Reliability and Cell-to-Cell Variability of TAS-MRAM arrays under cycling conditions

The impact of 500k write cycles on 1kbits TASMRAM arrays has been evaluated by extracting a set of characteristic parameters describing the technology in terms of cell-to cell variability and switching reliability. The relationship between switching voltages and cell resistances has been investigated in order to define the most reliable working conditions

Reliable Low-Power High Performance Spintronic Memories

Moores Gesetz folgend, ist es der Chipindustrie in den letzten fünf Jahrzehnten gelungen, ein explosionsartiges Wachstum zu erreichen. Dies hatte ebenso einen exponentiellen Anstieg der Nachfrage von Speicherkomponenten zur Folge, was wiederum zu speicherlastigen Chips in den heutigen Computersystemen führt. Allerdings stellen traditionelle on-Chip Speichertech- nologien wie Static Random Access Memories (SRAMs), Dynamic Random Access Memories (DRAMs) und Flip-Flops eine Herausforderung in Bezug auf Skalierbarkeit, Verlustleistung und Zuverlässigkeit dar. Eben jene Herausforderungen und die überwältigende Nachfrage nach höherer Performanz und Integrationsdichte des on-Chip Speichers motivieren Forscher, nach neuen nichtflüchtigen Speichertechnologien zu suchen. Aufkommende spintronische Spe- ichertechnologien wie Spin Orbit Torque (SOT) und Spin Transfer Torque (STT) erhielten in den letzten Jahren eine hohe Aufmerksamkeit, da sie eine Reihe an Vorteilen bieten. Dazu gehören Nichtflüchtigkeit, Skalierbarkeit, hohe Beständigkeit, CMOS Kompatibilität und Unan- fälligkeit gegenüber Soft-Errors. In der Spintronik repräsentiert der Spin eines Elektrons dessen Information. Das Datum wird durch die Höhe des Widerstandes gespeichert, welche sich durch das Anlegen eines polarisierten Stroms an das Speichermedium verändern lässt. Das Prob- lem der statischen Leistung gehen die Speichergeräte sowohl durch deren verlustleistungsfreie Eigenschaft, als auch durch ihr Standard- Aus/Sofort-Ein Verhalten an. Nichtsdestotrotz sind noch andere Probleme, wie die hohe Zugriffslatenz und die Energieaufnahme zu lösen, bevor sie eine verbreitete Anwendung finden können. Um diesen Problemen gerecht zu werden, sind neue Computerparadigmen, -architekturen und -entwurfsphilosophien notwendig. Die hohe Zugriffslatenz der Spintroniktechnologie ist auf eine vergleichsweise lange Schalt- dauer zurückzuführen, welche die von konventionellem SRAM übersteigt. Des Weiteren ist auf Grund des stochastischen Schaltvorgangs der Speicherzelle und des Einflusses der Prozessvari- ation ein nicht zu vernachlässigender Zeitraum dafür erforderlich. In diesem Zeitraum wird ein konstanter Schreibstrom durch die Bitzelle geleitet, um den Schaltvorgang zu gewährleisten. Dieser Vorgang verursacht eine hohe Energieaufnahme. Für die Leseoperation wird gleicher- maßen ein beachtliches Zeitfenster benötigt, ebenfalls bedingt durch den Einfluss der Prozess- variation. Dem gegenüber stehen diverse Zuverlässigkeitsprobleme. Dazu gehören unter An- derem die Leseintereferenz und andere Degenerationspobleme, wie das des Time Dependent Di- electric Breakdowns (TDDB). Diese Zuverlässigkeitsprobleme sind wiederum auf die benötigten längeren Schaltzeiten zurückzuführen, welche in der Folge auch einen über längere Zeit an- liegenden Lese- bzw. Schreibstrom implizieren. Es ist daher notwendig, sowohl die Energie, als auch die Latenz zur Steigerung der Zuverlässigkeit zu reduzieren, um daraus einen potenziellen Kandidaten für ein on-Chip Speichersystem zu machen. In dieser Dissertation werden wir Entwurfsstrategien vorstellen, welche das Ziel verfolgen, die Herausforderungen des Cache-, Register- und Flip-Flop-Entwurfs anzugehen. Dies erre- ichen wir unter Zuhilfenahme eines Cross-Layer Ansatzes. Für Caches entwickelten wir ver- schiedene Ansätze auf Schaltkreisebene, welche sowohl auf der Speicherarchitekturebene, als auch auf der Systemebene in Bezug auf Energieaufnahme, Performanzsteigerung und Zuver- lässigkeitverbesserung evaluiert werden. Wir entwickeln eine Selbstabschalttechnik, sowohl für die Lese-, als auch die Schreiboperation von Caches. Diese ist in der Lage, den Abschluss der entsprechenden Operation dynamisch zu ermitteln. Nachdem der Abschluss erkannt wurde, wird die Lese- bzw. Schreiboperation sofort gestoppt, um Energie zu sparen. Zusätzlich limitiert die Selbstabschalttechnik die Dauer des Stromflusses durch die Speicherzelle, was wiederum das Auftreten von TDDB und Leseinterferenz bei Schreib- bzw. Leseoperationen re- duziert. Zur Verbesserung der Schreiblatenz heben wir den Schreibstrom an der Bitzelle an, um den magnetischen Schaltprozess zu beschleunigen. Um registerbankspezifische Anforderungen zu berücksichtigen, haben wir zusätzlich eine Multiport-Speicherarchitektur entworfen, welche eine einzigartige Eigenschaft der SOT-Zelle ausnutzt, um simultan Lese- und Schreiboperatio- nen auszuführen. Es ist daher möglich Lese/Schreib- Konfilkte auf Bitzellen-Ebene zu lösen, was sich wiederum in einer sehr viel einfacheren Multiport- Registerbankarchitektur nieder- schlägt. Zusätzlich zu den Speicheransätzen haben wir ebenfalls zwei Flip-Flop-Architekturen vorgestellt. Die erste ist eine nichtflüchtige non-Shadow Flip-Flop-Architektur, welche die Speicherzelle als aktive Komponente nutzt. Dies ermöglicht das sofortige An- und Ausschalten der Versorgungss- pannung und ist daher besonders gut für aggressives Powergating geeignet. Alles in Allem zeigt der vorgestellte Flip-Flop-Entwurf eine ähnliche Timing-Charakteristik wie die konventioneller CMOS Flip-Flops auf. Jedoch erlaubt er zur selben Zeit eine signifikante Reduktion der statis- chen Leistungsaufnahme im Vergleich zu nichtflüchtigen Shadow- Flip-Flops. Die zweite ist eine fehlertolerante Flip-Flop-Architektur, welche sich unanfällig gegenüber diversen Defekten und Fehlern verhält. Die Leistungsfähigkeit aller vorgestellten Techniken wird durch ausführliche Simulationen auf Schaltkreisebene verdeutlicht, welche weiter durch detaillierte Evaluationen auf Systemebene untermauert werden. Im Allgemeinen konnten wir verschiedene Techniken en- twickeln, die erhebliche Verbesserungen in Bezug auf Performanz, Energie und Zuverlässigkeit von spintronischen on-Chip Speichern, wie Caches, Register und Flip-Flops erreichen

STT-MRAM characterization and its test implications

Spin torque transfer (STT)-magnetoresistive random-access memory (MRAM) has come a long way in research to meet the speed and power consumption requirements for future memory applications. The state-of-the-art STT-MRAM bit-cells employ magnetic tunnel junction (MTJ) with perpendicular magnetic anisotropy (PMA). The process repeatabil- ity and yield stability for wafer fabrication are some of the critical issues encountered in STT-MRAM mass production. Some of the yield improvement techniques to combat the e ect of process variations have been previously explored. However, little research has been done on defect oriented testing of STT-MRAM arrays. In this thesis, the author investi- gates the parameter deviation and non-idealities encountered during the development of a novel MTJ stack con guration. The characterization result provides motivation for the development of the design for testability (DFT) scheme that can help test and characterize STT-MRAM bit-cells and the CMOS peripheral circuitry e ciently. The primary factors for wafer yield degradation are the device parameter variation and its non-uniformity across the wafer due to the fabrication process non-idealities. There- fore, e ective in-process testing strategies for exploring and verifying the impact of the parameter variation on the wafer yield will be needed to achieve fabrication process opti- mization. While yield depends on the CMOS process variability, quality of the deposited MTJ lm, and other process non-idealities, test platform can enable parametric optimiza- tion and veri cation using the CMOS-based DFT circuits. In this work, we develop a DFT algorithm and implement a DFT circuit for parametric testing and prequali cation of the critical circuits in the CMOS wafer. The DFT circuit successfully replicates the electrical characteristics of MTJ devices and captures their spatial variation across the wafer with an error of less than 4%. We estimate the yield of the read sensing path by implement- ing the DFT circuit, which can replicate the resistance-area product variation up to 50% from its nominal value. The yield data from the read sensing path at di erent wafer loca- tions are analyzed, and a usable wafer radius has been estimated. Our DFT scheme can provide quantitative feedback based on in-die measurement, enabling fabrication process optimization through iterative estimation and veri cation of the calibrated parameters. Another concern that prevents mass production of STT-MRAM arrays is the defect formation in MTJ devices due to aging. Identifying manufacturing defects in the magnetic tunnel junction (MTJ) device is crucial for the yield and reliability of spin-torque-transfer (STT) magnetic random-access memory (MRAM) arrays. Several of the MTJ defects result in parametric deviations of the device that deteriorate over time. We extend our work on the DFT scheme by monitoring the electrical parameter deviations occurring due to the defect formation over time. A programmable DFT scheme was implemented for a sub-arrayin 65 nm CMOS technology to evaluate the feasibility of the test scheme. The scheme utilizes the read sense path to compare the bit-cell electrical parameters against known DFT cells characteristics. Built-in-self-test (BIST) methodology is utilized to trigger the onset of the fault once the device parameter crosses a threshold value. We demonstrate the operation and evaluate the accuracy of detection with the proposed scheme. The DFT scheme can be exploited for monitoring aging defects, modeling their behavior and optimization of the fabrication process. DFT scheme could potentially nd numerous applications for parametric characteriza- tion and fault monitoring of STT-MRAM bit-cell arrays during mass production. Some of the applications include a) Fabrication process feedback to improve wafer turnaround time, b) STT-MRAM bit-cell health monitoring, c) Decoupled characterization of the CMOS pe- ripheral circuitry such as read-sensing path and sense ampli er characterization within the STT-MRAM array. Additionally, the DFT scheme has potential applications for detec- tion of fault formation that could be utilized for deploying redundancy schemes, providing a graceful degradation in MTJ-based bit-cell array due to aging of the device, and also providing feedback to improve the fabrication process and yield learning

Addressing the RRAM Reliability and Radiation Soft-Errors in the Memory Systems

With the continuous and aggressive technology scaling, the design of memory systems becomes very challenging. The desire to have high-capacity, reliable, and energy efficient memory arrays is rising rapidly. However, from the technology side, the increasing leakage power and the restrictions resulting from the manufacturing limitations complicate the design of memory systems. In addition to this, with the new machine learning applications, which require tremendous amount of mathematical operations to be completed in a timely manner, the interest in neuromorphic systems has increased in recent years. Emerging Non- Volatile Memory (NVM) devices have been suggested to be incorporated in the design of memory arrays due to their small size and their ability to reduce leakage power since they can retain their data even in the absence of power supply. Compared to other novel NVM devices, the Resistive Random Access Memory (RRAM) device has many advantages including its low-programming requirements, the large ratio between its high and low resistive states, and its compatibility with the Complementary Metal Oxide Semiconductor (CMOS) fabrication process. RRAM device suffers from other disadvantages including the instability in its switching dynamics and its sensitivity to process variations. Yet, one of the popular issues hindering the deployment of RRAM arrays in products are the RRAM reliability and radiation soft-errors. The RRAM reliability soft-errors result from the diffusion of oxygen vacations out of the conductive channels within the oxide material of the device. On the other hand, the radiation soft-errors are caused by the highly energetic cosmic rays incident on the junction of the MOS device used as a selector for the RRAM cell. Both of those soft-errors cause the unintentional change of the resistive state of the RRAM device. While there is research work in literature to address some of the RRAM disadvantages such as the switching dynamic instability, there is no dedicated work discussing the impact of RRAM soft-errors on the various designs to which the RRAM device is integrated and how the soft-errors can be automatically detected and fixed. In this thesis, we bring the attention to the need of considering the RRAM soft-errors to avoid the degradation in design performance. In addition to this, using previously reported SPICE models, which were experimentally verified, and widely adapted system level simulators and test benches, various solutions are provided to automatically detect and fix the degradation in design performance due to the RRAM soft-errors. The main focus in this work is to propose methodologies which solve or improve the robustness of memory systems to the RRAM soft-errors. These memories are expected to be incorporated in the current and futuristic platforms running the advanced machine learning applications. In more details, the main contributions of this thesis can be summarized as: - Provide in depth analysis of the impact of RRAM soft-errors on the performance of RRAM-based designs. - Provide a new SRAM cell which uses the RRAM device to reduce the SRAM leakage power with minimal impact on its read and write operations. This new SRAM cell can be incorporated in the Graphical Processing Unit (GPU) design used currently in the implementation of the machine learning platforms. - Provide a circuit and system solutions to resolve the reliability and radiation soft-errors in the RRAM arrays. These solution can automatically detect and fix the soft-errors with minimum impact on the delay and energy consumption of the memory array. - A framework is developed to estimate the effect of RRAM soft-errors on the performance of RRAM-based neuromorphic systems. This actually provides, for the first time, a very generic methodology through which the device level RRAM soft-errors are mapped to the overall performance of the neuromorphic systems. Our analysis show that the accuracy of the RRAM-based neuromorphic system can degrade by more than 48% due to RRAM soft-errors. - Two algorithms are provided to automatically detect and restore the degradation in RRAM-based neuromorphic systems due to RRAM soft-errors. The system and circuit level techniques to implement these algorithms are also explained in this work. In conclusion, this work offers initial steps for enabling the usage of RRAM devices in products by tackling one of its most known challenges: RRAM reliability and radiation soft-errors. Despite using experimentally verified SPICE models and widely popular system simulators and test benches, the provided solutions in this thesis need to be verified in the future work through fabrication to study the impact of other RRAM technology shortcomings including: a) the instability in its switching dynamics due to the stochastic nature of oxygen vacancies movement, and b) its sensitivity to process variations

Optimization of spin-orbit magnetic-state readout in metallic nanodevices

183 p.This thesis presents the first steps of the optimization of the magnetic-state readout component for the envisioned magneto-electric spin-orbit (MESO) logic device. We established that (i) reducing the device dimension of ferromagnetic materials/ strong spin-orbit coupling non-magnetic materials nanostructured devices leads to an enhancement of the output signals; (ii) spurious effects in the device due to the local configuration can be avoided by proper design of the ferromagnetic and spin-orbit coupling material electrodes; (iii) interface properties and interfacial spin-charge interconversion have to be carefully considered when studying spin transport in metallic devices and such interface might be applicable for the MESO-logic devices. Even tough, we did not achieve the required values for the realization of cascaded gates with MESO devices, we did find a guideline for further improvement of the output signals. Besides the independent scaling laws for voltage and charge output signals, the use of other materials systems with large spin-charge interconversion efficiency and high resistivities seems to be promising for enhanced output signal. Further experiments are required to demonstrate the use of our device as a curren