175 research outputs found
Throughput-driven floorplanning with wire pipelining
The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires
Adaptive Latency Insensitive Protocols
Latency-insensitive design copes with excessive delays typical of global wires in current and future IC technologies. It achieves its goal via encapsulation of synchronous logic blocks in wrappers that communicate through a latency-insensitive protocol (LIP) and pipelined interconnects. Previously proposed solutions suffer from an excessive performance penalty in terms of throughput or from a lack of generality. This article presents an adaptive LIP that outperforms previous static implementations, as demonstrated by two relevant cases — a microprocessor and an MPEG encoder — whose components we made insensitive to the latencies of their interconnections through a newly developed wrapper. We also present an informal exposition of the theoretical basis of adaptive LIPs, as well as implementation detail
PeF: Poisson's Equation Based Large-Scale Fixed-Outline Floorplanning
Floorplanning is the first stage of VLSI physical design. An effective
floorplanning engine definitely has positive impact on chip design speed,
quality and performance. In this paper, we present a novel mathematical model
to characterize non-overlapping of modules, and propose a flat fixed-outline
floorplanning algorithm based on the VLSI global placement approach using
Poisson's equation. The algorithm consists of global floorplanning and
legalization phases. In global floorplanning, we redefine the potential energy
of each module based on the novel mathematical model for characterizing
non-overlapping of modules and an analytical solution of Poisson's equation. In
this scheme, the widths of soft modules appear as variables in the energy
function and can be optimized. Moreover, we design a fast approximate
computation scheme for partial derivatives of the potential energy. In
legalization, based on the defined horizontal and vertical constraint graphs,
we eliminate overlaps between modules remained after global floorplanning, by
modifying relative positions of modules. Experiments on the MCNC, GSRC, HB+ and
ami49\_x benchmarks show that, our algorithm improves the average wirelength by
at least 2\% and 5\% on small and large scale benchmarks with certain
whitespace, respectively, compared to state-of-the-art floorplanners
HeurÃsticas bioinspiradas para el problema de Floorplanning 3D térmico de dispositivos MPSoCs
Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leÃda el 20-06-2013Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu
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