Multi-level simulation of nano-electronic digital circuits on GPUs

Simulation of circuits and faults is an essential part in design and test validation tasks of contemporary nano-electronic digital integrated CMOS circuits. Shrinking technology processes with smaller feature sizes and strict performance and reliability requirements demand not only detailed validation of the functional properties of a design, but also accurate validation of non-functional aspects including the timing behavior. However, due to the rising complexity of the circuit behavior and the steady growth of the designs with respect to the transistor count, timing-accurate simulation of current designs requires a lot of computational effort which can only be handled by proper abstraction and a high degree of parallelization. This work presents a simulation model for scalable and accurate timing simulation of digital circuits on data-parallel graphics processing unit (GPU) accelerators. By providing compact modeling and data-structures as well as through exploiting multiple dimensions of parallelism, the simulation model enables not only fast and timing-accurate simulation at logic level, but also massively-parallel simulation with switch level accuracy. The model facilitates extensions for fast and efficient fault simulation of small delay faults at logic level, as well as first-order parametric and parasitic faults at switch level. With the parallelization on GPUs, detailed and scalable simulation is enabled that is applicable even to multi-million gate designs. This way, comprehensive analyses of realistic timing-related faults in presence of process- and parameter variations are enabled for the first time. Additional simulation efficiency is achieved by merging the presented methods in a unified simulation model, that allows to combine the unique advantages of the different levels of abstraction in a mixed-abstraction multi-level simulation flow to reach even higher speedups. Experimental results show that the implemented parallel approach achieves unprecedented simulation throughput as well as high speedup compared to conventional timing simulators. The underlying model scales for multi-million gate designs and gives detailed insights into the timing behavior of digital CMOS circuits, thereby enabling large-scale applications to aid even highly complex design and test validation tasks

Efficient algorithms for fundamental statistical timing analysis problems in delay test applications of VLSI circuits

Tremendous advances in semiconductor process technology are creating new challenges for the delay test of today’s digital VLSI circuits. The complexity of state-of-the-art manufacturing processes does not only lead to greater process variability, it also makes today's integrated circuits more prone to defects such as resistive shorts and opens. As a consequence, some of the manufactured circuits do not meet the timing requirements set by the design specification. These circuits must be identified by delay testing and sorted out to ensure the quality of shipped products. Due to the increasing process variability, key transistor and interconnect parameters must be modelled as random variables. These random variables capture the uncertainty caused by process variability, but also the impact of modelling errors and variations in the operating conditions of the circuits, such as the temperature or the supply voltage. The important consequence for delay testing is that a particular delay test detects a delay fault of fixed size in only a subset of all manufactured circuits, which inevitably leads to the shipment of defective products. Despite the fact that this problem is well understood, today's delay test generation methods are unable to consider the distortion of the delay test results, caused by process variability. To analyse and predict the effectiveness of delay tests in a population of circuits which are functionally identical but have varying timing properties, statistical timing analysis is necessary. Although the large runtime of statistical timing analysis is a well known problem, little progress has been made in the development of efficient statistical timing analysis algorithms for the variability-aware delay test generation and delay fault simulation. This dissertation proposes novel and efficient statistical timing analysis algorithms for the variability-aware delay test generation and delay fault simulation in presence of large delay variations. For the detection of path delay faults, a novel probabilistic sensitization analysis is presented which analyses the impact of process variations on the sensitization of the target paths. Furthermore, an efficient method for approximating the probability of detecting small delay faults is presented. Beyond that, efficient statistical SUM and MAX-operations are proposed, which provide the fundamental basis of block-based statistical timing analysis. The experiment results demonstrate the high efficiency of the proposed algorithms

Design for prognostics and security in field programmable gate arrays (FPGAs).

There is an evolutionary progression of Field Programmable Gate Arrays (FPGAs) toward more complex and high power density architectures such as Systems-on- Chip (SoC) and Adaptive Compute Acceleration Platforms (ACAP). Primarily, this is attributable to the continual transistor miniaturisation and more innovative and efficient IC manufacturing processes. Concurrently, degradation mechanism of Bias Temperature Instability (BTI) has become more pronounced with respect to its ageing impact. It could weaken the reliability of VLSI devices, FPGAs in particular due to their run-time reconfigurability. At the same time, vulnerability of FPGAs to device-level attacks in the increasing cyber and hardware threat environment is also quadrupling as the susceptible reliability realm opens door for the rogue elements to intervene. Insertion of highly stealthy and malicious circuitry, called hardware Trojans, in FPGAs is one of such malicious interventions. On the one hand where such attacks/interventions adversely affect the security ambit of these devices, they also undermine their reliability substantially. Hitherto, the security and reliability are treated as two separate entities impacting the FPGA health. This has resulted in fragmented solutions that do not reflect the true state of the FPGA operational and functional readiness, thereby making them even more prone to hardware attacks. The recent episodes of Spectre and Meltdown vulnerabilities are some of the key examples. This research addresses these concerns by adopting an integrated approach and investigating the FPGA security and reliability as two inter-dependent entities with an additional dimension of health estimation/ prognostics. The design and implementation of a small footprint frequency and threshold voltage-shift detection sensor, a novel hardware Trojan, and an online transistor dynamic scaling circuitry present a viable FPGA security scheme that helps build a strong microarchitectural level defence against unscrupulous hardware attacks. Augmented with an efficient Kernel-based learning technique for FPGA health estimation/prognostics, the optimal integrated solution proves to be more dependable and trustworthy than the prevalent disjointed approach.Samie, Mohammad (Associate)PhD in Transport System

MC 2019 Berlin Microscopy Conference - Abstracts

Das Dokument enthält die Kurzfassungen der Beiträge aller Teilnehmer an der Mikroskopiekonferenz "MC 2019", die vom 01. bis 05.09.2019, in Berlin stattfand

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

SPATIAL TRANSFORMATION PATTERN DUE TO COMMERCIAL ACTIVITY IN KAMPONG HOUSE

ABSTRACT Kampung houses are houses in kampung area of the city. Kampung House oftenly transformed into others use as urban dynamics. One of the transfomation is related to the commercial activities addition by the house owner. It make house with full private space become into mixused house with more public spaces or completely changed into full public commercial building. This study investigate the spatial transformation pattern of the kampung houses due to their commercial activities addition. Site observations, interviews and questionnaires were performed to study the spatial transformation. This study found that in kampung houses, the spatial transformation pattern was depend on type of commercial activities and owner perceptions, and there are several steps of the spatial transformation related the commercial activity addition. Keywords: spatial transformation pattern; commercial activity; owner perception, kampung house; adaptabilit

Detectability Challenges of Bridge Defects in FinFET Based Logic Cells

International audienceSince 22nm technology node, FinFET technology is an attractive candidate for high-performance and power-efficient applications. This is achieved due to better channel control in FinFET devices obtained by wrapping a metal gate around a thin fin. In this paper, we investigate the detectability of bridge defects in FinFET based logic cells that make use of Middle-Of-Line (MOL) interconnections and multi-fin and multi-finger design strategies. The use of MOL to build the logic cells impacts the possible bridge defect locations and the likelihood of occurrence of the defect. Some defect locations unlikely to appear in planar CMOS now become more likely to occur due to the use of MOL. It is shown that these defects are difficult to be detected. The detectability of bridge defects has been analyzed for gates with different drive strengths and fan-in, and also extended to the different type of gates. A metric called Bridge Defect Criticality (BDC) is used to identify the most harmful bridge defects. This metric depends on the degree of detectability and likelihood of occurrence of a bridge defect. More design and/or test effort may be dedicated to those defects with higher a value of the BDC metric to improve product quality