Eyeriss v2: A Flexible Accelerator for Emerging Deep Neural Networks on Mobile Devices

A recent trend in DNN development is to extend the reach of deep learning applications to platforms that are more resource and energy constrained, e.g., mobile devices. These endeavors aim to reduce the DNN model size and improve the hardware processing efficiency, and have resulted in DNNs that are much more compact in their structures and/or have high data sparsity. These compact or sparse models are different from the traditional large ones in that there is much more variation in their layer shapes and sizes, and often require specialized hardware to exploit sparsity for performance improvement. Thus, many DNN accelerators designed for large DNNs do not perform well on these models. In this work, we present Eyeriss v2, a DNN accelerator architecture designed for running compact and sparse DNNs. To deal with the widely varying layer shapes and sizes, it introduces a highly flexible on-chip network, called hierarchical mesh, that can adapt to the different amounts of data reuse and bandwidth requirements of different data types, which improves the utilization of the computation resources. Furthermore, Eyeriss v2 can process sparse data directly in the compressed domain for both weights and activations, and therefore is able to improve both processing speed and energy efficiency with sparse models. Overall, with sparse MobileNet, Eyeriss v2 in a 65nm CMOS process achieves a throughput of 1470.6 inferences/sec and 2560.3 inferences/J at a batch size of 1, which is 12.6x faster and 2.5x more energy efficient than the original Eyeriss running MobileNet. We also present an analysis methodology called Eyexam that provides a systematic way of understanding the performance limits for DNN processors as a function of specific characteristics of the DNN model and accelerator design; it applies these characteristics as sequential steps to increasingly tighten the bound on the performance limits.Comment: accepted for publication in IEEE Journal on Emerging and Selected Topics in Circuits and Systems. This extended version on arXiv also includes Eyexam in the appendi

NoCo: ILP-based worst-case contention estimation for mesh real-time manycores

Manycores are capable of providing the computational demands required by functionally-advanced critical applications in domains such as automotive and avionics. In manycores a network-on-chip (NoC) provides access to shared caches and memories and hence concentrates most of the contention that tasks suffer, with effects on the worst-case contention delay (WCD) of packets and tasks' WCET. While several proposals minimize the impact of individual NoC parameters on WCD, e.g. mapping and routing, there are strong dependences among these NoC parameters. Hence, finding the optimal NoC configurations requires optimizing all parameters simultaneously, which represents a multidimensional optimization problem. In this paper we propose NoCo, a novel approach that combines ILP and stochastic optimization to find NoC configurations in terms of packet routing, application mapping, and arbitration weight allocation. Our results show that NoCo improves other techniques that optimize a subset of NoC parameters.This work has been partially supported by the Spanish Ministry of Economy and Competitiveness under grant TIN2015- 65316-P and the HiPEAC Network of Excellence. It also received funding from the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation programme (agreement No. 772773). Carles Hernández is jointly supported by the MINECO and FEDER funds through grant TIN2014-60404-JIN. Jaume Abella has been partially supported by the Spanish Ministry of Economy and Competitiveness under Ramon y Cajal postdoctoral fellowship number RYC-2013-14717. Enrico Mezzetti has been partially supported by the Spanish Ministry of Economy and Competitiveness under Juan de la Cierva-Incorporaci´on postdoctoral fellowship number IJCI-2016-27396.Peer ReviewedPostprint (author's final draft

Design of TSV-sharing topologies for cost-effective 3D networks-on-chip

The Through-Silicon Via (TSV) technology has led to major breakthroughs in 3D stacking by providing higher speed and bandwidth, as well as lower power dissipation for the inter-layer communication. However, the current TSV fabrication suffers from a considerable area footprint and yield loss. Thus, it is necessary to restrict the number of TSVs in order to design cost-effective 3D on-chip networks. This critical issue can be addressed by clustering the network such that all of the routers within each cluster share a single TSV pillar for the vertical packet transmission. In some of the existing topologies, additional cluster routers are augmented into the mesh structure to handle the shared TSVs. However, they impose either performance degradation or power/area overhead to the system. Furthermore, the resulting architecture is no longer a mesh. In this paper, we redefine the clusters by replacing some routers in the mesh with the cluster routers, such that the mesh structure is preserved. The simulation results demonstrate a better equilibrium between performance and cost, using the proposed models

Exploring Adaptive Implementation of On-Chip Networks

As technology geometries have shrunk to the deep submicron regime, the communication delay and power consumption of global interconnections in high performance Multi- Processor Systems-on-Chip (MPSoCs) are becoming a major bottleneck. The Network-on- Chip (NoC) architecture paradigm, based on a modular packet-switched mechanism, can address many of the on-chip communication issues such as performance limitations of long interconnects and integration of large number of Processing Elements (PEs) on a chip. The choice of routing protocol and NoC structure can have a significant impact on performance and power consumption in on-chip networks. In addition, building a high performance, area and energy efficient on-chip network for multicore architectures requires a novel on-chip router allowing a larger network to be integrated on a single die with reduced power consumption. On top of that, network interfaces are employed to decouple computation resources from communication resources, to provide the synchronization between them, and to achieve backward compatibility with existing IP cores. Three adaptive routing algorithms are presented as a part of this thesis. The first presented routing protocol is a congestion-aware adaptive routing algorithm for 2D mesh NoCs which does not support multicast (one-to-many) traffic while the other two protocols are adaptive routing models supporting both unicast (one-to-one) and multicast traffic. A streamlined on-chip router architecture is also presented for avoiding congested areas in 2D mesh NoCs via employing efficient input and output selection. The output selection utilizes an adaptive routing algorithm based on the congestion condition of neighboring routers while the input selection allows packets to be serviced from each input port according to its congestion level. Moreover, in order to increase memory parallelism and bring compatibility with existing IP cores in network-based multiprocessor architectures, adaptive network interface architectures are presented to use multiple SDRAMs which can be accessed simultaneously. In addition, a smart memory controller is integrated in the adaptive network interface to improve the memory utilization and reduce both memory and network latencies. Three Dimensional Integrated Circuits (3D ICs) have been emerging as a viable candidate to achieve better performance and package density as compared to traditional 2D ICs. In addition, combining the benefits of 3D IC and NoC schemes provides a significant performance gain for 3D architectures. In recent years, inter-layer communication across multiple stacked layers (vertical channel) has attracted a lot of interest. In this thesis, a novel adaptive pipeline bus structure is proposed for inter-layer communication to improve the performance by reducing the delay and complexity of traditional bus arbitration. In addition, two mesh-based topologies for 3D architectures are also introduced to mitigate the inter-layer footprint and power dissipation on each layer with a small performance penalty.Siirretty Doriast

Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast