113,256 research outputs found
Process-Hardened, Multi-Analyte Sensor for Characterizing Rocket Plume Constituents
A multi-analyte sensor was developed that enables simultaneous detection of rocket engine combustion-product molecules in a launch-vehicle ground test stand. The sensor was developed using a pin-printing method by incorporating multiple sensor elements on a single chip. It demonstrated accurate and sensitive detection of analytes such as carbon dioxide, carbon monoxide, kerosene, isopropanol, and ethylene from a single measurement. The use of pin-printing technology enables high-volume fabrication of the sensor chip, which will ultimately eliminate the need for individual sensor calibration since many identical sensors are made in one batch. Tests were performed using a single-sensor chip attached to a fiber-optic bundle. The use of a fiber bundle allows placement of the opto-electronic readout device at a place remote from the test stand. The sensors are rugged for operation in harsh environments
Innovative teaching of IC design and manufacture using the Superchip platform
In this paper we describe how an intelligent chip architecture has allowed a large cohort of undergraduate students to be given effective practical insight into IC design by designing and manufacturing their own ICs. To achieve this, an efficient chip architecture, the “Superchip”, has been developed, which allows multiple student designs to be fabricated on a single IC, and encapsulated in a standard package without excessive cost in terms of time or resources. We demonstrate how the practical process has been tightly coupled with theoretical aspects of the degree course and how transferable skills are incorporated into the design exercise. Furthermore, the students are introduced at an early stage to the key concepts of team working, exposure to real deadlines and collaborative report writing. This paper provides details of the teaching rationale, design exercise overview, design process, chip architecture and test regime
Maximizing Enrollment for Kids: Results From a Diagnostic Assessment of Enrollment and Retention in Eight States
Examines strengths, challenges, and areas for improvement in Medicaid and Children's Health Insurance Plan enrollment and retention systems, policies, and procedures for children in eight grantee states. Outlines best practices in simplifying processes
Characterization of High Temperature Optocoupler for Power Electronic Systems
High-temperature devices have been rapidly increas due to the implementation of new technologies like silicon carbide, high-temperature ceramic, and others. Functionality under elevated temperatures can reduce signal integrity reducing the reliability of power electronic systems. This study presents an ongoing research effort to develop a high-temperature package for optocouplers to operate at higher temperature compared with commercial devices. Low temperature co-fired ceramic (LTCC) was used as the substrate. Bare die commercial LED and photodetectors were attached to the substrate and tested for functionality. Preliminary results show enhanced performance at elevated temperatures compared to a commercial optocoupler device
Improving the Delivery of Key Work Supports: Policy & Practice Opportunities at a Critical Moment
Examines the consequences of a lack of coordination and seamless service delivery across support programs. Outlines policy, procedural, and data utilization options and best practices to expedite receipt of benefits across programs, as well as challenges
Where Will Consumers Find Privacy Protection From RFIDs?: A Case for Federal Legislation
With the birth of RFID technology, businesses gained the ability to tag products with practically invisible computer chips that relay information about consumer behavior to remote databases. Such tagging permits retailers and manufacturers to track the purchases, identities, and movements of their customers. In the absence of enforceable regulations, society risks being subjected to an unprecedented level of Orwellian surveillance. This iBrief addresses consumer privacy concerns stemming from the proliferation of RFID technology. It discusses why tort law, state legislation, FTC guidelines, and proposed regulations are insufficient methods to alleviate consumer privacy concerns and suggests amending various federal privacy laws, thereby prohibiting the underlying RFID tracking behavior
Flexible and stretchable circuit technologies for space applications
Flexible and stretchable circuit technologies offer reduced volume and weight, increased electrical performance, larger design freedom and improved interconnect reliability. All of these advantages are appealing for space applications. In this paper, two example technologies, the ultra-thin chip package (UTCP) and stretchable moulded interconnect (SMI), are described. The UTCP technology results in a 60 µm thick chip package, including the embedding of a 20 µm thick chip, laser or protolithic via definition to the chip contacts and application of fan out metallization. Imec’s stretchable interconnect technology is inspired by conventional rigid and flexible printed circuit board (PCB) technology. Stretchable interconnects are realized by copper meanders supported by a flexible material e.g. polyimide. Elastic materials, predominantly silicone rubbers, are used to embed the conductors and the components, thus serving as circuit carrier. The possible advantages of these technologies with respect to space applications are discussed
Performing Under Pressure: Annual Findings of a 50-State Survey of Eligibility, Enrollment, Renewal, and Cost-Sharing Policies in Medicaid and CHIP, 2011-2012
Analyzes findings on state trends in maintaining or expanding eligibility for public coverage and improving enrollment and renewal procedures. Highlights some states' expansion of Medicaid eligibility and the use of technology to achieve efficiencies
Holding Steady, Looking Ahead: Annual Findings of a 50-State Survey of Eligibility Rules, Enrollment and Renewal Procedures, and Cost Sharing Practices in Medicaid and CHIP, 2010-2011
Analyzes findings on state trends in maintaining or expanding eligibility for public coverage and improving enrollment and renewal procedures. Highlights the challenges of developing the Web-based eligibility systems required under healthcare reform
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