Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG

A Holistic Approach to Functional Safety for Networked Cyber-Physical Systems

Functional safety is a significant concern in today's networked cyber-physical systems such as connected machines, autonomous vehicles, and intelligent environments. Simulation is a well-known methodology for the assessment of functional safety. Simulation models of networked cyber-physical systems are very heterogeneous relying on digital hardware, analog hardware, and network domains. Current functional safety assessment is mainly focused on digital hardware failures while minor attention is devoted to analog hardware and not at all to the interconnecting network. In this work we believe that in networked cyber-physical systems, the dependability must be verified not only for the nodes in isolation but also by taking into account their interaction through the communication channel. For this reason, this work proposes a holistic methodology for simulation-based safety assessment in which safety mechanisms are tested in a simulation environment reproducing the high-level behavior of digital hardware, analog hardware, and network communication. The methodology relies on three main automatic processes: 1) abstraction of analog models to transform them into system-level descriptions, 2) synthesis of network infrastructures to combine multiple cyber-physical systems, and 3) multi-domain fault injection in digital, analog, and network. Ultimately, the flow produces a homogeneous optimized description written in C++ for fast and reliable simulation which can have many applications. The focus of this thesis is performing extensive fault simulation and evaluating different functional safety metrics, \eg, fault and diagnostic coverage of all the safety mechanisms

High-level modelling languages

This paper gives an introduction to the latest developments in modern electronic design methodology. It will give a brief history of the evolution of design software in an attempt to explain the seemingly haphazard development up to the present-day situation

Mixed signal design flow, a mixed signal PLL case study

Mixed-signal designs are becoming more and more complex every day. In order to adapt to the new market requirements, a formal process for design and verification of mixed signal systems i. e. top-down design and bottom-up verification methodology is required. This methodology has already been established for digital design. The goal of this research is to propose a new design methodology for mixed signal systems. In the first two chapters of this thesis, the need for a mixed signal design flow based on top-down design methodology will be discussed. The proposed design flow is based on behavioral modeling of the mixed signal system using one of the mixed signal behavioral modeling languages. These models can be used for design and verification through different steps of the design from system level modeling to final physical design. The other advantage of the proposed flow is analog and digital co-design. In the remaining chapters of this thesis, the proposed design flow was verified by designing an 800 MHz mixed signal PLL. The PLL uses a charge pump phase frequency detector, a single capacitor loop filter, and a feed forward error correction architecture using an active damping control circuit instead of passive resistor in loop filter. The design was done in 0. 18- µ m CMOS process technology

Design of a process monitor and of peripheral circuits enabling the characterisation of CMOS 45nm Ultra Low Power and Litho Friendly optimised standard cells

L’evoluzione della tecnologia CMOS è caratterizzata dallo scaling delle dimensioni dei dispositivi e dalla riduzione del consumo di potenza. Dal momento che le difficoltà di realizzazione aumentano al diminuire delle dimensioni, nei nodi tecnologici più recenti la velocità del processo di scaling sta diminuendo. Uno dei maggiori problemi causati dalla riduzione delle dimensioni dei dispositivi è la variabilità del processo di fabbricazione. L’obiettivo di questo progetto è quello di ridurre gli effetti che la variabilità del processo di realizzazione nel nodo tecnologico CMOS 45 nm ha sulle prestazioni della logica digitale, grazie a metodi di design non convenzionali. In questo progetto è stato realizzato un testchip per studiare e quantificare i vantaggi, in termini di prestazioni, ottenuti tramite la progettazione di librerie standard-like ottimizzate secondo canoni di litho-friendliness (LF) e ultra low power (ULP). Le standard cells LF utilizzano layout estremamente regolari. Le standard cells ULP sono progettate per operare con tensioni di alimentazioni notevolmente ridotte. Il fine principale del testchip sta nell’ottenere una panoramica della variabilità locale e globale di parametri significativi nella progettazione digitale: ad esempio la frequenza di lavoro e il consumo di potenza. Inoltre, nel testchip sono stati realizzati alcuni circuiti originali per il monitoraggio della qualità del processo di fabbricazione. The evolution of the CMOS technology is characterized by the scaling of transistors size and by the reduction of their power dissipation. In the last technology nodes the speed of the scaling process is decreasing, since the complexity of the technology increases with its size reduction. One of the main issues caused by the shrinking of the transistor size is the variability of the fabrication process. The target of this project is to reduce the effects of the variability of the realisation process in a CMOS 45 nm technology node in digital circuits performances, using unconventional design methods. A testchip is realised in this project to investigate and to quantify the improvement of the circuit performances obtained through the design of dedicated litho-friendly (LF) and of the Ultra Low Power (ULP) standard-like libraries. The LF standard cells libraries are optimised for lithography using ultra regular layout styles. The ULP standard cells library is optimised to operate at extremely low supply voltage. The main aim of the testchip is to get insight into the local and the global variability of relevant parameters for digital design, such as operating frequency and power consumption. In this testchip some structures are also included, to develop some innovative circuits that should help to monitor the quality of the technology process

Moving Towards Analog Functional Safety

Over the past century, the exponential growth of the semiconductor industry has led to the creation of tiny and complex integrated circuits, e.g., sensors, actuators, and smart power systems. Innovative techniques are needed to ensure the correct functionality of analog devices that are ubiquitous in every smart system. The standard ISO 26262 related to functional safety in the automotive context specifies that fault injection is necessary to validate all electronic devices. For decades, standardizing fault modeling, injection and simulation mainly focused on digital circuits and disregarding analog ones. An initial attempt is being made with the IEEE P2427 standard draft standard that started to give this field a structured and formal organization. In this context, new fault models, injection, and abstraction methodologies for analog circuits are proposed in this thesis to enhance this application field. The faults proposed by the IEEE P2427 standard draft standard are initially evaluated to understand the associated fault behaviors during the simulation. Moreover, a novel approach is presented for modeling realistic stuck-on/off defects based on oxide defects. These new defects proposed are required because digital stuck-at-fault models where a transistor is frozen in on-state or offstate may not apply well on analog circuits because even a slight variation could create deviations of several magnitudes. Then, for validating the proposed defects models, a novel predictive fault grouping based on faulty AC matrices is applied to group faults with equivalent behaviors. The proposed fault grouping method is computationally cheap because it avoids performing DC or transient simulations with faults injected and limits itself to faulty AC simulations. Using AC simulations results in two different methods that allow grouping faults with the same frequency response are presented. The first method is an AC-based grouping method that exploits the potentialities of the S-parameters ports. While the second is a Circle-based grouping based on the circle-fitting method applied to the extracted AC matrices. Finally, an open-source framework is presented for the fault injection and manipulation perspective. This framework relies on the shared semantics for reading, writing, or manipulating transistor-level designs. The ultimate goal of the framework is: reading an input design written in a specific syntax and then allowing to write the same design in another syntax. As a use case for the proposed framework, a process of analog fault injection is discussed. This activity requires adding, removing, or replacing nodes, components, or even entire sub-circuits. The framework is entirely written in C++, and its APIs are also interfaced with Python. The entire framework is open-source and available on GitHub. The last part of the thesis presents abstraction methodologies that can abstract transistor level models into Verilog-AMS models and Verilog- AMS piecewise and nonlinear models into C++. These abstracted models can be integrated into heterogeneous systems. The purpose of integration is the simulation of heterogeneous components embedded in a Virtual Platforms (VP) needs to be fast and accurate

Multi-Domain Fault Models Covering the Analog Side of a Smart or Cyber-Physical System

Over the last decade, the industrial world has been involved in a massive revolution guided by the adoption of digital technologies. In this context, complex systems like cyber-physical systems play a fundamental role since they were designed and realized by composing heterogeneous components. The combined simulation of the behavioral models of these components allows to reproduce the nominal behavior of the real system. Similarly, a smart system is a device that integrates heterogeneous components but in a miniaturized form factor. The development of smart or cyber-physical systems, in combination with faulty behaviors modeled for the different physical domains composing the system, enables to support advanced functional safety assessment at the system level. A methodology to create and inject multi-domain fault models in the analog side of these systems has been proposed by exploiting the physical analogy between the electrical and mechanical domains to infer a new mechanical fault taxonomy. Thus, standard electrical fault models are injected into the electrical part, while the derived mechanical fault models are injected directly into the mechanical part. The entire flow has been applied to two case studies: a direct current motor connected with a gear train, and a three-axis accelerometer

Energy Detection UWB Receiver Design using a Multi-resolution VHDL-AMS Description

Ultra Wide Band (UWB) impulse radio systems are appealing for location-aware applications. There is a growing interest in the design of UWB transceivers with reduced complexity and power consumption. Non-coherent approaches for the design of the receiver based on energy detection schemes seem suitable to this aim and have been adopted in the project the preliminary results of which are reported in this paper. The objective is the design of a UWB receiver with a top-down methodology, starting from Matlab-like models and refining the description down to the final transistor level. This goal will be achieved with an integrated use of VHDL for the digital blocks and VHDL-AMS for the mixed-signal and analog circuits. Coherent results are obtained using VHDL-AMS and Matlab. However, the CPU time cost strongly depends on the description used in the VHDL-AMS models. In order to show the functionality of the UWB architecture, the receiver most critical functions are simulated showing results in good agreement with the expectations

A VHDL-AMS Modeling Methodology for Top-Down/Bottom-Up Design of RF Systems

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