Design, modeling and fabrication of thermal actuated micromirror for fine-tracking mechanism of high-density optical data storage

Master'sMASTER OF ENGINEERIN

MEMS micromirrors for imaging applications

Strathclyde theses - ask staff. Thesis no. : T13478Optical MEMS (microelectromechanical systems) are widely used in various applications. In this thesis, the design, simulation and characterisation of two optical MEMS devices for imaging applications, a varifocal micromirror and a 2D scanning micromirror, are introduced. Both devices have been fabricated using the commercial Silicon-on-Insulator multi-users MEMS processes (SOIMUMPs), in the 10 m thick Silicon-on-Insulator (SOI) wafer. Optical MEMS device with variable focal length is a critical component for imaging system miniaturisation. In this thesis, a thermally-actuated varifocal micromirror (VFM) with 1-mm-diameter aperture is introduced. The electrothermal actuation through Joule heating of the micromirror suspensions and the optothermal actuation using incident laser power absorption have been demonstrated as well as finite element method (FEM) simulation comparisons. Especially, the optical aberrations produced by this VFM have been statistically quantified to be negligible throughout the actuation range. A compact imaging system incorporating this VFM has been demonstrated with high quality imaging results. MEMS 2D scanners, or scanning micromirrors, are another type of optical MEMS which have been widely investigated for applications such as biomedical microscope imaging, projection, retinal display and optical switches for telecommunication network, etc. For large and fast scanning motions, the actuation scheme to scan a micromirror in two axes, the structural connections and arrangement are fundamental. The microscanner introduced utilises two types of actuators, electrothermal actuators and electrostatic comb-drives, to scan a 1.2-mm-diameter gold coated silicon micromirror in two orthogonal axes. With assistance of FEM software, CoventorWare, the structure optimisation of actuators and flexure connections are presented. The maximum optical scan angles in two axes by each type of actuator individually and by actuating the two at the same time have been characterised experimentally. By programming actuation signals, the microscanner has achieved a rectangular scan pattern with 7° 10° angular-scan-field at a line-scan rate of around 1656 Hz.Optical MEMS (microelectromechanical systems) are widely used in various applications. In this thesis, the design, simulation and characterisation of two optical MEMS devices for imaging applications, a varifocal micromirror and a 2D scanning micromirror, are introduced. Both devices have been fabricated using the commercial Silicon-on-Insulator multi-users MEMS processes (SOIMUMPs), in the 10 m thick Silicon-on-Insulator (SOI) wafer. Optical MEMS device with variable focal length is a critical component for imaging system miniaturisation. In this thesis, a thermally-actuated varifocal micromirror (VFM) with 1-mm-diameter aperture is introduced. The electrothermal actuation through Joule heating of the micromirror suspensions and the optothermal actuation using incident laser power absorption have been demonstrated as well as finite element method (FEM) simulation comparisons. Especially, the optical aberrations produced by this VFM have been statistically quantified to be negligible throughout the actuation range. A compact imaging system incorporating this VFM has been demonstrated with high quality imaging results. MEMS 2D scanners, or scanning micromirrors, are another type of optical MEMS which have been widely investigated for applications such as biomedical microscope imaging, projection, retinal display and optical switches for telecommunication network, etc. For large and fast scanning motions, the actuation scheme to scan a micromirror in two axes, the structural connections and arrangement are fundamental. The microscanner introduced utilises two types of actuators, electrothermal actuators and electrostatic comb-drives, to scan a 1.2-mm-diameter gold coated silicon micromirror in two orthogonal axes. With assistance of FEM software, CoventorWare, the structure optimisation of actuators and flexure connections are presented. The maximum optical scan angles in two axes by each type of actuator individually and by actuating the two at the same time have been characterised experimentally. By programming actuation signals, the microscanner has achieved a rectangular scan pattern with 7° 10° angular-scan-field at a line-scan rate of around 1656 Hz

Design, Fabrication, and Characterization of a 2-D SOI MEMS Micromirror with Sidewall Electrodes for Confocal MACROscope Imaging

Micro-Electro-Mechanical Systems (MEMS) micromirrors have been developed for more than two decades along with the development of MEMS technology. They have been used into many application fields: optical switches, digital light projector (DLP), adoptive optics (AO), high definition (HD) display, barcode reader, endoscopic optical coherence tomography (OCT) and confocal microscope, and so on. Especially, MEMS mirrors applied into endoscopic OCT and confocal microscope are the intensive research field. Various actuation mechanisms, such as electrostatic, electromagnetic, electro bimorph thermal, electrowetting, piezoelectric (PZT) and hybrid actuators, are adopted by different types of micromirrors. Among these actuators, the electrostatic is easily understood and simple to realize, therefore, it is broadly adopted by a large number of micromirrors. This thesis reports the design, fabrication, and characterization of a 2-D Silicon-on-insulation (SOI) MEMS micromirror with sidewall (SW) electrodes for endoscopic OCT or confocal microscope imaging. The biaxial MEMS mirror with SW electrodes is actuated by electrostatic actuators. The dimension of mirror plate is 1000micron×1000micron, with a thickness of a 35micron. The analytical modeling of SW electrodes, fabrication process, and performance characteristics are described. In comparison to traditional electrostatic actuators, parallel-plate and comb-drive, SW electrodes combined with bottom electrodes achieve a large tilt angle under a low drive voltage that the comb-drive does and possess fairly simple fabrication process same as that of the parallel-plate. A new fabrication process based on SOI wafer, hybrid bulk/surface micromachined technology, and a high-aspect-ratio shadow mask is presented. Moreover, the fabrication process is successfully extended to fabricate 2×2 and 4×4 micromirror arrays. Finally, a biaxial MEMS mirror with SW electrodes was used into Confocal MACROscope for imaging. Studied optical requirements in terms of two optical configurations and frequency optimization of the micromirror, the biaxial MEMS mirror replaces the galvo-scanner and improves the MACROscope. Meanwhile, a new Micromirror-based Laser Scanning Microscope system is presented and allows 2D images to be acquired and displayed

MEMS Actuation and Self-Assembly Applied to RF and Optical Devices

The focus of this work involves optical and RF (radio frequency) applications of novel microactuation and self-assembly techniques in MEMS (Microelectromechanical systems). The scaling of physical forces into the micro domain is favorably used to design several types of actuators that can provide large forces and large static displacements at low operation voltages. A self-assembly method based on thermally induced localized plastic deformation of microstructures has been developed to obtain truly three-dimensional structures from a planar fabrication process. RF applications include variable discrete components such as capacitors and inductors as well as tunable coupling circuits. Optical applications include scanning micromirrors with large scan angles (>90 degrees), low operation voltages (<10 Volts), and multiple degrees of freedom. One and two-dimensional periodic structures with variable periods and orientations (with respect to an incident wave) are investigated as well, and analyzed using optical phased array concepts. Throughout the research, permanent tuning via plastic deformation and power-off latching techniques are used in order to demonstrate that the optical and RF devices can exhibit zero quiescent power consumption once their geometry is set

Microelectromechanical Systems and Devices

The advances of microelectromechanical systems (MEMS) and devices have been instrumental in the demonstration of new devices and applications, and even in the creation of new fields of research and development: bioMEMS, actuators, microfluidic devices, RF and optical MEMS. Experience indicates a need for MEMS book covering these materials as well as the most important process steps in bulk micro-machining and modeling. We are very pleased to present this book that contains 18 chapters, written by the experts in the field of MEMS. These chapters are groups into four broad sections of BioMEMS Devices, MEMS characterization and micromachining, RF and Optical MEMS, and MEMS based Actuators. The book starts with the emerging field of bioMEMS, including MEMS coil for retinal prostheses, DNA extraction by micro/bio-fluidics devices and acoustic biosensors. MEMS characterization, micromachining, macromodels, RF and Optical MEMS switches are discussed in next sections. The book concludes with the emphasis on MEMS based actuators

Design of a high-speed, meso-scale nanopositioners driven by electromagnetic actuators

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2008.Includes bibliographical references (p. 218-230).The purpose of this thesis is to generate the design and fabrication knowledge that is required to engineer high-speed, six-axis, meso-scale nanopositioners that are driven by electromagnetic actuators. When compared to macro-scale nanopositioners, meso-scale nanopositioners enable a combination of greater bandwidth, improved thermal stability, portability, and capacity for massively parallel operation. Meso-scale nanopositioners are envisioned to impact emerging applications in data storage and nanomanufacturing, which will benefit from low-cost, portable, multi-axis nanopositioners that may position samples with nanometer-level precision at bandwidth of 100s of Hz and over a working envelope greater than 10x10x10 micrometers3 This thesis forms the foundation of design and fabrication knowledge required to engineer mesoscale systems to meet these needs.The design combines a planar silicon flexure bearing and unique moving-coil microactuators that employ millimeter-scale permanent magnets and stacked, planar-spiral micro-coils. The new moving-coil actuator outperforms previous coil designs as it enables orthogonal and linear force capability in two axes while minimizing parasitic forces. The system performance was modeled in the structural, thermal, electrical, and magnetic domains with analytical and finite-element techniques. A new method was created to model the three-dimensional permanent magnet fields of finite magnet arrays. The models were used to optimize the actuator coil and flexure geometry in order to achieve the desired motions, stiffness, and operating temperature, and to reduce thermal error motions.A new microfabrication process and design-for-manufacturing rules were generated to integrate multilayer actuator coils and silicon flexure bearings. The process combines electroplating for the copper coils, a silicon dioxide interlayer dielectric, and deep reactive-ion etching for the silicon flexures and alignment features.(cont.) Microfabrication experiments were used to formulate coil geometry design rules that minimized the delamination and cracking of the materials that comprise the coil structure. Experiments were also used to measure the previously-unreported breakdown strength of the unannealed, PECVD silicon dioxide interlayer dielectric. The results of this research were used to design and fabricate a meso-scale nanopositioner system. The nanopositioner was measured to have a range of motion of 10 micrometers in the lateral directions, a range of 2 micrometers in the out-of-plane direction, an angular range of 0.5 degrees, and a first mode resonant frequency at 900 Hz. Open-loop calibration has been shown to minimize parasitic in-plane motion to less than 100 nm over the range of motion.by Dariusz S. Golda.Ph.D

Single-Chip Scanning Probe Microscopes

Scanning probe microscopes (SPMs) are the highest resolution imaging instruments available today and are among the most important tools in nanoscience. Conventional SPMs suffer from several drawbacks owing to their large and bulky construction and to the use of piezoelectric materials. Large scanners have low resonant frequencies that limit their achievable imaging bandwidth and render them susceptible to disturbance from ambient vibrations. Array approaches have been used to alleviate the bandwidth bottleneck; however as arrays are scaled upwards, the scanning speed must decline to accommodate larger payloads. In addition, the long mechanical path from the tip to the sample contributes thermal drift. Furthermore, intrinsic properties of piezoelectric materials result in creep and hysteresis, which contribute to image distortion. The tip-sample interaction signals are often measured with optical configurations that require large free-space paths, are cumbersome to align, and add to the high cost of state-of-the-art SPM systems. These shortcomings have stifled the widespread adoption of SPMs by the nanometrology community. Tiny, inexpensive, fast, stable and independent SPMs that do not incur bandwidth penalties upon array scaling would therefore be most welcome. The present research demonstrates, for the first time, that all of the mechanical and electrical components that are required for the SPM to capture an image can be scaled and integrated onto a single CMOS chip. Principles of microsystem design are applied to produce single-chip instruments that acquire images of underlying samples on their own, without the need for off-chip scanners or sensors. Furthermore, it is shown that the instruments enjoy a multitude of performance benefits that stem from CMOS-MEMS integration and volumetric scaling of scanners by a factor of 1 million. This dissertation details the design, fabrication and imaging results of the first single-chip contact-mode AFMs, with integrated piezoresistive strain sensing cantilevers and scanning in three degrees-of-freedom (DOFs). Static AFMs and quasi-static AFMs are both reported. This work also includes the development, fabrication and imaging results of the first single-chip dynamic AFMs, with integrated flexural resonant cantilevers and 3 DOF scanning. Single-chip Amplitude Modulation AFMs (AM-AFMs) and Frequency Modulation AFMs (FM-AFMs) are both shown to be capable of imaging samples without the need for any off-chip sensors or actuators. A method to increase the quality factor (Q-factor) of flexural resonators is introduced. The method relies on an internal energy pumping mechanism that is based on the interplay between electrical, mechanical, and thermal effects. To the best of the author’s knowledge, the devices that are designed to harness these effects possess the highest electromechanical Qs reported for flexural resonators operating in air; electrically measured Q is enhanced from ~50 to ~50,000 in one exemplary device. A physical explanation for the underlying mechanism is proposed. The design, fabrication, imaging, and tip-based lithographic patterning with the first single-chip Scanning Thermal Microscopes (SThMs) are also presented. In addition to 3 DOF scanning, these devices possess integrated, thermally isolated temperature sensors to detect heat transfer in the tip-sample region. Imaging is reported with thermocouple-based devices and patterning is reported with resistive heater/sensors. An “isothermal electrothermal scanner” is designed and fabricated, and a method to operate it is detailed. The mechanism, based on electrothermal actuation, maintains a constant temperature in a central location while positioning a payload over a range of >35μm, thereby suppressing the deleterious thermal crosstalk effects that have thus far plagued thermally actuated devices with integrated sensors. In the thesis, models are developed to guide the design of single-chip SPMs and to provide an interpretation of experimental results. The modelling efforts include lumped element model development for each component of single-chip SPMs in the electrical, thermal and mechanical domains. In addition, noise models are developed for various components of the instruments, including temperature-based position sensors, piezoresistive cantilevers, and digitally controlled positioning devices

Electro-Thermal Mechanical Modeling of Microbolometer for Reliability Analysis

Infrared (IR) imaging is a key technology in a variety of military and civilian applications, especially for night vision and remote sensing. Compared with cryogenically cooled IR sensors, uncooled infrared imaging devices have the advantages of being low cost, light weight, and superior reliability. The electro-thermal analysis of a microbolometer pixel is critical to determine both device performance and reliability. To date, most microbolometer analysis research has focused on performance optimization and computation of thermal conductance directly from the geometry. However, modeling of the thermal distribution across the microbolometer pixel is critical for the comprehensive analysis of system performance and reliability. Therefore, this thesis investigates the electro-thermo-mechanical characteristics of a microbolometer pixel considering the effects of joule heating and incoming IR energy. The contributions of the present research include the electro-thermal models for microbolometer and methods of validating thermal distribution using experimental results. The electro-thermal models explain the effect of microbolometer material properties and geometry on device performance and reliability. The research also contributes methods of estimating the thermal conductivity of microbolometer, which take into account different heat transfer mechanisms, including radiation and convection. Previous approaches for estimating the thermal conductance of uncooled microbolometer consider heat conduction via legs from the geometry of the pixel structure and material properties [2]. This approach assumes linear temperature distribution in the pixel legs structure. It also leaves out the various electro-thermal effects existing for multilayer structures. In the present research, a different approach is used to develop the thermal conductance of microbolometer pixel structure. The temperature distribution in the pixel is computed from an electro-thermal model. Then, the average temperature in the pixel microplate and the total heat energy generated by joule heating is utilized to compute the thermal conductance of the structure. The thesis discusses electro-thermal and thermo-mechanical modeling, simulation and testing of Polysilicon Multi-User MEMS Process (PolyMUMPs®) test devices as the groundwork for the investigation of microbolometer performance and reliability in space applications. An electro-thermal analytical and numerical model was developed to predict the temperature distribution across the microbolometer pixel by solving the second order differential heat equation. To provide a qualitative insight of the effect of different parameters in the thermal distribution, including material properties and device geometry, first an explicit formulation for the solution of the electro-thermal coupling is obtained using the analytical method. In addition, the electro-thermal model, which accounts for the effect of IR energy and radiation heat transfer, spreading resistance and transient conditions, was studied using numerical methods. In addition, an analytical model has been developed to compute the IR absorption coefficient of a Thin Single Stage (TSS) microbolometer pixel. The simulation result of this model was used to compute absorbed IR energy for the numerical model. Subsequently, the temperature distribution calculated from the analytical model is used to obtain the deflections that the structure undergoes, which will be fundamental for the reliability analysis of the device. Finite element analysis (FEA) has been simulated for the selected device using commercial software, ANSYS® multiphysics. Finite element simulation shows that the electro-thermal models predict the temperature distribution across a microbolometer pixel at steady-state conditions within 2.3% difference from the analytical model. The analytical and numerical models are also simulated and results for a temperature distribution within 1.6% difference. In addition, to validate the analytical and numerical electro-thermal and thermo-mechanical models, a PolyMUMPs® test device has been used. The test results showed a close agreement with the FEM simulation deflection of the test device