Enhancing MB-OFDM throughput with dual circular 32-QAM

Quadrature Phase Shift Keying (QPSK) and Dual Carrier Modulation (DCM) are currently used as the modulation schemes for Multiband Orthogonal Frequency Division Multiplexing (MB-OFDM) in the ECMA-368 defined Ultra-Wideband (UWB) radio platform. ECMA-368 has been chosen as the physical radio platform for many systems including Wireless USB (W-USB), Bluetooth 3.0 and Wireless HDMI; hence ECMA-368 is an important issue to consumer electronics and the users experience of these products. To enable the transport of high-rate USB, ECMA-368 offers up to 480 Mb/s instantaneous bit rate to the Medium Access Control (MAC) layer, but depending on radio channel conditions dropped packets unfortunately result in a lower throughput. This paper presents an alternative high data rate modulation scheme that fits within the configuration of the current standard increasing system throughput by achieving 600 Mb/s (reliable to 3.1 meters) thus maintaining the high rate USB throughput even with a moderate level of dropped packets. The modulation system is termed Dual Circular 32-QAM (DC 32-QAM). The system performance for DC 32-QAM modulation is presented and compared with 16-QAM and DCM1

Robust and scalable matching pursuits video transmission using the Bluetooth air interface standard

This paper introduces an error resilient implementation of the matching pursuits algorithm for video coding. The video bitstream is transmitted using a simulation of the Bluetooth air interface standard, which recommends ARQ as a means of overcoming channel errors in the data packets. This approach may be unsuitable for real time and broadcast applications. Therefore, a modified receiver is proposed in this paper, which does not request the retransmission of erroneous packets, but instead passes them to the video decoder to exploit error resilience. This strategy is shown to be superior to a standard compliant system if ARQ cannot be applied. The work confirms that wireless communication standards should support a transparent mode for video applications

No-reference bitstream-based visual quality impairment detection for high definition H.264/AVC encoded video sequences

Ensuring and maintaining adequate Quality of Experience towards end-users are key objectives for video service providers, not only for increasing customer satisfaction but also as service differentiator. However, in the case of High Definition video streaming over IP-based networks, network impairments such as packet loss can severely degrade the perceived visual quality. Several standard organizations have established a minimum set of performance objectives which should be achieved for obtaining satisfactory quality. Therefore, video service providers should continuously monitor the network and the quality of the received video streams in order to detect visual degradations. Objective video quality metrics enable automatic measurement of perceived quality. Unfortunately, the most reliable metrics require access to both the original and the received video streams which makes them inappropriate for real-time monitoring. In this article, we present a novel no-reference bitstream-based visual quality impairment detector which enables real-time detection of visual degradations caused by network impairments. By only incorporating information extracted from the encoded bitstream, network impairments are classified as visible or invisible to the end-user. Our results show that impairment visibility can be classified with a high accuracy which enables real-time validation of the existing performance objectives

An Initial study on The Reliability of Power Semiconductor Devices

An initial literature study combined with some basic comparative simulations has been performed on different electricfield modulation techniques and the subsequent reliability issues are reported for power semiconductor devices. An explanation of the most important power device metrics such as the offstate breakdown (BV) and specific on-resistance (RON) will be given, followed by a short overview of some of the electrostatic techniques (fieldplates, RESURF e.g. [1]) used to suppress peak electric fields. Furthermore it will be addressed that the high current operation of these devices results in shifting electric field peaks (Kirk effect [2], [3]) and as such different avalanche behavior, resulting in (gate oxide) reliability issues unlike those of conventional CMOS

A review of stencil printing for microelectronic packaging

PurposeThe purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging.Design/methodology/approachThis paper gives a thorough review of stencil printing for electronic packaging including the current state of the art.FindingsThis article explains the different stencil technologies and printing materials. It then examines the various factors that determine the outcome of a successful printing process, including printing parameters, materials, apparatus and squeegees. Relevant technical innovations in the art of stencil printing for microelectronics packaging are examined as each part of the printing process is explained.Originality/valueStencil printing is currently the cheapest and highest throughput technique to create the mechanical and electrically conductive connections between substrates, bare die, packaged chips and discrete components. As a result, this process is used extensively in the electronic packaging industry and therefore such a review paper should be of interest to a large selection of the electronics interconnect and assembly community.</jats:sec