Impact of quantum confinement on transport and the electrostatic driven performance of silicon nanowire transistors at the scaling limit

In this work we investigate the impact of quantum mechanical effects on the device performance of n-type silicon nanowire transistors (NWT) for possible future CMOS applications at the scaling limit. For the purpose of this paper, we created Si NWTs with two channel crystallographic orientations <110> and <100> and six different cross-section profiles. In the first part, we study the impact of quantum corrections on the gate capacitance and mobile charge in the channel. The mobile charge to gate capacitance ratio, which is an indicator of the intrinsic performance of the NWTs, is also investigated. The influence of the rotating of the NWTs cross-sectional geometry by 90o on charge distribution in the channel is also studied. We compare the correlation between the charge profile in the channel and cross-sectional dimension for circular transistor with four different cross-sections diameters: 5nm, 6nm, 7nm and 8nm. In the second part of this paper, we expand the computational study by including different gate lengths for some of the Si NWTs. As a result, we establish a correlation between the mobile charge distribution in the channel and the gate capacitance, drain-induced barrier lowering (DIBL) and the subthreshold slope (SS). All calculations are based on a quantum mechanical description of the mobile charge distribution in the channel. This description is based on the solution of the Schrödinger equation in NWT cross sections along the current path, which is mandatory for nanowires with such ultra-scale dimensions

Engineering Nanowire n-MOSFETs at Lg < 8 nm

As metal-oxide-semiconductor field-effect transistors (MOSFET) channel lengths (Lg) are scaled to lengths shorter than Lg<8 nm source-drain tunneling starts to become a major performance limiting factor. In this scenario a heavier transport mass can be used to limit source-drain (S-D) tunneling. Taking InAs and Si as examples, it is shown that different heavier transport masses can be engineered using strain and crystal orientation engineering. Full-band extended device atomistic quantum transport simulations are performed for nanowire MOSFETs at Lg<8 nm in both ballistic and incoherent scattering regimes. In conclusion, a heavier transport mass can indeed be advantageous in improving ON state currents in ultra scaled nanowire MOSFETs.Comment: 6 pages, 7 figures, journa

Impact of randomly distributed dopants on Ω-gate junctionless silicon nanowire transistors

This paper presents experimental and simulation analysis of an Ω-shaped silicon junctionless nanowire field-effect transistor (JL-NWT) with gate lengths of 150 nm and diameter of the Si channel of 8 nm. Our experimental measurements reveal that the ON-currents up to 1.15 mA/μm for 1.0 V and 2.52 mA/μm for the 1.8-V gate overdrive with an OFF-current set at 100 nA/μm. Also, the experiment data reveal more than eight orders of magnitude ON-current to OFF-current ratios and an excellent subthreshold slope of 66 mV/dec recorded at room temperature. The obtained experimental current-voltage characteristics are used as a reference point to calibrate the simulations models used in this paper. Our simulation data show good agreement with the experimental results. All simulations are based on drift-diffusion formalism with activated density gradient quantum corrections. Once the simulations methodology is established, the simulations are calibrated to the experimental data. After this, we have performed statistical numerical experiments of a set of 500 different JL-NWTs. Each device has a unique random distribution of the discrete dopants within the silicon body. From those statistical simulations, we extracted important figures of merit, such as OFF-current and ON-current, subthreshold slope, and voltage threshold. The performed statistical analysis, on samples of those 500 JL-NWTs, shows that the mean ID-VGs characteristic is in excellent agreement with the experimental measurements. Moreover, the mean ID-VGs characteristic reproduces better the subthreshold slope data obtained from the experiment in comparison to the continuous model simulation. Finally, performance predictions for the JL transistor with shorter gate lengths and thinner oxide regions are carried out. Among the simulated JL transistors, the configuration with 25-nm gate length and 2-nm oxide thickness shows the most promising characteristics offering scalable designs

Full 3D Quantum Transport Simulation of Atomistic Interface Roughness in Silicon Nanowire FETs

The influence of interface roughness scattering (IRS) on the performances of silicon nanowire field-effect transistors (NWFETs) is numerically investigated using a full 3D quantum transport simulator based on the atomistic sp3d5s* tight-binding model. The interface between the silicon and the silicon dioxide layers is generated in a real-space atomistic representation using an experimentally derived autocovariance function (ACVF). The oxide layer is modeled in the virtual crystal approximation (VCA) using fictitious SiO2 atoms. -oriented nanowires with different diameters and randomly generated surface configurations are studied. The experimentally observed ON-current and the threshold voltage is quantitatively captured by the simulation model. The mobility reduction due to IRS is studied through a qualitative comparison of the simulation results with the experimental results

Simulation study of vertically stacked lateral Si nanowires transistors for 5 nm CMOS applications

In this paper we present a simulation study of vertically stacked lateral nanowires transistors (NWTs), which may have applications at 5nm CMOS technology. Our simulation approach is based on a collection of simulation techniques to capture the complexity in such ultra-scaled devices. Initially, we used drift-diffusion methodology with activated Poisson-Schrodinger quantum corrections to accurately capture the quantum confinement in the cross-section of the device. Ensemble Monte Carlo simulations are used to accurately evaluate the drive current capturing the complexity of the carrier transport in the NWTs. We compared the current flow in single, double, and triple vertically stacked lateral NWTs with and without contact resistance. The results presented here suggest a consistent link between channel strain and device performance. Furthermore, we propose a device structure for the 5nm CMOS technology node that meets the required industry scaling projection. We also consider the interplay between various sources of statistical variability and reliability in this work

Impact of precisely positioned dopants on the performance of an ultimate silicon nanowire transistor: a full three-dimensional NEGF simulation study

In this paper, we report the first systematic study of quantum transport simulation of the impact of precisely positioned dopants on the performance of ultimately scaled gate-all-around silicon nanowire transistors (NWTs) designed for digital circuit applications. Due to strong inhomogeneity of the selfconsistent electrostatic potential, a full 3-D real-space nonequilibrium Green function formalism is used. The simulations are carried out for an n-channel NWT with 2.2 × 2.2 nm2 cross section and 6-nm channel length, where the locations of the precisely arranged dopants in the source-drain extensions and in the channel region have been varied. The individual dopants act as localized scatters, and hence, impact of the electron transport is directly correlated to the position of the single dopants. As a result, a large variation in the ON-current and a modest variation of the subthreshold slope are observed in the ID-VG characteristics when comparing devices with microscopically different discrete dopant configurations. The variations of the current-voltage characteristics are analyzed with reference to the behavior of the transmission coefficients

Simulation and Modeling of Novel Electronic Device Architectures with NESS (Nano-Electronic Simulation Software): A Modular Nano TCAD Simulation Framework

The modeling of nano-electronic devices is a cost-effective approach for optimizing the semiconductor device performance and for guiding the fabrication technology. In this paper, we present the capabilities of the new flexible multi-scale nano TCAD simulation software called NanoElectronic Simulation Software (NESS). NESS is designed to study the charge transport in contemporary and novel ultra-scaled semiconductor devices. In order to simulate the charge transport in such ultra-scaled devices with complex architectures and design, we have developed numerous simulation modules based on various simulation approaches. Currently, NESS contains a driftdiffusion, Kubo–Greenwood, and non-equilibrium Green’s function (NEGF) modules. All modules are numerical solvers which are implemented in the C++ programming language, and all of them are linked and solved self-consistently with the Poisson equation. Here, we have deployed some of those modules to showcase the capabilities of NESS to simulate advanced nano-scale semiconductor devices. The devices simulated in this paper are chosen to represent the current state-of-the-art and future technologies where quantum mechanical effects play an important role. Our examples include ultra-scaled nanowire transistors, tunnel transistors, resonant tunneling diodes, and negative capacitance transistors. Our results show that NESS is a robust, fast, and reliable simulation platform which can accurately predict and describe the underlying physics in novel ultra-scaled electronic devices.European Union Horizon 2020 - 688101 SUPERAID7EPSRC UKRI Innovation Fellowship - EP/S001131/1 (QSEE), No. EP/P009972/1 (QUANTDEVMOD)H2020-FETOPEN-2019 s- No.862539-Electromed-FET OPEN.No. EP/S000259/1(Variability PDK for design based research on FPGA/neuro computing

On the Bandstructure Velocity and Ballistic Current of Ultra Narrow Silicon Nanowire Transistors as a Function of Cross Section Size, Orientation and Bias

A 20 band sp3d5s* spin-orbit-coupled, semi-empirical, atomistic tight-binding (TB) model is used with a semi-classical, ballistic, field-effect-transistor (FET) model, to theoretically examine the bandstructure carrier velocity and ballistic current in silicon nanowire (NW) transistors. Infinitely long, uniform, cylindrical and rectangular NWs, of cross sectional diameters/sides ranging from 3nm to 12nm are considered. For a comprehensive analysis, n-type and p-type metal-oxide-semiconductor (NMOS and PMOS) NWs in [100], [110] and [111] transport orientations are examined. In general, physical cross section reduction increases velocities, either by lifting the heavy mass valleys, or significantly changing the curvature of the bands. The carrier velocities of PMOS [110] and [111] NWs are a strong function of diameter, with the narrower D=3nm wires having twice the velocities of the D=12nm NWs. The velocity in the rest of the NW categories shows only minor diameter dependence. This behavior is explained through features in the electronic structure of the silicon host material. The ballistic current, on the other hand, shows the least sensitivity with cross section in the cases where the velocity has large variations. Since the carrier velocity is a measure of the effective mass and reflects on the channel mobility, these results can provide insight into the design of NW devices with enhanced performance and performance tolerant to structure geometry variations. In the case of ballistic transport in high performance devices, the [110] NWs are the ones with both high NMOS and PMOS performance, as well as low on-current variations with cross section geometry variations.Comment: 31 pages, 7 figures, 1 tabl