Combined on-line lifetime-energy optimization for asymmetric multicores

In this paper we present an architectural and on-line resource management solution to optimize lifetime reliability of asymmetric multicores while minimizing the system energy consumption, targeting both single nodes (multicores) as well as multiple ones (cluster of multicores). The solution exploits the different characteristics of the computing resources to achieve the desired performance while optimizing the lifetime/energy trade-off. The experimental results show that a combined optimization of energy and lifetime allows for achieving an extended lifetime (similar to the one pursued by lifetime-only optimization solutions) with a marginal energy consumption detriment (less than 2%) with respect to energy-aware but aging-unaware systems

Evaluating the impact of job scheduling and power management on processor lifetime for chip multiprocessors

Temperature-induced reliability issues are among the major challenges for multicore architectures. Thermal hot spots and thermal cycles combine to degrade reliability. This research presents new reliability-aware job scheduling and power management approaches for chip multiprocessors. Accurate evaluation of these policies requires a novel simulation framework that can capture architecture-level effects over tens of seconds or longer, while also capturing thermal interactions among cores resulting from dynamic scheduling policies. Using this framework and a set of new thermal management policies, this work shows that techniques that offer similar performance, energy, and even peak temperature can differ significantly in their effects on the expected processor lifetime

Aggressive and reliable high-performance architectures - techniques for thermal control, energy efficiency, and performance augmentation

As more and more transistors fit in a single chip, consumers of the electronics industry continue to expect decline in cost-per-function. Advancements in process technology offer steady improvements in system performance. The improvements manifest themselves as shrinking area, faster circuits and improved battery life. However, this migration toward sub-micro/nano-meter technologies presents a new set of challenges as the system becomes extremely sensitive to any voltage, temperature or process variations. One approach to immunize the system from the adverse effects of these variations is to add sufficient safety margins to the operating clock frequency of the system. Clearly, this approach is overly conservative because these worst case scenarios rarely occur. But, process technology in nanoscale era has already hit the power and frequency walls. Regardless of any of these challenges, the present processors not only need to run faster, but also cooler and use lesser energy. At a juncture where there is no further improvement in clock frequency is possible, data dependent latching through Timing Speculation (TS) provides a silver lining. Timing speculation is a widely known method for realizing better-than-worst-case systems. TS is aggressive in nature, where the mechanism is to dynamically tune the system frequency beyond the worst-case limits obtained from application characteristics to enhance the performance of system-on-chips (SoCs). However, such aggressive tuning has adverse consequences that need to be overcome. Power dissipation, on-chip temperature and reliability are key issues that cannot be ignored. A carefully designed power management technique combined with a reliable, controlled, aggressive clocking not only attempts to constrain power dissipation within a limit, but also improves performance whenever possible. In this dissertation, we present a novel power level switching mechanism by redefining the existing voltage-frequency pairs. We introduce an aggressive yet reliable framework for energy efficient thermal control. We were able to achieve up to 40% speed-up compared to a base scheme without overclocking. We compare our method against different schemes. We observe that up to 75% Energy-Delay squared product (ED2) savings relative to base architecture is possible. We showcase the loss of efficiency in present chip multiprocessor systems due to excess power supplied, and propose Utilization-aware Task Scheduling (UTS) - a power management scheme that increases energy efficiency of chip multiprocessors. Our experiments demonstrate that UTS along with aggressive timing speculation squeezes out maximum performance from the system without loss of efficiency, and breaching power & thermal constraints. From our evaluation we infer that UTS improves performance by up to 12% due to aggressive power level switching and over 50% in ED2 savings compared to traditional power management techniques. Aggressive clocking systems having TS as their central theme operate at a clock frequency range beyond specified safe limits, exploiting the data dependence on circuit critical paths. However, the margin for performance enhancement is restricted due to extreme difference between short paths and critical paths. In this thesis, we show that increasing the lengths of short paths of the circuit increases the margin of TS, leading to performance improvement in aggressively designed systems. We develop Min-arc algorithm to efficiently add delay buffers to selected short paths while keeping down the area penalty. We show that by using our algorithm, it is possible to increase the circuit contamination delay by up to 30% without affecting the propagation delay, with moderate area overhead. We also explore the possibility of increasing short path delays further by relaxing the constraint on propagation delay, and achieve even higher performance. Overall, we bring out the inter-relationship between power, temperature and reliability of aggressively clocked systems. Our main objective is to achieve maximal performance benefits and improved energy efficiency within thermal constraints by effectively combining dynamic frequency scaling, dynamic voltage scaling and reliable overclocking. We provide solutions to improve the existing power management in chip multiprocessors to dynamically maximize system utilization and satisfy the power constraints within safe thermal limits

Modeling and optimization of high-performance many-core systems for energy-efficient and reliable computing

Thesis (Ph.D.)--Boston UniversityMany-core systems, ranging from small-scale many-core processors to large-scale high performance computing (HPC) data centers, have become the main trend in computing system design owing to their potential to deliver higher throughput per watt. However, power densities and temperatures increase following the growth in the performance capacity, and bring major challenges in energy efficiency, cooling costs, and reliability. These challenges require a joint assessment of performance, power, and temperature tradeoffs as well as the design of runtime optimization techniques that monitor and manage the interplay among them. This thesis proposes novel modeling and runtime management techniques that evaluate and optimize the performance, energy, and reliability of many-core systems. We first address the energy and thermal challenges in 3D-stacked many-core processors. 3D processors with stacked DRAM have the potential to dramatically improve performance owing to lower memory access latency and higher bandwidth. However, the performance increase may cause 3D systems to exceed the power budgets or create thermal hot spots. In order to provide an accurate analysis and enable the design of efficient management policies, this thesis introduces a simulation framework to jointly analyze performance, power, and temperature for 3D systems. We then propose a runtime optimization policy that maximizes the system performance by characterizing the application behavior and predicting the operating points that satisfy the power and thermal constraints. Our policy reduces the energy-delay product (EDP) by up to 61.9% compared to existing strategies. Performance, cooling energy, and reliability are also critical aspects in HPC data centers. In addition to causing reliability degradation, high temperatures increase the required cooling energy. Communication cost, on the other hand, has a significant impact on system performance in HPC data centers. This thesis proposes a topology-aware technique that maximizes system reliability by selecting between workload clustering and balancing. Our policy improves the system reliability by up to 123.3% compared to existing temperature balancing approaches. We also introduce a job allocation methodology to simultaneously optimize the communication cost and the cooling energy in a data center. Our policy reduces the cooling cost by 40% compared to cooling-aware and performance-aware policies, while achieving comparable performance to performance-aware policy

Improving processor efficiency through thermal modeling and runtime management of hybrid cooling strategies

One of the main challenges in building future high performance systems is the ability to maintain safe on-chip temperatures in presence of high power densities. Handling such high power densities necessitates novel cooling solutions that are significantly more efficient than their existing counterparts. A number of advanced cooling methods have been proposed to address the temperature problem in processors. However, tradeoffs exist between performance, cost, and efficiency of those cooling methods, and these tradeoffs depend on the target system properties. Hence, a single cooling solution satisfying optimum conditions for any arbitrary system does not exist. This thesis claims that in order to reach exascale computing, a dramatic improvement in energy efficiency is needed, and achieving this improvement requires a temperature-centric co-design of the cooling and computing subsystems. Such co-design requires detailed system-level thermal modeling, design-time optimization, and runtime management techniques that are aware of the underlying processor architecture and application requirements. To this end, this thesis first proposes compact thermal modeling methods to characterize the complex thermal behavior of cutting-edge cooling solutions, mainly Phase Change Material (PCM)-based cooling, liquid cooling, and thermoelectric cooling (TEC), as well as hybrid designs involving a combination of these. The proposed models are modular and they enable fast and accurate exploration of a large design space. Comparisons against multi-physics simulations and measurements on testbeds validate the accuracy of our models (resulting in less than 1C error on average) and demonstrate significant reductions in simulation time (up to four orders of magnitude shorter simulation times). This thesis then introduces temperature-aware optimization techniques to maximize energy efficiency of a given system as a whole (including computing and cooling energy). The proposed optimization techniques approach the temperature problem from various angles, tackling major sources of inefficiency. One important angle is to understand the application power and performance characteristics and to design management techniques to match them. For workloads that require short bursts of intense parallel computation, we propose using PCM-based cooling in cooperation with a novel Adaptive Sprinting technique. By tracking the PCM state and incorporating this information during runtime decisions, Adaptive Sprinting utilizes the PCM heat storage capability more efficiently, achieving 29\% performance improvement compared to existing sprinting policies. In addition to the application characteristics, high heterogeneity in on-chip heat distribution is an important factor affecting efficiency. Hot spots occur on different locations of the chip with varying intensities; thus, designing a uniform cooling solution to handle worst-case hot spots significantly reduces the cooling efficiency. The hybrid cooling techniques proposed as part of this thesis address this issue by combining the strengths of different cooling methods and localizing the cooling effort over hot spots. Specifically, the thesis introduces LoCool, a cooling system optimizer that minimizes cooling power under temperature constraints for hybrid-cooled systems using TECs and liquid cooling. Finally, the scope of this work is not limited to existing advanced cooling solutions, but it also extends to emerging technologies and their potential benefits and tradeoffs. One such technology is integrated flow cell array, where fuel cells are pumped through microchannels, providing both cooling and on-chip power generation. This thesis explores a broad range of design parameters including maximum chip temperature, leakage power, and generated power for flow cell arrays in order to maximize the benefits of integrating this technology with computing systems. Through thermal modeling and runtime management techniques, and by exploring the design space of emerging cooling solutions, this thesis provides significant improvements in processor energy efficiency.2018-07-09T00:00:00

Application aware performance, power consumption, and reliability tradeoff

There has been an unprecedented increase in the drive for microprocessor performance. This drive is motivated by the increase in software complexity, opportunity to solve previously unattempted problems especially in scientific domain, and a need to crunch the ever growing `Big Data\u27 to enable a multitude of technological advances to benefit mankind. A consequence of these phenomena is the ever increasing transistor count in deployed computing systems. Although technology scaling leads to lower power consumption per transistor, the overall system level power consumption is on the rise. This leads to a variety of power supply related issues. As the chip die area is not increasing significantly, and the supply voltage reduction is not keeping on par with the reduction in device dimensions, an increase in power density is observed. This manifests as an increased temperature profile on the chip floorplan. A rise in temperature necessitates aggressive and costly cooling mechanisms adding to the design complexity and manufacturing efforts. It also triggers various failure mechanisms leading to reduction in the expected chip lifetime/reliability. Given the conflicting trends in Performance, Power consumption, and chip Reliability (PPR), it is imperative to balance them in a fine-grained fashion to meet system level goals and expectations. Sole dependence on the advancements in manufacturing technology is no longer sufficient. Alternate venues for PPR management are being increasingly paid attention to. On the other hand, the PPR demands are usually time dependent. For example, the constraint on power consumption in a green data center is dictated by the energy reserve. The demand on performance in a cloud based platform depends on the agreed Quality of Service (QOS) requirements. The reliability of a microprocessor is dependent on the deployment domain. The goal of our research is to address the issue of growing microprocessor power consumption subject to performance and/or reliability goals. Through our developed schemes, we tailor the execution context to match application requirements. This leads to judicious use of power while adhering to aforementioned constraints. It is to be noted that the actual demands on performance, power consumption, and reliability are highly variant, and depend upon executing applications and operating conditions. As such, we develop schemes to cater to these variant demands. To meet these demands efficiently, the solutions developed are tailored to current hardware-software interaction characteristics. Two techniques that are very relevant in this area, namely dynamic voltage and frequency scaling (DVFS) and microarchitectural adaptation, are leveraged to produce expected PPR characteristics when executing a wide variety of tasks. In this dissertation, we demonstrate how the expected chip lifetime can be augmented in a real-time setting using DVFS while paying heed to performance constraints modeled as QoS requirements. Individual tasks in a task queue are assigned specific voltage and frequency pairs to utilize for their execution. This assignment is empowered by knowledge of application-wise hardware-software interactions to reach solutions that are tailored to the current execution scenario. Our observations indicate that a 2 to 18 fold improvement in chip lifetime can be expected by the utilization of the schemes we develop in this regard. Capitalizing on the power of microarchitectural adaptation, we further improve chip lifetime expectations 2-8 times, based on the failure mechanism investigated. This increase in expected chip lifetime directly translates to reduction of both operational and replacement costs. We also provide mechanisms to co-manage performance and power consumption constraints. Comprehensive microarchitectural adaptation space is very complex and its usage thus leads to significant runtime overhead. To tackle this, we devote a fair bit of attention to its pruning so as to narrow down on and utilize only the most effective adaptations. A two stage adaptation process is provided to a) improve optimality of the solutions delivered, and b) to keep the runtime overhead in check. We observe that our schemes provide 20\% higher normalized energy efficiency compared to the state of the art techniques proposed, while using just a very small fraction of the configuration space. We also find that our schemes effectively cater to a wide variety of demands on performance and power consumption, providing the necessary hardware characteristics within 10\% bound. Since only the most useful configuration space is retained for adaptation, occurrence of a fault that prohibits the usage of a certain adaptive control can lead to the inability to satisfy a subset of hardware demands. A detailed analysis has been carried out to understand how the remaining active configurations can preserve the expected hardware behavior. To a good extent, we observe that the system behavior under a failure closely tracks (with less than 5\% tracking error) the obtainable behavior without the presence of the fault. We believe that application tailored schemes for PPR management become increasingly relevant as the microprocessor design advancements saturate in the future. They will be extremely relevant to extract every possible ounce of performance while confirming to constraints on power consumption and reliability. Given the effectiveness of our schemes, we are confident that such schemes are applicable in different markets like embedded computing, desktop computing, cloud platforms and high performance computing. Insights drawn from our research will guide chip designers in the provision of effective adaptive controls to combat increasing demands on PPR characteristics

Energy Efficient Scheduling for Real-Time Systems

The goal of this dissertation is to extend the state of the art in real-time scheduling algorithms to achieve energy efficiency. Currently, Pfair scheduling is one of the few scheduling frameworks which can optimally schedule a periodic real-time taskset on a multiprocessor platform. Despite the theoretical optimality, there exist large concerns about efficiency and applicability of Pfair scheduling in practical situations. This dissertation studies and proposes solutions to such efficiency and applicability concerns. This dissertation also explores temperature aware energy management in the domain of real-time scheduling. The thesis of this dissertation is: the implementation efficiency of Pfair scheduling algorithms can be improved. Further, temperature awareness of a real-time system can be improved while considering variation of task execution times to reduce energy consumption. This thesis is established through research in a number of directions. First, we explore the applicability of Dynamic Voltage and Frequency Scaling (DVFS) feature in the underlying platform, within Pfair scheduled systems. We propose techniques to reduce energy consumption in Pfair scheduling by using DVFS. Next, we explore the problem of quantum size selection in Pfair scheduled system so that runtime overheads are minimized. We also propose a hardware design for a central Pfair scheduler core in a multiprocessor system to minimized the overheads and energy consumption of Pfair scheduling. Finally, we propose a temperature aware energy management scheme for tasks with varying execution times

Techniques for Aging, Soft Errors and Temperature to Increase the Reliability of Embedded On-Chip Systems

This thesis investigates the challenge of providing an abstracted, yet sufficiently accurate reliability estimation for embedded on-chip systems. In addition, it also proposes new techniques to increase the reliability of register files within processors against aging effects and soft errors. It also introduces a novel thermal measurement setup that perspicuously captures the infrared images of modern multi-core processors