Influence of parasitic capacitance variations on 65 nm and 32 nm predictive technology model SRAM core-cells

The continuous improving of CMOS technology allows the realization of digital circuits and in particular static random access memories that, compared with previous technologies, contain an impressive number of transistors. The use of new production processes introduces a set of parasitic effects that gain more and more importance with the scaling down of the technology. In particular, even small variations of parasitic capacitances in CMOS devices are expected to become an additional source of faulty behaviors in future technologies. This paper analyzes and compares the effect of parasitic capacitance variations in a SRAM memory circuit realized with 65 nm and 32 nm predictive technology model

On Fault Modeling and Testing of Content-addressable Memories

Associative or content addressable memories can be used for many computing applications. This paper discusses fault modeling for the content addressable memory (CAM) chips. Detailed examination of a single CAM cell is presented. A functional fault model for a CAM architecture executing exact match derived from the single cell model is presented. An efficient testing strategy can be derived using the proposed fault mode

Path Delay Test Through Memory Arrays

Memory arrays cannot be as easily tested as other storage elements in a chip. Most of the flip-flops (FFs) in a chip can be replaced by scan cells in scan-based design. However, the bits in memory arrays cannot be replaced by scan cells, due to the area cost and the timing-critical nature of many of the paths into and out of memories. Thus, bits in a memory array can be considered non-scan storage elements. Test methods such as memory built-in self-test (MBIST), functional test, and macro test are used to test memory arrays. However, these tests aren’t sufficient to test the paths through the memory arrays. During structural (scan) test generation, memory arrays are treated as “black boxes” or memory arrays are bypassed to a known value. Black boxes decrease coverage loss while bypassing increases chip area and delay. Path delay test through memory arrays is proposed using pseudo functional test (PFT) with K Longest Paths Per Gate (KLPG). In this technique, any longest path that is captured into a non-scan cell (including a memory cell) is propagated to a scan cell. The propagation of the captured value from non-scan cell to scan cell occurs during low-speed clock cycles. In this work, we assume that only one extra coda cycle is sufficient to propagate the captured value to a scan cell. This is true if the output of the memory feeds combinational logic that in turn feeds scan cells. When we want to launch a transition from a memory output, different values are written into different address locations and the address is toggled between the locations. The ATPG writes the different values into the memory cells during the preamble cycles. In the case of launching a transition out of a non-scan cell, the cell must be written with an initial value during the preamble cycles, and the next value set on the non-scan cell input. Thus, it is possible to capture and launch transitions into and from memory and non-scan cells and thus test the path delay of the longest paths into and out of memory and non-scan cells

Technology and layout-related testing of static random-access memories

Static random-access memories (SRAMs) exhibit faults that are electrical in nature. Functional and electrical testing are performed to diagnose faulty operation. These tests are usually designed from simple fault models that describe the chip interface behavior without a thorough analysis of the chip layout and technology. However, there are certain technology and layout-related defects that are internal to the chip and are mostly time-dependent in nature. The resulting failures may or may not seriously degrade the input/output interface behavior. They may show up as electrical faults (such as a slow access fault) and/or functional faults (such as a pattern sensitive fault). However, these faults cannot be described properly with the functional fault models because these models do not take timing into account. Also, electrical fault models that describe merely the input/output interface behavior are inadequate to characterize every possible defect in the basic SRAM cell. Examples of faults produced by these defects are: (a) static data loss, (b) abnormally high currents drawn from the power supply, etc. Generating tests for such faults often requires a thorough understanding and analysis of the circuit technology and layout. In this article, we shall examine ways to characterize and test such faults. We shall divide such faults into two categories depending on the types of SRAMs they effect—silicon SRAMs and GaAs SRAMs.Peer Reviewedhttp://deepblue.lib.umich.edu/bitstream/2027.42/43015/1/10836_2004_Article_BF00972519.pd

Test and diagnosis of microprocessor memory arrays using functional patterns

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1996.Includes bibliographical references (p. 101).by Ya-Chieh Lai.M.Eng

Testability and redundancy techniques for improved yield and reliability of CMOS VLSI circuits

The research presented in this thesis is concerned with the design of fault-tolerant integrated circuits as a contribution to the design of fault-tolerant systems. The economical manufacture of very large area ICs will necessitate the incorporation of fault-tolerance features which are routinely employed in current high density dynamic random access memories. Furthermore, the growing use of ICs in safety-critical applications and/or hostile environments in addition to the prospect of single-chip systems will mandate the use of fault-tolerance for improved reliability. A fault-tolerant IC must be able to detect and correct all possible faults that may affect its operation. The ability of a chip to detect its own faults is not only necessary for fault-tolerance, but it is also regarded as the ultimate solution to the problem of testing. Off-line periodic testing is selected for this research because it achieves better coverage of physical faults and it requires less extra hardware than on-line error detection techniques. Tests for CMOS stuck-open faults are shown to detect all other faults. Simple test sequence generation procedures for the detection of all faults are derived. The test sequences generated by these procedures produce a trivial output, thereby, greatly simplifying the task of test response analysis. A further advantage of the proposed test generation procedures is that they do not require the enumeration of faults. The implementation of built-in self-test is considered and it is shown that the hardware overhead is comparable to that associated with pseudo-random and pseudo-exhaustive techniques while achieving a much higher fault coverage through-the use of the proposed test generation procedures. The consideration of the problem of testing the test circuitry led to the conclusion that complete test coverage may be achieved if separate chips cooperate in testing each other's untested parts. An alternative approach towards complete test coverage would be to design the test circuitry so that it is as distributed as possible and so that it is tested as it performs its function. Fault correction relies on the provision of spare units and a means of reconfiguring the circuit so that the faulty units are discarded. This raises the question of what is the optimum size of a unit? A mathematical model, linking yield and reliability is therefore developed to answer such a question and also to study the effects of such parameters as the amount of redundancy, the size of the additional circuitry required for testing and reconfiguration, and the effect of periodic testing on reliability. The stringent requirement on the size of the reconfiguration logic is illustrated by the application of the model to a typical example. Another important result concerns the effect of periodic testing on reliability. It is shown that periodic off-line testing can achieve approximately the same level of reliability as on-line testing, even when the time between tests is many hundreds of hours