High-freequency CMOS VLSI chip testability and on-chip interconnect modeling

As high-speed digital and radio-frequency mixed-signal integrated circuits become increasingly common in product designs in industry, it is important for VLSI designers to be familiar with the challenges of chip testing and the behavior of circuit elements, including on-chip interconnect, at high frequencies. Expensive, specialized test equipment and software simulation packages for high-frequency chip testing and design are not always accessible for student research. This thesis documents the setup and characterization of a best-possible environment for high-frequency chip testing and data acquisition using existing laboratory equipment and resources. Experimental methodologies and measurement results of on-chip interconnect signal integrity and delay, ring oscillator noise and timing jitter, and time-domain reflectometry (TDR) testing are presented. Methods of modeling on-chip interconnect at high frequencies using field solvers and equivalent circuits are discussed. Lastly, the designs of single-ended and differential ring oscillators, for use in future voltage-controlled oscillator (VCO) and phase-locked loop (PLL) test chip designs, are presented and analyzed

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book