11,070 research outputs found
From FPGA to ASIC: A RISC-V processor experience
This work document a correct design flow using these tools in the Lagarto RISC- V Processor and the RTL design considerations that must be taken into account, to move from a design for FPGA to design for ASIC
Internationalisation of Innovation: Why Chip Design Moving to Asia
This paper will appear in International Journal of Innovation Management, special issue in honor of Keith Pavitt, (Peter Augsdoerfer, Jonathan Sapsed, and James Utterback, guest editors), forthcoming. Among Keith Pavitt's many contributions to the study of innovation is the proposition that physical proximity is advantageous for innovative activities that involve highly complex technological knowledge But chip design, a process that creates the greatest value in the electronics industry and that requires highly complex knowledge, is experiencing a massive dispersion to leading Asian electronics exporting countries. To explain why chip design is moving to Asia, the paper draws on interviews with 60 companies and 15 research institutions that are doing leading-edge chip design in Asia. I demonstrate that "pull" and "policy" factors explain what attracts design to particular locations. But to get to the root causes that shift the balance in favor of geographical decentralization, I examine "push" factors, i.e. changes in design methodology ("system-on-chip design") and organization ("vertical specialization" within global design networks). The resultant increase in knowledge mobility explains why chip design - that, in Pavitt's framework is not supposed to move - is moving from the traditional centers to a few new specialized design clusters in Asia. A completely revised and updated version has been published as: " Complexity and Internationalisation of Innovation: Why is Chip Design Moving to Asia?," in International Journal of Innovation Management, special issue in honour of Keith Pavitt, Vol. 9,1: 47-73.
The integration of on-line monitoring and reconfiguration functions using IEEE1149.4 into a safety critical automotive electronic control unit.
This paper presents an innovative application of IEEE 1149.4 and the integrated diagnostic reconfiguration (IDR) as tools for the implementation of an embedded test solution for an automotive electronic control unit, implemented as a fully integrated mixed signal system. The paper describes how the test architecture can be used for fault avoidance with results from a hardware prototype presented. The paper concludes that fault avoidance can be integrated into mixed signal electronic systems to handle key failure modes
AI/ML Algorithms and Applications in VLSI Design and Technology
An evident challenge ahead for the integrated circuit (IC) industry in the
nanometer regime is the investigation and development of methods that can
reduce the design complexity ensuing from growing process variations and
curtail the turnaround time of chip manufacturing. Conventional methodologies
employed for such tasks are largely manual; thus, time-consuming and
resource-intensive. In contrast, the unique learning strategies of artificial
intelligence (AI) provide numerous exciting automated approaches for handling
complex and data-intensive tasks in very-large-scale integration (VLSI) design
and testing. Employing AI and machine learning (ML) algorithms in VLSI design
and manufacturing reduces the time and effort for understanding and processing
the data within and across different abstraction levels via automated learning
algorithms. It, in turn, improves the IC yield and reduces the manufacturing
turnaround time. This paper thoroughly reviews the AI/ML automated approaches
introduced in the past towards VLSI design and manufacturing. Moreover, we
discuss the scope of AI/ML applications in the future at various abstraction
levels to revolutionize the field of VLSI design, aiming for high-speed, highly
intelligent, and efficient implementations
Design Methodology of Very Large Scale Integration
Very Large Scale Integration (VLSI) deals with systems complexity rather than transistor size or circuit performance. VLSI design methodology is supported by Computer Aided Design (CAD) and Design Automation (DA) tools, which help VLSI designers to implement more complex and guaranteed designs. The increasing growth in VLSI complexity dictates a hierarchical design approach and the need for hardware DA tools.
This paper discusses the generalized Design Procedure for CAD circuit design; the commercial CADs offered by CALMA and the Caesar System, supported by the Berkeley design tools. A complete design of a Content Addressable Memory (CAM) cell, using the Caesar system, supported by Berkeley CAD tools, is illustrated
Late Innovation Strategies in Asian Electronics Industries: A Conceptual Framework and Illustrative Evidence
This paper was published in Oxford Development Studies special issue in honor of the late Professor Linsu Kim. The paper reviews evidence on the evolution of electronics design in Asia's leading electronics exporting countries, to establish what capabilities have been developed, and to shed light on the forces that are driving "late innovation" strategies. It also reviews intellectual sources that can be used to theoretically ground these hypotheses. Using a well-known taxonomy of innovation that distinguishes incremental, modular, architectural and radical innovations, and the concept of "disruptive technologies", I argue that Asian firms may have realistic chances to engage in incremental innovations as well as in architectural innovations. However, to sustain "late innovation" strategies over a longer period, "complex system integration" capabilities are necessary to provide the missing link.
Tensor Computation: A New Framework for High-Dimensional Problems in EDA
Many critical EDA problems suffer from the curse of dimensionality, i.e. the
very fast-scaling computational burden produced by large number of parameters
and/or unknown variables. This phenomenon may be caused by multiple spatial or
temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit
simulation), nonlinearity of devices and circuits, large number of design or
optimization parameters (e.g. full-chip routing/placement and circuit sizing),
or extensive process variations (e.g. variability/reliability analysis and
design for manufacturability). The computational challenges generated by such
high dimensional problems are generally hard to handle efficiently with
traditional EDA core algorithms that are based on matrix and vector
computation. This paper presents "tensor computation" as an alternative general
framework for the development of efficient EDA algorithms and tools. A tensor
is a high-dimensional generalization of a matrix and a vector, and is a natural
choice for both storing and solving efficiently high-dimensional EDA problems.
This paper gives a basic tutorial on tensors, demonstrates some recent examples
of EDA applications (e.g., nonlinear circuit modeling and high-dimensional
uncertainty quantification), and suggests further open EDA problems where the
use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and
System
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