Polyimides with improved compression moldability

The semicrystalline polyimide prepared by reaction of 3,3',4,4' benzophenonetetracarboxylic (BTDA) and 1,3-bis(4-aminophenoxy 4' benzoyl) benzene (1,3-BABB) is modified so that it can be more readily processed to form adhesive bonds, moldings, and composites. The stoichiometric ratio of the two monomers, BTDA and 1,3-BABB is controlled so that the intermediate polyamide acid is of a calculated molecular weight. A polyimide acid with excess anhydride groups is then reacted with the stoichiometrically required amount of monofunctional aromatic or aliphatic amine required for complete endcapping. The stoichiometrically offset, encapped polyimide is processed at lower temperatures and pressures than the unmodified high molecular weight polyimide with the same repeat unit, and exhibits an improved melt stability

Process of end-capping a polyimide system

A process of endcapping a polyimide system with an endcapping agent in order to achieve a controlled decrease in molecular weight and melt viscosity along with predictable fracture resistance of the molded products is disclosed. The uncapped system is formed by combining an equimolar ratio of 4,4'-bis (3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA) and 1,-bis (aminophenoxy) benzene (APB) dissolved in bis (2-methoxyethyl)ether. The endcapped system is formed by dissolving APB in bis-(2-methoxyethyl)ether, adding the BDSDA. By varying the amount of endcapping from 0 to 4%, molecular weight is decreased from 13,900 to 8660. At a processing temperature of 250 C, there is a linear relationship between molecular weight and viscosity, with the viscosity decreasing by two orders of magnitude as the molecular weight decreased from 13,900 to 8660

Experimental Evidence for Quantum Interference and Vibrationally Induced Decoherence in Single-Molecule Junctions

We analyze quantum interference and decoherence effects in single-molecule junctions both experimentally and theoretically by means of the mechanically controlled break junction technique and density-functional theory. We consider the case where interference is provided by overlapping quasi-degenerate states. Decoherence mechanisms arising from the electronic-vibrational coupling strongly affect the electrical current flowing through a single-molecule contact and can be controlled by temperature variation. Our findings underline the all-important relevance of vibrations for understanding charge transport through molecular junctions.Comment: 5 pages, 4 figure

Method for forming pyrrone molding powders and products of said method

The formation of pyrrone resins of the ladder or semiladder structure is described. The technique involves initial formation of fully cyclized prepolymers having an average degree of polymerization of about 1.5, one with acidic terminal groups, another with amine terminal groups. Thereafter the prepolymers are intimately admixed on a 1:1 stoichiometric basis. The resulting powder mixture is molded at elevated pressures and temperatures to form a fully cyclized resin

Processable polyimide adhesive and matrix composite resin

A high temperature polyimide composition prepared by reacting 4,4'-isophthaloyldiphthalic anhydride with metaphenylenediamine is employed to prepare matrix resins, adhesives, films, coatings, moldings, and laminates, especially those showing enhanced flow with retention of mechanical and adhesive properties. It can be used in the aerospace industry, for example, in joining metals to metals or metals to composite structures. One area of application is in the manufacture of lighter and stronger aircraft and spacecraft structures

Development of space stable semitransparent polyquinoxaline films

Three polyphenylquinoxalines underwent preliminary study for potential use as coatings on aircraft and spacecraft. These polymers were prepared from the reaction of 3,3 prime, 4,4 prime-tetraaminodiphenyl ether with p,p prime-oxydibenzil and with m -bis (phenylglyoxalyl) benzene and from the reaction of 3,3 prime, 4,4 prime-tetraaminodiphenylsulfone with p,p prime-oxydibenzil. High purity reactants and solvents were used in polymer preparation to minimize color in the polymer films. High molecular weight polymers were prepared at ambient temperature at 12 to 15 percent concentration by upsetting the stoichiometry by 0.5 to 1.0 percent in favor of the bis (1,2-dicarbonyl) reactant. A portion of each polymer was endcapped with benzil and with o-phenylenediamine. Certain properties of the endcapped and unendcapped versions of each polymer are compared. Uniform films of 2.0 and 0.1 mil thickness were cast from solutions of the unendcapped and endcapped versions of each of the three polymers

Polyimide processing additives

A process for preparing polyimides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly-(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15 percent by weight of additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA

LARC-IA: A flexible backbone polyimide

A new linear, aromatic, thermoplastic polyimide, prepared from oxydiphthalic anhydride (ODPA) and 3,4'-oxydianiline (ODA) in diglyme and identified as LARC-IA, was synthesized and evaluated. The monomers are relatively inexpensive and physiologically safe. Molecular weight was controlled by use of a monofunctional anhydride, phthalic anhydride (PA), in order to promote controlled flow and wetting properties. The polymer is considered a safe alternative to commercially available LARC-TPI which is prepared with an expensive diamine of uncertain carcinogenicity. The evaluation was based primarily on the polymer's adhesive properties as determined by thermal and water boil exposure of lap shear specimens. Strengths were determined at room temperature, 177, 204 and 232 C before and after exposure to determine the adhesive system's durability to adverse environments over a period of time. Other properties (FWT, G(1c), film and composite properties) were examined which were determined to be typical of a high temperature polyimide. Results of the study show a favorable comparison to LARC-TPI, a commercially available polyimide

Thermoplastic adhesives based on 4,4'-isophthaloyldiphthalic anhydride (IDPA)

Thermoplastic polyimides were prepared and evaluated as adhesives. These materials are based on 4,4'-isophthaloyldiphathalic anhydride (IDAP) and either metaphenylene diamine (MPD) or 3,3'-diaminobenzophenone (DBAP). Both polymers exhibit excellent adhesive properties; however, the IDPA-MPD is the more attractive system because of a combination of high mechanical and physical properties as well as being made from commercially attractive monomers. The IDPA-MPD is an isomeric form of the commercially available adhesive and matrix resin, LARC-TPI and both systems have the same glass transition temperature and exhibit similar adhesive properties