A Survey Addressing on High Performance On-Chip VLSI Interconnect

With the rapid increase in transmission speeds of communication systems, the demand for very high-speed lowpower VLSI circuits is on the rise. Although the performance of CMOS technologies improves notably with scaling, conventional CMOS circuits cannot simultaneously satisfy the speed and power requirements of these applications. In this paper we survey the state of the art of on-chip interconnect techniques for improving performance, power and delay optimization and also comparative analysis of various techniques for high speed design have been discussed

High-Speed and Low-Energy On-Chip Communication Circuits.

Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire delays have increased due to less wiring pitch with higher resistance and coupling capacitance. Due to this ever growing gap, long on-chip interconnects pose well-known latency, bandwidth, and energy challenges to high-performance VLSI systems. Repeaters effectively mitigate wire RC effects but do little to improve their energy costs. Moreover, the increased complexity and high level of integration requires higher wire densities, worsening crosstalk noise and power consumption of conventionally repeated interconnects. Such increasing concerns in global on-chip wires motivate circuits to improve wire performance and energy while reducing the number of repeaters. This work presents circuit techniques and investigation for high-performance and energy-efficient on-chip communication in the aspects of encoding, data compression, self-timed current injection, signal pre-emphasis, low-swing signaling, and technology mapping. The improved bus designs also consider the constraints of robust operation and performance/energy gains across process corners and design space. Measurement results from 5mm links on 65nm and 90nm prototype chips validate 2.5-3X improvement in energy-delay product.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/75800/1/jseo_1.pd

Exploration and Design of High Performance Variation Tolerant On-Chip Interconnects

Siirretty Doriast

High Peformance and Low Power On-Die Interconnect Fabrics.

Increasing power density with technology scaling has caused stagnation in operating frequency of modern day microprocessors. This has led designers to prefer multicore architectures over complex monolithic processors to keep up with the demand for rising computing throughput. Although processing units are getting smaller and simpler, the dramatic rise of their count on a single die has made the fabric that connects these processing units increasingly complex. These interconnect fabrics have become a bottleneck in improving overall system effciency. As a result, the design paradigm for multi-core chips is gradually shifting from a core-centric architecture towards an interconnect-centric architecture, where system efficiency is limited by the fabric rather than the processing ability of any individual core. This dissertation introduces three novel and synergistic circuit techniques to improve scalability of switch fabrics to make on-die integration of hundreds to thousands of cores feasible. 1) A matrix topology is proposed for designing a fully connected switch fabric that re-uses output buses for programming, and stores shue congurations at cross points. This significantly reduces routing congestion, lowers area/power, and improves per- formance. Silicon measurements demonstrate 47% energy savings in a 64-lane SIMD processor fabricated in 65nm CMOS over a conventional implementation. 2) A novel approach to handle high radix arbitration along with data routing is proposed. It optimally uses existing cross-bar interconnect resources without requiring any additional overhead. Bandwidth exceeding 2Tb/s is recorded in a test prototype fabricated in 65nm. 3) Building on the later, a new circuit topology to manage and update priority adaptively within the switch fabric without incurring additional delay or area is then proposed. Several assist circuit techniques, such as a thyristor based sense amplifier and self regenerating bi-directional repeaters are proposed for high speed energy efficient signaling to and from the switch fabric to improve overall routing efficiency. Using these techniques a 64 x 64 switch fabric with 128b data bus fabricated in 45nm achieves a throughput of 4.5Tb/s at single cycle latency while operating at 559MHz.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/91506/1/sudhirks_1.pd

Doctor of Philosophy

dissertationCommunication surpasses computation as the power and performance bottleneck in forthcoming exascale processors. Scaling has made transistors cheap, but on-chip wires have grown more expensive, both in terms of latency as well as energy. Therefore, the need for low energy, high performance interconnects is highly pronounced, especially for long distance communication. In this work, we examine two aspects of the global signaling problem. The first part of the thesis focuses on a high bandwidth asynchronous signaling protocol for long distance communication. Asynchrony among intellectual property (IP) cores on a chip has become necessary in a System on Chip (SoC) environment. Traditional asynchronous handshaking protocol suffers from loss of throughput due to the added latency of sending the acknowledge signal back to the sender. We demonstrate a method that supports end-to-end communication across links with arbitrarily large latency, without limiting the bandwidth, so long as line variation can be reliably controlled. We also evaluate the energy and latency improvements as a result of the design choices made available by this protocol. The use of transmission lines as a physical interconnect medium shows promise for deep submicron technologies. In our evaluations, we notice a lower energy footprint, as well as vastly reduced wire latency for transmission line interconnects. We approach this problem from two sides. Using field solvers, we investigate the physical design choices to determine the optimal way to implement these lines for a given back-end-of-line (BEOL) stack. We also approach the problem from a system designer's viewpoint, looking at ways to optimize the lines for different performance targets. This work analyzes the advantages and pitfalls of implementing asynchronous channel protocols for communication over long distances. Finally, the innovations resulting from this work are applied to a network-on-chip design example and the resulting power-performance benefits are reported

Low-power and high-fanout bus design techniques

Low-power techniques pose an important concern, when designing autonomous electronic devices. Most of the upcoming applications increasingly demand high performance and low-power consumption. In this thesis work, two low-power and high-fanout bus design techniques are reviewed. Pulse Width Modulation (PWM) and Time-Domain Conversion (TDC) approaches are elucidated. Schematic simulations (Cadence), quantitative and comparative results of both approaches are included. Additionally, on-chip wire theory is shown as well as some optimized bus simulation models (MATLAB), concluding with a summary of the main application areas for this techniques. Finally , two ready-to-use library cells are generated, as well as Verilog code for the TDC system

High-performance long NoC link using delay-insensitive current-mode signaling

High-performance long-range NoC link enables efficient implementation of network-on-chip topologies which inherently require high-performance long-distance point-to-point communication such as torus and fat-tree structures. In addition, the performance of other topologies, such as mesh, can be improved by using high-performance link between few selected remote nodes.We presented novel implementation of high-performance long-range NoC link based onmultilevel current-mode signaling and delayinsensitive two-phase 1-of-4 encoding. Current-mode signaling reduces the communication latency of long wires significantlycompared to voltage-mode signaling, making it possible to achieve high throughput without pipelining and/or using repeaters. The performance of the proposed multilevel current-mode interconnect is analyzed and compared with two reference voltage mode interconnects. These two reference interconnects are designed using two-phase 1-of-4 encoded voltage-mode signaling, one with pipeline stages and the other using optimal repeater insertion. The proposed multilevel current-mode interconnect achieves higher throughput and lower latency than the two reference interconnects. Its throughput at 8mm wire length is 1.222GWord/swhich is 1.58 and 1.89 times higher than the pipelined and optimal repeater insertion interconnects, respectively. Furthermore, its power consumption is less than the optimal repeater insertion voltage-mode interconnect, at 10mm wire length its power consumption is 0.75mW while the reference repeater insertion interconnect is 1.066 mW. The effect of crosstalk is analyzed using four-bit parallel data transfer with the best-case and worst-case switching patterns and a transmission line model which has both capacitive coupling and inductive coupling.</p

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

ATAC: A Manycore Processor with On-Chip Optical Network

Ever since industry has turned to parallelism instead of frequency scaling to improve processor performance, multicore processors have continued to scale to larger and larger numbers of cores. Some believe that multicores will have 1000 cores or more by the middle of the next decade. However, their promise of increased performance will only be reached if their inherent scaling and programming challenges are overcome. Meanwhile, recent advances in nanophotonic device manufacturing are making chip-stack optics a reality; interconnect technology which can provide significantly more bandwidth at lower power than conventional electrical analogs. Perhaps more importantly, optical interconnect also has the potential to enable new, easy-to-use programming models enabled by an inexpensive broadcast mechanism. This paper introduces ATAC, a new manycore architecture that capitalizes on the recent advances in optics to address a number of the challenges that future manycore designs will face. The new constraints and opportunities associated with on-chip optical interconnect are presented and explored in the design of ATAC. Furthermore, this paper introduces ACKwise, a novel directory-based cache coherence protocol that takes advantage of the special properties of ATAC to achieve high performance and scalability on large-scale manycores. Early performance results show that a 1000-core ATAC chip achieves a speedup of as much as 39% when compared with a similarly sized manycore with an electrical mesh network