Gadolinium oxide nanocrystal nonvolatile memory with HfO2/Al2O3 nanostructure tunneling layers

In this study, Gd2O3 nanocrystal (Gd2O3-NC) memories with nanostructure tunneling layers are fabricated to examine their performance. A higher programming speed for Gd2O3-NC memories with nanostructure tunneling layers is obtained when compared with that of memories using a single tunneling layer. A longer data retention (< 15% charge loss after 104 s) is also observed. This is due to the increased physical thickness of the nanostructure tunneling layer. The activation energy of charge loss at different temperatures is estimated. The higher activation energy value (0.13 to 0.17 eV) observed at the initial charge loss stage is attributed to the thermionic emission mechanism, while the lower one (0.07 to 0.08 eV) observed at the later charge loss stage is attributed to the direct tunneling mechanism. Gd2O3-NC memories with nanostructure tunneling layers can be operated without degradation over several operation cycles. Such NC structures could potentially be used in future nonvolatile memory applications

Charge-Trapping Characteristics of BaTiO3 with and without Nitridation for Nonvolatile Memory Applications

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Nitrided La 2O 3 as charge-trapping layer for nonvolatile memory applications

Charge-trapping characteristics of La 2O 3 with and without nitrogen incorporation were investigated based on Al/Al 2O 3/La 2O 3/SiO 2Si (MONOS) capacitors. The physical properties of the high-k films were analyzed by X-ray diffraction and X-ray photoelectron spectroscopy. Compared with the MONOS capacitor with La 2O 3 as charge-trapping layer, the one with nitrided La 2O 3 showed a larger memory window (4.9 V at ±10-V sweeping voltage), higher program speed (4.9 V at 1-ms +14 V), and smaller charge loss (27% after 10 years), due to the nitrided La 2O 3 film exhibiting less crystallized structure and high trap density induced by nitrogen incorporation, and suppressed leakage by nitrogen passivation. © 2012 IEEE.published_or_final_versio

Memristive Non-Volatile Memory Based on Graphene Materials

Resistive random access memory (RRAM), which is considered as one of the most promising next-generation non-volatile memory (NVM) devices and a representative of memristor technologies, demonstrated great potential in acting as an artificial synapse in the industry of neuromorphic systems and artificial intelligence (AI), due its advantages such as fast operation speed, low power consumption, and high device density. Graphene and related materials (GRMs), especially graphene oxide (GO), acting as active materials for RRAM devices, are considered as a promising alternative to other materials including metal oxides and perovskite materials. Herein, an overview of GRM-based RRAM devices is provided, with discussion about the properties of GRMs, main operation mechanisms for resistive switching (RS) behavior, figure of merit (FoM) summary, and prospect extension of GRM-based RRAM devices. With excellent physical and chemical advantages like intrinsic Young’s modulus (1.0 TPa), good tensile strength (130 GPa), excellent carrier mobility (2.0 × 105 cm2∙V−1∙s−1), and high thermal (5000 Wm−1∙K−1) and superior electrical conductivity (1.0 × 106 S∙m−1), GRMs can act as electrodes and resistive switching media in RRAM devices. In addition, the GRM-based interface between electrode and dielectric can have an effect on atomic diffusion limitation in dielectric and surface effect suppression. Immense amounts of concrete research indicate that GRMs might play a significant role in promoting the large-scale commercialization possibility of RRAM devices

Resistance switching of electrodeposited cuprous oxide

In this work, the resistance switching behavior of electrodeposited cuprous oxide (Cu2O) thin films in Au/Cu2O/top electrode (Pt, Au-Pd, Al) cells was studied. After an initial FORMING process, the fabricated cells show reversible switching between a low resistance state (16.6 Ω) and a high resistance state (0.4 x 106 Ω). Changing the resistance states in cuprous oxide films depends on the magnitude of the applied voltage which corresponds to unipolar resistance switching behavior of this material. The endurance and retention tests indicate a potential application of the fabricated cells for nonvolatile resistance switching random access memory (RRAM). The results suggest formation and rupture of one or several nanoscale copper filaments as the resistance switching mechanism in the cuprous oxide films. At high electric voltage in the as-deposited state of Au/Cu2O/Au-Pd cell structure, the conduction behavior follows Poole-Frenkel emission. Various parameters, such as the compliance current, the cuprous oxide microstructure, the cuprous oxide thickness, top electrode area, and top electrode material, affect the resistance switching characteristics. The required FORMING voltage is higher for Au/Cu2O/Al cell compared with the Au/Cu2O/Pt which is related to the Schottky behavior of Al contact with Cu2O. Cu2O nanowires in Au-Pt/ Cu2O/Au-Pt cell also show resistance switching behavior, indicating scalable potential of this cell for usage as RRAM. After an initial FORMING process under an electric field of 3 x 106 V/m, the Cu2O nanowire is switched to the LRS. During the FORMING process physical damages are observed in the cell, which may be caused by Joule heating and gas evolution --Abstract, page iii