Is Ambient Intelligence a truly Human-Centric Paradigm in Industry? Current Research and Application Scenario

The use of pervasive networked devices is nowadays a reality in the service sector. It impacts almost all aspects of our daily lives, although most times we are not aware of its influence. This is a fundamental characteristic of the concept of Ambient Intelligence (AmI). Ambient Intelligence aims to change the form of human-computer interaction, focusing on the user needs so they can interact in a more seamless way, with emphasis on greater user-friendliness. The idea of recognizing people and their context situation is not new and has been successfully applied with limitations, for instance, in the health and military sectors. However its appearance in the manufacturing industry has been elusive. Could the concept of AmI turn the current shop floor into a truly human centric environment enabling comprehensive reaction to human presence and action? In this article an AmI scenario is presented and detailed with applications in human’s integrity and safety.Ambient Intelligence, networks, human-computer interaction

A comparison of processing techniques for producing prototype injection moulding inserts.

This project involves the investigation of processing techniques for producing low-cost moulding inserts used in the particulate injection moulding (PIM) process. Prototype moulds were made from both additive and subtractive processes as well as a combination of the two. The general motivation for this was to reduce the entry cost of users when considering PIM. PIM cavity inserts were first made by conventional machining from a polymer block using the pocket NC desktop mill. PIM cavity inserts were also made by fused filament deposition modelling using the Tiertime UP plus 3D printer. The injection moulding trials manifested in surface finish and part removal defects. The feedstock was a titanium metal blend which is brittle in comparison to commodity polymers. That in combination with the mesoscale features, small cross-sections and complex geometries were considered the main problems. For both processing methods, fixes were identified and made to test the theory. These consisted of a blended approach that saw a combination of both the additive and subtractive processes being used. The parts produced from the three processing methods are investigated and their respective merits and issues are discussed

Reducing risk in pre-production investigations through undergraduate engineering projects.

This poster is the culmination of final year Bachelor of Engineering Technology (B.Eng.Tech) student projects in 2017 and 2018. The B.Eng.Tech is a level seven qualification that aligns with the Sydney accord for a three-year engineering degree and hence is internationally benchmarked. The enabling mechanism of these projects is the industry connectivity that creates real-world projects and highlights the benefits of the investigation of process at the technologist level. The methodologies we use are basic and transparent, with enough depth of technical knowledge to ensure the industry partners gain from the collaboration process. The process we use minimizes the disconnect between the student and the industry supervisor while maintaining the academic freedom of the student and the commercial sensitivities of the supervisor. The general motivation for this approach is the reduction of the entry cost of the industry to enable consideration of new technologies and thereby reducing risk to core business and shareholder profits. The poster presents several images and interpretive dialogue to explain the positive and negative aspects of the student process

Index to 1984 NASA Tech Briefs, volume 9, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1984 Tech B Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

Engineering for a changing world: 60th Ilmenau Scientific Colloquium, Technische Universität Ilmenau, September 04-08, 2023 : programme

In 2023, the Ilmenau Scientific Colloquium is once more organised by the Department of Mechanical Engineering. The title of this year’s conference “Engineering for a Changing World” refers to limited natural resources of our planet, to massive changes in cooperation between continents, countries, institutions and people – enabled by the increased implementation of information technology as the probably most dominant driver in many fields. The Colloquium, supplemented by workshops, is characterised but not limited to the following topics: – Precision engineering and measurement technology Nanofabrication – Industry 4.0 and digitalisation in mechanical engineering – Mechatronics, biomechatronics and mechanism technology – Systems engineering – Productive teaming - Human-machine collaboration in the production environment The topics are oriented on key strategic aspects of research and teaching in Mechanical Engineering at our university

SciTech News Volume 71, No. 2 (2017)

Columns and Reports From the Editor 3 Division News Science-Technology Division 5 Chemistry Division 8 Engineering Division 9 Aerospace Section of the Engineering Division 12 Architecture, Building Engineering, Construction and Design Section of the Engineering Division 14 Reviews Sci-Tech Book News Reviews 16 Advertisements IEEE

SciTech News Volume 70, No. 4 (2016)

Columns and Reports From the Editor 3 Division News Science-Technology Division 4 SLA Annual Meeting 2016 Report (S. Kirk Cabeen Travel Stipend Award recipient) 6 Reflections on SLA Annual Meeting (Diane K. Foster International Student Travel Award recipient) 8 SLA Annual Meeting Report (Bonnie Hilditch International Librarian Award recipient)10 Chemistry Division 12 Engineering Division 15 Reflections from the 2016 SLA Conference (SPIE Digital Library Student Travel Stipend recipient)15 Fundamentals of Knowledge Management and Knowledge Services (IEEE Continuing Education Stipend recipient) 17 Makerspaces in Libraries: The Big Table, the Art Studio or Something Else? (by Jeremy Cusker) 19 Aerospace Section of the Engineering Division 21 Reviews Sci-Tech Book News Reviews 22 Advertisements IEEE 17 WeBuyBooks.net 2

Index to 1981 NASA Tech Briefs, volume 6, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1981 Tech Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences