reliably transmitted using a single-end bus with power/ground shielding. Compared to conventional twisted differential line structure, our new techniques can reduce the magnitude of noise by 45% as witnessed in our simulation. The fourth chapter proposes a buffer insertion and gate sizing algorithm for million plus gates. The algorithm takes a combinational circuit as input instead of individual nets and greatly reduces the buffer and gate cost of the entire circuit. The algorithm has two main features: 1) A circuit partition technique based on the criticality of the primary inputs, which provides the scalability for the algorithm, and 2) A linear programming formulation of non-linear delay versus cost tradeoff, which formulates the simultaneous buffer insertion and gate sizing into linear programming problem. Experimental results on ISCAS85 circuits show that even without the circuit partition technique, the new algorithm achieves 17X speedup compared with path based algorithm. In the meantime, the new algorithm saves 16.0% buffer cost, 4.9% gate cost, 5.8% total cost and results in less circuit delay

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

Guaranteed passive parameterized model order reduction of the partial element equivalent circuit (PEEC) method

The decrease of IC feature size and the increase of operating frequencies require 3-D electromagnetic methods, such as the partial element equivalent circuit (PEEC) method, for the analysis and design of high-speed circuits. Very large systems of equations are often produced by 3-D electromagnetic methods. During the circuit synthesis of large-scale digital or analog applications, it is important to predict the response of the system under study as a function of design parameters, such as geometrical and substrate features, in addition to frequency (or time). Parameterized model order reduction (PMOR) methods become necessary to reduce large systems of equations with respect to frequency and other design parameters. We propose an innovative PMOR technique applicable to PEEC analysis, which combines traditional passivity-preserving model order reduction methods and positive interpolation schemes. It is able to provide parametric reduced-order models, stable, and passive by construction over a user-defined range of design parameter values. Numerical examples validate the proposed approach

Power supply noise analysis for 3D ICs using through-silicon-vias

3D design is being recognized widely as the next BIG thing in system integration. However, design and analysis tools for 3D are still in infancy stage. Power supply noise analysis is one of the critical aspects of a design. Hence, the area of noise analysis for 3D designs is a key area for future development. The following research presents a new parasitic RLC modeling technique for 3D chips containing TSVs as well as a novel optimization algorithm for power-ground network of a 3D chip with the aim of minimizing noise in the network. The following work also looks into an existing commercial IR drop analysis tool and presents a way to modify it with the aim of handling 3D designs containing TSVs.M.S.Committee Chair: Lim, Sung-Kyu; Committee Member: Lee, Hsien-Hsin Sean; Committee Member: Loh, Gabrie

Computational Prototyping Tools and Techniques

Contains reports on five research projects.Industry Consortium (Mobil, Statoil, DNV Software, Shell, OTRC, Petrobras, NorskHydro, Exxon, Chevron, SAGA, NSWC)U.S. Navy - Office of Naval ResearchAnalog DevicesDefense Advanced Research Projects Agency Contract J-FBI-95-215Cadence Design SystemsHarris SemiconductorMAFET ConsortiumMotorola SemiconductorDefense Advanced Research Projects AgencyMultiuniversity Research InitiativeSemiconductor Research CorporationIBM Corporatio