Delay test for diagnosis of power switches

Power switches are used as part of power-gating technique to reduce leakage power of a design. To the best of our knowledge, this is the first work in open-literature to show a systematic diagnosis method for accurately diagnosingpower switches. The proposed diagnosis method utilizes recently proposed DFT solution for efficient testing of power switches in the presence of PVT variation. It divides power switches into segments such that any faulty power switch is detectable thereby achieving high diagnosis accuracy. The proposed diagnosis method has been validated through SPICE simulation using a number of ISCAS benchmarks synthesized with a 90-nm gate library. Simulation results show that when considering the influence of process variation, the worst case loss of accuracy is less than 4.5%; and the worst case loss of accuracy is less than 12% when considering VT (Voltage and Temperature) variations

High quality testing of grid style power gating

This paper shows that existing delay-based testing techniques for power gating exhibit fault coverage loss due to unconsidered delays introduced by the structure of the virtual voltage power-distribution-network (VPDN). To restore this loss, which could reach up to 70.3% on stuck-open faults, we propose a design-for-testability (DFT) logic that considers the impact of VPDN on fault coverage in order to constitute the proper interface between the VPDN and the DFT. The proposed logic can be easily implemented on-top of existing DFT solutions and its overhead is optimized by an algorithm that offers trade-off flexibility between test-application-time and hardware overhead. Through physical layout SPICE simulations, we show complete fault coverage recovery on stuck-open faults and 43.2% test-application-time improvement compared to a previously proposed DFT technique. To the best of our knowledge, this paper presents the first analysis of the VPDN impact on test qualit

Diagnosis of power switches with power-distribution-network consideration

This paper examines diagnosis of power switches when the power-distribution-network (PDN) is considered as a high resolution distributed electrical model. The analysis shows that for a diagnosis method to perform high diagnosis accuracy and resolution, the distributed nature of PDN should not be simplified by a lumped model. For this reason, a PDN-aware diagnosis method for power switches fault grading is proposed. The proposed method utilizes a novel signature generation design-for-testability (DFT) unit, the signatures of which are processed by a novel diagnosis algorithm that grades the magnitude of faults. Through simulations of physical layout SPICE models, we explore the trade-offs of the proposed method between diagnosis accuracy and diagnosis resolution against area overhead and we show that 100% diagnosis accuracy and up to 98% diagnosis resolution can be achieved with negligible cost

Leakage Current Analysis for Diagnosis of Bridge Defects in Power-Gating Designs

Manufacturing defects that do not affect the functional operation of low power Integrated Circuits (ICs) can nevertheless impact their power saving capability. We show that stuck-ON faults on the power switches and resistive bridges between the power networks can impair the power saving capability of power-gating designs. For quantifying the impact of such faults on the power savings of power-gating designs, we propose a diagnosis technique that targets bridges between the power networks. The proposed technique is based on the static power analysis of a power-gating design in stand-by mode and it utilizes a novel on-chip signature generation unit, which is sensitive to the voltage level between power rails, the measurements of which are processed off-line for the diagnosis of bridges that can adversely affect power savings. We explore, through SPICE simulation of the largest IWLS’05 benchmarks synthesised using a 32 nm CMOS technology, the trade-offs achieved by the proposed technique between diagnosis accuracy and area cost and we evaluate its robustness against process variation. The proposed technique achieves a diagnosis resolution that is higher than 98.6% and 97.9% for bridges of R ≳ 10MΩ(weak bridges) and bridges of R ≲ 10MΩ (strong bridges), respectively, and a diagnosis accuracy higher than 94.5% for all the examined defects. The area overhead is small and scalable: it is found to be 1.8% and 0.3% for designs with 27K and 157K gate equivalents, respectively

DFT Architecture with Power-Distribution-Network Consideration for Delay-based Power Gating Test

This paper shows that existing delay-based testing techniques for power gating exhibit both fault coverage and yield loss due to deviations at the charging delay introduced by the distributed nature of the power-distribution-networks (PDNs). To restore this test quality loss, which could reach up to 67.7% of false passes and 25% of false fails due to stuck-open faults, we propose a design-for-testability (DFT) logic that accounts for a distributed PDN. The proposed logic is optimized by an algorithm that also handles uncertainty due to process variations and offers trade-off flexibility between test-application time and area cost. A calibration process is proposed to bridge model-to-hardware discrepancies and increase test quality when considering systematic variations. Through SPICE simulations, we show complete recovery of the test quality lost due to PDNs. The proposed method is robust sustaining 80.3% to 98.6% of the achieved test quality under high random and systematic process variations. To the best of our knowledge, this paper presents the first analysis of the PDN impact on test quality and offers a unified test solution for both ring and grid power gating styles

A Cost-Effective Fault Tolerance Technique for Functional TSV in 3-D ICs

Regular and redundant through-silicon via (TSV) interconnects are used in fault tolerance techniques of 3-D IC. However, the fabrication process of TSVs results in defects that reduce the yield and reliability of TSVs. On the other hand, each TSV is associated with a significant amount of on-chip area overhead. Therefore, unlike the state-of-the-art fault tolerance architectures, here we propose the time division multiplexing access (TDMA)-based fault tolerance technique without using any redundant TSVs, which reduces the area overhead and enhances the yield. In the proposed technique, by means of TDMA, we reroute the signal through defect-free TSV. Subsequently, an architecture based on the proposed technique has been designed, evaluated, and validated on logic-on-logic 3-D IWLS'05 benchmark circuits using 130-nm technology node. The proposed technique is found to reduce the area overhead by 28.70%-40.60%, compared to the state-of-the-art architectures and results in a yield of 98.9%-99.8%

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount