Concepts and methods in optimization of integrated LC VCOs

Underlying physical mechanisms controlling the noise properties of oscillators are studied. This treatment shows the importance of inductance selection for oscillator noise optimization. A design strategy centered around an inductance selection scheme is executed using a practical graphical optimization method to optimize phase noise subject to design constraints such as power dissipation, tank amplitude, tuning range, startup condition, and diameters of spiral inductors. The optimization technique is demonstrated through a design example, leading to a 2.4-GHz fully integrated, LC voltage-controlled oscillator (VCO) implemented using 0.35-μm MOS transistors. The measured phase-noise values are -121, -117, and -115 dBc/Hz at 600-kHz offset from 1.91, 2.03, and 2.60-GHz carriers, respectively. The VCO dissipates 4 mA from a 2.5-V supply voltage. The inversion mode MOSCAP tuning is used to achieve 26% of tuning range. Two figures of merit for performance comparison of various oscillators are introduced and used to compare this work to previously reported results

Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems

In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads

Design of a 3 GHz fine resolution LC DCO

In this thesis, the design of a fine resolution LC digitally controlled oscillator (DCO) is introduced. Two NMOS varactor banks are used to achieve 12 bits medium and fine frequency tuning. Both delta-sigma modulator and capacitive divider circuit are implemented to achieve a finer resolution and a larger dynamic range. The LC-oscillator has a coarse tuning range from 3.05 GHz to 3.85 GHz and a fine tuning range of 50MHz. It features a phase noise level of -115dBc/Hz at 1MHz frequency offset and consumes 5.4mW. Efficient simulation methodology is explored. Finally, this DCO is simulated in an All-Digital Phase Locked Loop (ADPLL) with other ideal behavior blocks implemented using Verilog-A, and the performance of the DCO is evaluated.Electrical and Computer Engineerin

A Low-Power BFSK/OOK Transmitter for Wireless Sensors

In recent years, significant improvements in semiconductor technology have allowed consistent development of wireless chipsets in terms of functionality and form factor. This has opened up a broad range of applications for implantable wireless sensors and telemetry devices in multiple categories, such as military, industrial, and medical uses. The nature of these applications often requires the wireless sensors to be low-weight and energy-efficient to achieve long battery life. Among the various functions of these sensors, the communication block, used to transmit the gathered data, is typically the most power-hungry block. In typical wireless sensor networks, transmission range is below 10 meters and required radiated power is below 1 milliwatt. In such cases, power consumption of the frequency-synthesis circuits prior to the power amplifier of the transmitter becomes significant. Reducing this power consumption is currently the focus of various research endeavors. A popular method of achieving this goal is using a direct-modulation transmitter where the generated carrier is directly modulated with baseband data using simple modulation schemes. Among the different variations of direct-modulation transmitters, transmitters using unlocked digitally-controlled oscillators and transmitters with injection or resonator-locked oscillators are widely investigated because of their simple structure. These transmitters can achieve low-power and stable operation either with the help of recalibration or by sacrificing tuning capability. In contrast, phase-locked-loop-based (PLL) transmitters are less researched. The PLL uses a feedback loop to lock the carrier to a reference frequency with a programmable ratio and thus achieves good frequency stability and convenient tunability. This work focuses on PLL-based transmitters. The initial goal of this work is to reduce the power consumption of the oscillator and frequency divider, the two most power-consuming blocks in a PLL. Novel topologies for these two blocks are proposed which achieve ultra-low-power operation. Along with measured performance, mathematical analysis to derive rule-of-thumb design approaches are presented. Finally, the full transmitter is implemented using these blocks in a 130 nanometer CMOS process and is successfully tested for low-power operation

Study Of Design For Reliability Of Rf And Analog Circuits

Due to continued device dimensions scaling, CMOS transistors in the nanometer regime have resulted in major reliability and variability challenges. Reliability issues such as channel hot electron injection, gate dielectric breakdown, and negative bias temperature instability (NBTI) need to be accounted for in the design of robust RF circuits. In addition, process variations in the nanoscale CMOS transistors are another major concern in today‟s circuits design. An adaptive gate-source biasing scheme to improve the RF circuit reliability is presented in this work. The adaptive method automatically adjusts the gate-source voltage to compensate the reduction in drain current subjected to various device reliability mechanisms. A class-AB RF power amplifier shows that the use of a source resistance makes the power-added efficiency robust against threshold voltage and mobility variations, while the use of a source inductance is more reliable for the input third-order intercept point. A RF power amplifier with adaptive gate biasing is proposed to improve the circuit device reliability degradation and process variation. The performances of the power amplifier with adaptive gate biasing are compared with those of the power amplifier without adaptive gate biasing technique. The adaptive gate biasing makes the power amplifier more resilient to process variations as well as the device aging such as mobility and threshold voltage degradation. Injection locked voltage-controlled oscillators (VCOs) have been examined. The VCOs are implemented using TSMC 0.18 µm mixed-signal CMOS technology. The injection locked oscillators have improved phase noise performance than free running oscillators. iv A differential Clapp-VCO has been designed and fabricated for the evaluation of hot electron reliability. The differential Clapp-VCO is formed using cross-coupled nMOS transistors, on-chip transformers/inductors, and voltage-controlled capacitors. The experimental data demonstrate that the hot carrier damage increases the oscillation frequency and degrades the phase noise of Clapp-VCO. A p-channel transistor only VCO has been designed for low phase noise. The simulation results show that the phase noise degrades after NBTI stress at elevated temperature. This is due to increased interface states after NBTI stress. The process variability has also been evaluated

RF CMOS Oscillators for Modern Wireless Applications

While mobile phones enjoy the largest production volume ever of any consumer electronics products, the demands they place on radio-frequency (RF) transceivers are particularly aggressive, especially on integration with digital processors, low area, low power consumption, while being robust against process-voltage-temperature variations. Since mobile terminals inherently operate on batteries, their power budget is severely constrained. To keep up with the ever increasing data-rate, an ever-decreasing power per bit is required to maintain the battery lifetime. The RF oscillator is the second most power-hungry block of a wireless radio (after power amplifiers). Consequently, any power reduction in an RF oscillator will greatly benefit the overall power efficiency of the cellular transceiver. Moreover, the RF oscillators' purity limits the transceiver performance. The oscillator's phase noise results in power leakage into adjacent channels in a transmit mode and reciprocal mixing in a receive mode. On the other hand, the multi-standard and multi-band transceivers that are now trending demand wide tuning range oscillators. However, broadening the oscillator’s tuning range is usually at the expense of die area (cost) or phase noise. The main goal of this book is to bring forth the exciting and innovative RF oscillator structures that demonstrate better phase noise performance, lower cost, and higher power efficiency than currently achievable. Technical topics discussed in RF CMOS Oscillators for Modern Wireless Applications include: Design and analysis of low phase-noise class-F oscillators Analyze a technique to reduce 1/f noise up-conversion in the oscillators Design and analysis of low power/low voltage oscillators Wide tuning range oscillators Reliability study of RF oscillators in nanoscale CMO

Design of VCOs in Deep Sub-micron Technologies

This work will present a more accurate frequency prediction model for single-ended ring oscillators (ROs), a case-study comparing different ROs, and a design method for LC voltage-controlled oscillators (LCVCOs) that uses a MATLAB script based on analytical equations to output a graphical design space showing performance characteristics as a function of design parameters. Using this method, design trade-offs become clear, and the designer can choose which performance characteristics to optimize. These methods were used to design various topologies of ring oscillators and LCVCOs in the GlobalFoundries 28 nm HPP CMOS technology, comparing the performance between different topologies based on simulation results. The results from the MATLAB design script were compared to simulation results as well to show the effectiveness of the design methods. Three varieties of 5 GHz voltage controlled ring oscillators were designed in the GlobalFoundries 28 nm HPP CMOS technology. The first is a low current low dropout regulator (LDO) tuned ring oscillator designed with thin oxide devices and a 0.85 V supply. The second is a high current LDO-tuned ring oscillator designed with medium oxide devices and a 1.5 V supply. The third is varactor-tuned ring oscillator with no LDO, and 0.85 V supply. Performance comparison of these ring oscillator systems are presented, outlining trade-offs between tuning range, phase noise, power dissipation, and area. The varactor-tuned ring oscillator exhibits 8.89 dBc/Hz (with power supply noise) and 16.27 dBc/Hz (without power supply noise) improvement in phase noise over the best-performing LDO-tuned ring oscillator. There are advantages in average power dissipation and area for a minimal tradeoff in tuning range with the varactor-tuned ring oscillator. Four multi-GHz LCVCOs were designed in the GlobalFoundries 28 nm HPP CMOS technology: 15 GHz varactor-tuned NMOS-only, 9 GHz varactor-tuned self-biased CMOS, 14.2 GHz digitally-tuned NMOS-only, and 8.2 GHz digitally-tuned self-biased CMOS. As a design method, analytical ex-pressions describing tuning range, tank amplitude constraint, and startup condition were used in MATLAB to output a graphical view of the design space for both NMOS-only and CMOS LCVCOs, with maximum varactor capacitance on the y-axis and NMOS transistor width on the x-axis. Phase noise was predicted as well. In addition to the standard varactor control voltage tuning method, digitally-tuned implementations of both NMOS and CMOS LCVCOs are presented. The performance aspects of all designed LCVCOs are compared. Both varactor-tuned and digitally-tuned NMOS LCVCOs have lower phase noise, lower power consumption, and higher tuning range than both CMOS topologies. The varactor-tuned NMOS LCVCO has the lowest phase noise of -97 dBc/Hz at 1 MHz offset from 15 GHz center frequency, FOM of -172.20 dBc/Hz, and FOMT of -167.76 dBc/Hz. The digitally-tuned CMOS LCVCO has the greatest tuning range at 10%. Phase noise is improved by 3 dBc/Hz with the digitally-tuned CMOS topology over varactor-tuned CMOS