4 research outputs found

    Pengenalan Multi Wajah Berdasarkan Klasifikasi Kohonen SOM Dioptimalkan dengan Algoritma Discriminant Analysis PCA

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    Face recognition is a process of identification with the image has variations changeable can be recognized, needs a method of optimization to minimize computational time by not affecting the classification results. This research proposes a face recognition system are directly based on Kohonen SOM classification that optimized by the method of Discriminant Analysis based Principal Component Analysis (PCA). Evaluation of PCA’s extraction performance uses two approaches, first the LDA method to optimize PCA issues of the election of irrelevant features of the dataset and the second approach is to apply a kernel function on the LDA (KDA), the results of both approaches are applied on face image classification for Kohonen directly. The testing is two phases, the first stage is testing with a single image of a face and then multi face. Based on the results of testing one face image, both of the approached feature extraction that proposed is very accurately be applied to the classification of the Kohonen SOM with the accurate value of the second approach PCA-KDA is more accurate with 94.22% and the first approach 93.91%, however on the first approach is faster than the second approach with the accurate value of time 0.4 seconds for PCA-LDA and 0.5 seconds to PCA-KDA to one image of the face, but while testing of multi face more two images the result is not significant. Keywords: Face recognition, Feature extraction, Kohonen SOM

    On-line quality monitoring and lifetime prediction of thick Al wire bonds using signals obtained from ultrasonic generator

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    Abstract The reliable performance of power electronic modules has been a concern for many years due to their increased use in applications which demand high availability and longer lifetimes. Thick Al wire bonding is a key technique for providing interconnections in power electronic modules. Today, wire bond lift-off and heel cracking are often considered the most lifetime limiting factors of power electronic modules as a result of cyclic thermomechanical stresses. Therefore, it is important for power electronic packaging manufacturers to address this issue at the design stage and on the manufacturing line. Techniques for the non-destructive, real-time evaluation and control of wire bond quality have been proposed to detect defects in manufacture and predict reliability prior to in-service exposure. This approach has the potential to improve the accuracy of lifetime prediction for the manufactured product. In this thesis, a non-destructive technique for detecting bond quality by the application of a semi-supervised classification algorithm to process signals obtained from an ultrasonic generator is presented. Experimental tests verified that the classification method is capable of accurately predicting bond quality, indicated by bonded area as measured by X-ray tomography. Samples classified during bonding were subjected to both passive and active cycling and the distribution of bond life amongst the different classes analysed. It is demonstrated that the as-bonded quality classification is closely correlated with cycling life and can therefore be used as a non-destructive tool for monitoring bond quality and predicting useful service life

    On-line quality monitoring and lifetime prediction of thick Al wire bonds using signals obtained from ultrasonic generator

    Get PDF
    Abstract The reliable performance of power electronic modules has been a concern for many years due to their increased use in applications which demand high availability and longer lifetimes. Thick Al wire bonding is a key technique for providing interconnections in power electronic modules. Today, wire bond lift-off and heel cracking are often considered the most lifetime limiting factors of power electronic modules as a result of cyclic thermomechanical stresses. Therefore, it is important for power electronic packaging manufacturers to address this issue at the design stage and on the manufacturing line. Techniques for the non-destructive, real-time evaluation and control of wire bond quality have been proposed to detect defects in manufacture and predict reliability prior to in-service exposure. This approach has the potential to improve the accuracy of lifetime prediction for the manufactured product. In this thesis, a non-destructive technique for detecting bond quality by the application of a semi-supervised classification algorithm to process signals obtained from an ultrasonic generator is presented. Experimental tests verified that the classification method is capable of accurately predicting bond quality, indicated by bonded area as measured by X-ray tomography. Samples classified during bonding were subjected to both passive and active cycling and the distribution of bond life amongst the different classes analysed. It is demonstrated that the as-bonded quality classification is closely correlated with cycling life and can therefore be used as a non-destructive tool for monitoring bond quality and predicting useful service life

    IEEE Transactions On Circuits And Systems For Video Technology : Vol. 24, No. 2, February 2014

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    1. Property analysis of XOR-Based visual cryptography. 2. Multiscale saliency detection using random walk with restart. 3. How to estimate the regularization parameter for spectral regression discriminant analysis and its kernel version? 4. Adaptive weight allocation-based subpixel rendering algorithm. 5. A Framework for making face detection benchmark databases. 6. Robust visual tracking via multiple kernel boosting with affinity constraints. 7. Voting-based directional interpolation method and its application to still color image demosaicking. 8. Detecting human action as the spatio-temporal tube of maximum mutual information. 9. Event detection and summarization in soccer videos using bayesian network and copula. 10. An overview of information hiding in H.264/AVC Compressed video. 11. A Novel no-reference PSNR estimation method with regrad to deblocking filtering effect in H.264/AVC bitstreams. 12. Wireless scalable video coding using a hybrid digital-analog scheme. Etc
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