Power and Area Efficient Design of Network-on-Chip Router through Utilization

Abstract Network-on-Chip (NoC) is the interconnection platform that answers the requirements of the modern on-Chip design. Small optimizations in NoC router architecture can show a significant improvement in the overall performance of NoC based systems. Power consumption, area overhead and the entire NoC performance is influenced by the router buffers. Resource sharing for on-chip network is critical to reduce the chip area and power consumption. Virtual channel buffer sharing by other router ports has been proposed to enhance the performance of on-chip communication. We approach the router architecture optimization by utilizing the idle buffers instead of increasing the number and size of buffers for desired throughput

A new approach to switch fabrics based on mini-router grids and output queueing

A number of switch fabric architectures based on mini-router grids (MRG) have been proposed as a replacement of buses for system-on-chip communication, as well as a replacement of crossbars for network routers. The rationale for using MRGs in switch fabrics is that they provide high delivery ratios, low latencies, high degree of parallelism and pipelining, load balancing properties, and sub-quadratic cost growth for their implementation. The traditional approaches to switch fabrics are based on input queuing (IQ) or virtual output queueing (VOQ), because output queuing (OQ) solutions to date are unscalable and expensive due to the speedup problem. However, we show that the speedup problem introduced by OQ can be bounded by 3 by using MRGs.We present the design of a switch fabric based on OQ MRGs that offers high delivery ratios, smaller queue sizes, and QoS guarantees. Queueing and scheduling are distributed over the MRs, where each MR is a pipestage, thus allowing MRGs to provide high throughput by nature. We present the first in-depth analytical model of switch fabric architectures based on OQ MRG, and support our model with register-transfer level (RTL) simulations in SystemC. The analytical and simulation results are shown to have close correlation over a range of design parameters and evaluation metrics

Méthodologies de conception ASIC pour des systèmes sur puce 3D hétérogènes à base de réseaux sur puce 3D

Dans cette thèse, nous étudions les architectures 3D NoC grâce à des implémentations de conception physiques en utilisant la technologie 3D réel mis en oeuvre dans l'industrie. Sur la base des listes d'interconnexions en déroute, nous procédons à l'analyse des performances d'évaluer le bénéfice de l'architecture 3D par rapport à sa mise en oeuvre 2D. Sur la base du flot de conception 3D proposé en se concentrant sur la vérification temporelle tirant parti de l'avantage du retard négligeable de la structure de microbilles pour les connexions verticales, nous avons mené techniques de partitionnement de NoC 3D basé sur l'architecture MPSoC y compris empilement homogène et hétérogène en utilisant Tezzaron 3D IC technlogy. Conception et mise en oeuvre de compromis dans les deux méthodes de partitionnement est étudiée pour avoir un meilleur aperçu sur l'architecture 3D de sorte qu'il peut être exploitée pour des performances optimales. En utilisant l'approche 3D homogène empilage, NoC topologies est explorée afin d'identifier la meilleure topologie entre la topologie 2D et 3D pour la mise en œuvre MPSoC 3D sous l'hypothèse que les chemins critiques est fondée sur les liens inter-routeur. Les explorations architecturales ont également examiné les différentes technologies de traitement. mettant en évidence l'effet de la technologie des procédés à la performance d'architecture 3D en particulier pour l'interconnexion dominant du design. En outre, nous avons effectué hétérogène 3D d'empilage pour la mise en oeuvre MPSoC avec l'approche GALS de style et présenté plusieurs analyses de conception physiques connexes concernant la conception 3D et la mise en œuvre MPSoC utilisant des outils de CAO 2D. Une analyse plus approfondie de l'effet microbilles pas à la performance de l'architecture 3D à l'aide face-à-face d'empilement est également signalé l'identification des problèmes et des limitations à prendre en considération pendant le processus de conception.In this thesis, we study the exploration 3D NoC architectures through physical design implementations using real 3D technology used in the industry. Based on the proposed 3D design flow focusing on timing verification by leveraging the benefit of negligible delay of microbumps structure for vertical connections, we have conducted partitioning techniques for 3D NoC-based MPSoC architecture including homogeneous and heterogeneous stacking using Tezzaron 3D IC technlogy. Design and implementation trade-off in both partitioning methods is investigated to have better insight about 3D architecture so that it can be exploited for optimal performance. Using homogeneous 3D stacking approach, NoC architectures are explored to identify the best topology between 2D and 3D topology for 3D MPSoC implementation. The architectural explorations have also considered different process technologies highlighting the wire delay effect to the 3D architecture performance especially for interconnect-dominated design. Additionally, we performed heterogeneous 3D stacking of NoC-based MPSoC implementation with GALS style approach and presented several physical designs related analyses regarding 3D MPSoC design and implementation using 2D EDA tools. Finally we conducted an exploration of 2D EDA tool on different 3D architecture to evaluate the impact of 2D EDA tools on the 3D architecture performance. Since there is no commercialize 3D design tool until now, the experiment is important on the basis that designing 3D architecture using 2D EDA tools does not have a strong and direct impact to the 3D architecture performance mainly because the tools is dedicated for 2D architecture design.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF