Design of robust spin-transfer torque magnetic random access memories for ultralow power high performance on-chip cache applications

Spin-transfer torque magnetic random access memories (STT-MRAMs) based on magnetic tunnel junction (MTJ) has become the leading candidate for future universal memory technology due to its potential for low power, non-volatile, high speed and extremely good endurance. However, conflicting read and write requirements exist in STT-MRAM technology because the current path during read and write operations are the same. Read and write failures of STT-MRAMs are degraded further under process variations. The focus of this dissertation is to optimize the yield of STT- MRAMs under process variations by employing device-circuit-architecture co-design techniques. A devices-to-systems simulation framework was developed to evaluate the effectiveness of the techniques proposed in this dissertation. An optimization methodology for minimizing the failure probability of 1T-1MTJ STT-MRAM bit-cell by proper selection of bit-cell configuration and access transistor sizing is also proposed. A failure mitigation technique using assistsin 1T-1MTJ STT-MRAM bit-cells is also proposed and discussed. Assist techniques proposed in this dissertation to mitigate write failures either increase the amount of current available to switch the MTJ during write or decrease the required current to switch the MTJ. These techniques achieve significant reduction in bit-cell area and write power with minimal impact on bit-cell failure probability and read power. However, the proposed write assist techniques may be less effective in scaled STT-MRAM bit-cells. Furthermore, read failures need to be overcome and hence, read assist techniques are required. It has been experimentally demonstrated that a class of materials called multiferroics can enable manipulation of magnetization using electric fields via magnetoelectric effects. A read assist technique using an MTJ structure incorporating multiferroic materials is proposed and analyzed. It was found that it is very difficult to overcome the fundamental design issues with 1T-1MTJ STT-MRAM due to the two-terminal nature of the MTJ. Hence, multi-terminal MTJ structures consisting of complementary polarized pinned layers are proposed. Analysis of the proposed MTJ structures shows significant improvement in bit-cell failures. Finally, this dissertation explores two system-level applications enabled by STT-MRAMs, and shows that device-circuit-architecture co-design of STT-MRAMs is required to fully exploit its benefits

Perpendicular STT-MTJs with Double Reference Layers and its Application to Downscaled Memory Cells

Chip design presents problems due to scaling as the technology node reaches to the physical limits. The roadmap to 7nm technology node and beyond is already traced and overcome the problems in power and energy dissipation have become a fundamental part in the chip design...El diseño del chip presenta problemas debido al escalamiento de dispositivos a medida que el nodo tecnológico llega a sus límites físicos. La ruta para el desarrollo de nodos de 7nm en adelante se ha trazado, y superar los problemas de potencia y disipación de energía se ha convertido una parte fundamental para el diseño de chips..

Stochastic Memory Devices for Security and Computing

With the widespread use of mobile computing and internet of things, secured communication and chip authentication have become extremely important. Hardware-based security concepts generally provide the best performance in terms of a good standard of security, low power consumption, and large-area density. In these concepts, the stochastic properties of nanoscale devices, such as the physical and geometrical variations of the process, are harnessed for true random number generators (TRNGs) and physical unclonable functions (PUFs). Emerging memory devices, such as resistive-switching memory (RRAM), phase-change memory (PCM), and spin-transfer torque magnetic memory (STT-MRAM), rely on a unique combination of physical mechanisms for transport and switching, thus appear to be an ideal source of entropy for TRNGs and PUFs. An overview of stochastic phenomena in memory devices and their use for developing security and computing primitives is provided. First, a broad classification of methods to generate true random numbers via the stochastic properties of nanoscale devices is presented. Then, practical implementations of stochastic TRNGs, such as hardware security and stochastic computing, are shown. Finally, future challenges to stochastic memory development are discussed

Design techniques for dense embedded memory in advanced CMOS technologies

University of Minnesota Ph.D. dissertation. February 2012. Major: Electrical Engineering. Advisor: Chris H. Kim. 1 computer file (PDF); viii, 116 pages.On-die cache memory is a key component in advanced processors since it can boost micro-architectural level performance at a moderate power penalty. Demand for denser memories only going to increase as the number of cores in a microprocessor goes up with technology scaling. A commensurate increase in the amount of cache memory is needed to fully utilize the larger and more powerful processing units. 6T SRAMs have been the embedded memory of choice for modern microprocessors due to their logic compatibility, high speed, and refresh-free operation. However, the relatively large cell size and conflicting requirements for read and write make aggressive scaling of 6T SRAMs challenging in sub-22 nm. In this dissertation, circuit techniques and simulation methodologies are presented to demonstrate the potential of alternative options such as gain cell eDRAMs and spin-torque-transfer magnetic RAMs (STT-MRAMs) for high density embedded memories.Three unique test chip designs are presented to enhance the retention time and access speed of gain cell eDRAMs. Proposed bit-cells utilize preferential boostings, beneficial couplings, and aggregated cell leakages for expanding signal window between data `1' and `0'. The design space of power-delay product can be further enhanced with various assist schemes that harness the innate properties of gain cell eDRAMs. Experimental results from the test chips demonstrate that the proposed gain cell eDRAMs achieve overall faster system performances and lower static power dissipations than SRAMs in a generic 65 nm low-power (LP) CMOS process. A magnetic tunnel junction (MTJ) scaling scenario and an efficient HSPICE simulation methodology are proposed for exploring the scalability of STT-MRAMs under variation effects from 65 nm to 8 nm. A constant JC0*RA/VDD scaling method is adopted to achieve optimal read and write performances of STT-MRAMs and thermal stabilities for a 10 year retention are achieved by adjusting free layer thicknesses as well as projecting crystalline anisotropy improvements. Studies based on the proposed methodology show that in-plane STT-MRAM will outperform SRAM from 15 nm node, while its perpendicular counterpart requires further innovations in MTJ material properties in order to overcome the poor write performance from 22 nm node

RRAM variability and its mitigation schemes

Emerging technologies such as RRAMs are attracting significant attention due to their tempting characteristics such as high scalability, CMOS compatibility and non-volatility to replace the current conventional memories. However, critical causes of hardware reliability failures, such as process variation due to their nano-scale structure have gained considerable importance for acceptable memory yields. Such vulnerabilities make it essential to investigate new robust design strategies at the circuit system level. In this paper we have analyzed the RRAM variability phenomenon, its impact and variation tolerant techniques at the circuit level. Finally a variation-monitoring circuit is presented that discerns the reliable memory cells affected by process variability.Peer ReviewedPostprint (author's final draft

Enabling a reliable STT-MRAM main memory simulation

STT-MRAM is a promising new memory technology with very desirable set of properties such as non-volatility, byte-addressability and high endurance. It has the potential to become the universal memory that could be incorporated to all levels of memory hierarchy. Although STT-MRAM technology got significant attention of various major memory manufacturers, to this day, academic research of STT-MRAM main memory remains marginal. This is mainly due to the unavailability of publicly available detailed timing parameters which are required to perform a cycle accurate main memory simulation. Our study presents a detailed analysis of STT-MRAM main memory timing and propose an approach to perform a reliable system level simulation of the memory technology. We seamlessly incorporate STT-MRAM timing parameters into DRAMSim2 memory simulator and use it as a part of the simulation infrastructure of the high-performance computing (HPC) systems. Our results suggests that, STT-MRAM main memory would provide performance comparable to DRAM, while opening up various opportunities for HPC system improvements. Most importantly, our study enables researchers to conduct reliable system level research on STT-MRAM main memory, and to explore the opportunities that this technology has to offer.This work was supported by BSC, Spanish Government through Programa Severo Ochoa (SEV-2015-0493), by the Spanish Ministry of Science and Technology through TIN2015-65316-P project and by the Generalitat de Catalunya (contracts 2014-SGR-1051 and 2014-SGR-1272). This work has also received funding from the European Union's Horizon 2020 research and innovation programme under ExaNoDe project (grant agreement No 671578). The authors wish to thank Terry Hulett, Duncan Bennett and Ben Cooke from Everspin Technologies Inc., for their technical support.Peer ReviewedPostprint (author's final draft

Smart Material Implication Using Spin-Transfer Torque Magnetic Tunnel Junctions for Logic-in-Memory Computing

Smart material implication (SIMPLY) logic has been recently proposed for the design of energy-efficient Logic-in-Memory (LIM) architectures based on non-volatile resistive memory devices. The SIMPLY logic is enabled by adding a comparator to the conventional IMPLY scheme. This allows performing a preliminary READ operation and hence the SET operation only in the case it is actually required. This work explores the SIMPLY logic scheme using nanoscale spin-transfer torque magnetic tunnel junction (STT-MTJ) devices. The performance of the STT-MTJ based SIMPLY architecture is analyzed by varying the load resistor and applied voltages to implement both READ and SET operations, while also investigating the effect of temperature on circuit operation. Obtained results show an existing tradeoff between error rate and energy consumption, which can be effectively managed by properly setting the values of load resistor and applied voltages. In addition, our analysis proves that tracking the temperature dependence of the MTJ properties through a proportional to absolute temperature (PTAT) reference voltage at the input of the comparator is beneficial to mitigate the reliability degradation under temperature variations