Design Time Optimization for Hardware Watermarking Protection of HDL Designs

HDL-level design offers important advantages for the application of watermarking to IP cores, but its complexity also requires tools automating these watermarking algorithms. A new tool for signature distribution through combinational logic is proposed in this work. IPP@HDL, a previously proposed high-level watermarking technique, has been employed for evaluating the tool. IPP@HDL relies on spreading the bits of a digital signature at the HDL design level using combinational logic included within the original system. The development of this new tool for the signature distribution has not only extended and eased the applicability of this IPP technique, but it has also improved the signature hosting process itself. Three algorithms were studied in order to develop this automated tool. The selection of a cost function determines the best hosting solutions in terms of area and performance penalties on the IP core to protect. An 1D-DWT core and MD5 and SHA1 digital signatures were used in order to illustrate the benefits of the new tool and its optimization related to the extraction logic resources. Among the proposed algorithms, the alternative based on simulated annealing reduces the additional resources while maintaining an acceptable computation time and also saving designer effort and time

Variability-driven module selection with joint design time optimization and post-silicon tuning

Abstract—Increasing delay and power variation are significant chal-lenges to the designers as technology scales to the deep sub-micron (DSM) regime. Traditional module selection techniques in high level synthesis use worst case delay/power information to perform the optimization, and therefore may be too pessimistic such that extra resources are used to guarantee design requirements. Parametric yield, which is defined as the probability of the synthesized hardware meeting the performance/power constraints, can be used to guide design space exploration. The para-metric yield can be effectively improved by combining both design-time variation-aware optimization and post silicon tuning techniques (such as adaptive body biasing (ABB)). In this paper, we propose a module selection algorithm that combines design-time optimization with post-silicon tuning (using ABB) to maximize design yield. A variation-aware module selection algorithm based on efficient performance and power yield gradient computation is developed. The post silicon optimization is formulated as an efficient sequential conic program to determine the optimal body bias distribution, which in turn affects design-time module selection. The experiment results show that significant yield can be achieved compared to traditional worst-case driven module selection technique. To the best of our knowledge, this is the first variability-driven high level synthesis technique that considers post-silicon tuning during design time optimization. 1 I

Characterization and Optimization of Integrated Silicon-Photonic Neural Networks under Fabrication-Process Variations

Silicon-photonic neural networks (SPNNs) have emerged as promising successors to electronic artificial intelligence (AI) accelerators by offering orders of magnitude lower latency and higher energy efficiency. Nevertheless, the underlying silicon photonic devices in SPNNs are sensitive to inevitable fabrication-process variations (FPVs) stemming from optical lithography imperfections. Consequently, the inferencing accuracy in an SPNN can be highly impacted by FPVs -- e.g., can drop to below 10% -- the impact of which is yet to be fully studied. In this paper, we, for the first time, model and explore the impact of FPVs in the waveguide width and silicon-on-insulator (SOI) thickness in coherent SPNNs that use Mach-Zehnder Interferometers (MZIs). Leveraging such models, we propose a novel variation-aware, design-time optimization solution to improve MZI tolerance to different FPVs in SPNNs. Simulation results for two example SPNNs of different scales under realistic and correlated FPVs indicate that the optimized MZIs can improve the inferencing accuracy by up to 93.95% for the MNIST handwritten digit dataset -- considered as an example in this paper -- which corresponds to a <0.5% accuracy loss compared to the variation-free case. The proposed one-time optimization method imposes low area overhead, and hence is applicable even to resource-constrained design

A RISC-V Vector Processor With Simultaneous-Switching Switched-Capacitor DC-DC Converters in 28 nm FDSOI

This work demonstrates a RISC-V vector microprocessor implemented in 28 nm FDSOI with fully integrated simultaneous-switching switched-capacitor DC-DC (SC DC-DC) converters and adaptive clocking that generates four on-chip voltages between 0.45 and 1 V using only 1.0 V core and 1.8 V IO voltage inputs. The converters achieve high efficiency at the system level by switching simultaneously to avoid charge-sharing losses and by using an adaptive clock to maximize performance for the resulting voltage ripple. Details about the implementation of the DC-DC switches, DC-DC controller, and adaptive clock are provided, and the sources of conversion loss are analyzed based on measured results. This system pushes the capabilities of dynamic voltage scaling by enabling fast transitions (20 ns), simple packaging (no off-chip passives), low area overhead (16%), high conversion efficiency (80%-86%), and high energy efficiency (26.2 DP GFLOPS/W) for mobile devices

Master of Science

thesisThis thesis designs, implements, and evaluates modular Open Core Protocol (OCP) interfaces for Intellectual Property (IP) cores and Network-on-Chip (NoC) that re- duces System-On-Chip (SoC) design time and enables research on di erent architectural sequencing control methods. To utilize the NoCs design time optimization feature at the boundaries, a standardized industry socket was required, which can address the SoC shorter time-to-market requirements, design issues, and also the subsequent reuse of developed IP cores. OCP is an open industry standard socket interface speci cation used in this research to enable the IP cores reusability across multiple SoC designs. This research work designs and implements clocked OCP interfaces between IP cores and On-Chip Network Fabric (NoC), in single- and multi- frequency clocked domains. The NoC interfaces between IP cores and on-chip network fabric are implemented using the standard network interface structure. It consists of back-end and front-end submodules corresponding to customized interfaces to IP cores or network fabric and OCP Master and Slave entities, respectively. A generic domain interface (DI) protocol is designed which acts as the bridge between back-end and front-end submodules for synchronization and data ow control. Clocked OCP interfaces are synthesized, placed and routed using IBM's 65nm process technology. The implemented designs are veri ed for OCP compliance using SOLV (Sonics OCP Library for Veri cation). Finally, this thesis reports the performance metrics such as design target frequency of operation, latency, area, energy per transaction, and maximum bandwidth across network on-chip for single- and multifrequency clocked designs

Monitor-Based In-Field Wearout Mitigation for CMOS RF Integrated Circuits

abstract: Performance failure due to aging is an increasing concern for RF circuits. While most aging studies are focused on the concept of mean-time-to-failure, for analog circuits, aging results in continuous degradation in performance before it causes catastrophic failures. In this regard, the lifetime of RF/analog circuits, which is defined as the point where at least one specification fails, is not just determined by aging at the device level, but also by the slack in the specifications, process variations, and the stress conditions on the devices. In this dissertation, firstly, a methodology for analyzing the performance degradation of RF circuits caused by aging mechanisms in MOSFET devices at design-time (pre-silicon) is presented. An algorithm to determine reliability hotspots in the circuit is proposed and design-time optimization methods to enhance the lifetime by making the most likely to fail circuit components more reliable is performed. RF circuits are used as test cases to demonstrate that the lifetime can be enhanced using the proposed design-time technique with low area and no performance impact. Secondly, in-field monitoring and recovering technique for the performance of aged RF circuits is discussed. The proposed in-field technique is based on two phases: During the design time, degradation profiles of the aged circuit are obtained through simulations. From these profiles, hotspot identification of aged RF circuits are conducted and the circuit variable that is easy to measure but highly correlated to the performance of the primary circuit is determined for a monitoring purpose. After deployment, an on-chip DC monitor is periodically activated and its results are used to monitor, and if necessary, recover the circuit performances degraded by aging mechanisms. It is also necessary to co-design the monitoring and recovery mechanism along with the primary circuit for minimal performance impact. A low noise amplifier (LNA) and LC-tank oscillators are fabricated for case studies to demonstrate that the lifetime can be enhanced using the proposed monitoring and recovery techniques in the field. Experimental results with fabricated LNA/oscillator chips show the performance degradation from the accelerated stress conditions and this loss can be recovered by the proposed mitigation scheme.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Thermal/performance trade-off in network-on-chip architectures

Multi-core architectures are a promising paradigm to exploit the huge integration density reached by high-performance systems. Indeed, integration density and technology scaling are causing undesirable operating temperatures, having net impact on reduced reliability and increased cooling costs. Dynamic Thermal Management (DTM) approaches have been proposed in literature to control temperature profile at run-time, while design-time approaches generally provide floorplan-driven solutions to cope with temperature constraints. Nevertheless, a suitable approach to collect performance, thermal and reliability metrics has not been proposed, yet. This work presents a novel methodology to jointly optimize temperature/performance trade-off in reliable high-performance parallel architectures with security constraints achieved by workload physical isolation on each core. The proposed methodology is based on a linear formal model relating temperature and duty-cycle on one side, and performance and duty-cycle on the other side. Extensive experimental results on real-world use-case scenarios show the goodness of the proposed model, suitable for design-time system-wide optimization to be used in conjunction with DTM technique

Hermeneutics framework: integration of design rationale and optimizing software modules

To tackle the evolution challenges of adaptive systems, this paper argues on the necessity of hermeneutic approaches that help to avoid too early elimination of design alternatives. This visionary paper proposes the Hermeneutics Framework, which computationally integrates a design rationale management system, an auto-adaptive control system and a reflective and modular event-driven language runtime together. The Hermeneutics Framework is, among others, suitable for implementing dynamic adaptive software systems that undergo intensive evolution cycles

TSV placement optimization for liquid cooled 3D-ICs with emerging NVMs

Three dimensional integrated circuits (3D-ICs) are a promising solution to the performance bottleneck in planar integrated circuits. One of the salient features of 3D-ICs is their ability to integrate heterogeneous technologies such as emerging non-volatile memories (NVMs) in a single chip. However, thermal management in 3D-ICs is a significant challenge, owing to the high heat flux (~ 250 W/cm2). Several research groups have focused either on run-time or design-time mechanisms to reduce the heat flux and did not consider 3D-ICs with heterogeneous stacks. The goal of this work is to achieve a balanced thermal gradient in 3D-ICs, while reducing the peak temperatures. In this research, placement algorithms for design-time optimization and choice of appropriate cooling mechanisms for run-time modulation of temperature are proposed. Specifically, an architectural framework which introduce weight-based simulated annealing (WSA) algorithm for thermal-aware placement of through silicon vias (TSVs) with inter-tier liquid cooling is proposed for design-time. In addition, integrating a dedicated stack of emerging NVMs such as RRAM, PCRAM and STTRAM, a run-time simulation framework is developed to analyze the thermal and performance impact of these NVMs in 3D-MPSoCs with inter-tier liquid cooling. Experimental results of WSA algorithm implemented on MCNC91 and GSRC benchmarks demonstrate up to 11 K reduction in the average temperature across the 3D-IC chip. In addition, power density arrangement in WSA improved the uniformity by 5%. Furthermore, simulation results of PARSEC benchmarks with NVM L2 cache demonstrates a temperature reduction of 12.5 K (RRAM) compared to SRAM in 3D-ICs. Especially, RRAM has proved to be thermally efficient replacement for SRAM with 34% lower energy delay product (EDP) and 9.7 K average temperature reduction