A Hierachical Infrastrucutre for SOC Test Management

HD2BIST - a complete hierarchical framework for BIST scheduling, data-patterns delivery, and diagnosis of complex systems - maximizes and simplifies the reuse of built-in test architectures. HD2BIST optimizes the flexibility for chip designers in planning an overall SoC test strategy by defining a test access method that provides direct virtual access to each core of the system

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

Conception d'un système de test et de configuration numérique tolérant aux pannes pour la technologie WAFERIC

RÉSUMÉ L’objectif principal du projet de recherche est de concevoir, implanter et vérifier un système de programmation JTAG tolérant aux pannes pour un circuit intégré à l'échelle de la tranche (WSIC, Wafer Scale Integrated Circuit). Le projet comprend la conception de l'interface logicielle/matérielle, l'implantation en VHDL du système, la conception de l'environnement de vérification SystemC ainsi qu’une étude sur la “diagnosabilité” du WaferIC un circuit WSIC au cœur d’un système configurable applicable au prototypage rapide. Une nouvelle approche face à la conception de bancs de test programmable pour le test de circuits numériques est en cours de développement dans plusieurs universités québécoises, dont l’École Polytechnique Montréal dans le cadre du projet “DreamWaferTM”. Ce nouveau système de prototypage rapide de circuits numériques a pour but de mettre au point un réseau intégré d'interconnexions configurables, nommé WaferNet. Ce réseau d'interconnexions est déployé sur un circuit intégré à l'échelle de la tranche. Ainsi, le projet “DreamWaferTM” vise à développer un système équivalent à un “PCB reconfigurable” permettant de prototyper des circuits intégrés numériques discrets (FPGA, processeurs, DSP…), ceux-ci étant déposés à sa surface. Ce circuit intégré contient une matrice comportant des milliers de cellules identiques, chacune comportant un centre de contrôle logique, un crossbar configurable et un ensemble de “plots“ de quelques dizaines de micromètres de large (points de contact avec les composants déposés). Cette matrice de cellules se nomme le WaferIC. Ce projet de maîtrise porte spécifiquement sur la conception d’un système de configuration tolérant aux pannes pour le WaferIC, en la mise au point d’un environnement de simulation et de vérification matérielle codé en SystemC et en VHDL, à concevoir l’interface logicielle/matérielle pour le contrôle de la configuration basée sur le protocole JTAG et la conception d’une méthodologie de test et de diagnostic du système de configuration et du WaferNet. La tolérance aux pannes est importante dans le cadre de cette application spécifique pour des raisons économiques et pour atteindre le niveau de qualité requis pour cette application.------------------ABSTRACT The goal of this master project is to design, implement and validate a new system able to control the WaferIC, a Wafer Scale Integrated Circuit (WSIC). More specifically, the project objective was to design the software/hardware interface, design and implement an embedded fault-tolerant control system and implement from scratch an environment in SystemC for functional verification. Moreover, the ASIC synthesis is applied on the VHDL code to fabricate a test chip to validate the circuit. A new approach for rapid prototyping of digital systems is in development at several universities, including École Polytechnique de Montréal, through the “DreamWaferTM” project. The goal of this new system is to interconnect all the digital pins of a set of discrete chip at the system level by using a reconfigurable network called WaferNet. This interconnection network is deployed over the active surface of a whole wafer. This wafer scale integrated system called WaferIC aims at implementing a form of reconfigurable PCB that is able to reconnect the digital pins of discrete chips at will. User’s ICs deposited on the active surface of the wafer are detected by an array of tiny reconfigurable “NanoPads” that can redirect the signals in the WaferIC’s internal network or feed the user’s IC pins with data and power. The specific contribution of this master project consists of designing a fault-tolerant system to test and configure the WaferIC, to implement a verification environment coded in a mixed language SystemC/VHDL. This environment implements a software/hardware interface for the WaferIC and the design of a new test and diagnosis methodology for the reconfigurable network. Fault tolerance is an important issue for this class of circuit for economic reasons, and to reach the quality required for this application