Formal Verification of a MESI-based Cache Implementation

Cache coherency is crucial to multi-core systems with a shared memory programming model. Coherency protocols have been formally verified at the architectural level with relative ease. However, several subtle issues creep into the hardware realization of cache in a multi-processor environment. The assumption, made in the abstract model, that state transitions are atomic, is invalid for the HDL implementation. Each transition is composed of many concurrent multi-core operations. As a result, even with a blocking bus, several transient states come into existence. Most modern processors optimize communication with a split-transaction bus, this results in further transient states and race conditions. Therefore, the design and verification of cache coherency is increasingly complex and challenging. Simulation techniques are insufficient to ensure memory consistency and the absence of deadlock, livelock, and starvation. At best, it is tediously complex and time consuming to reach confidence in functionality with simulation. Formal methods are ideally suited to identify the numerous race conditions and subtle failures. In this study, we perform formal property verification on the RTL of a multi-core level-1 cache design based on snooping MESI protocol. We demonstrate full-proof verification of the coherence module in JasperGold using complexity reduction techniques through parameterization. We verify that the assumptions needed to constrain inputs of the stand-alone cache coherence module are satisfied as valid assertions in the instantiation environment. We compare results obtained from formal property verification against a state-of-the-art UVM environment. We highlight the benefits of a synergistic collaboration between simulation and formal techniques. We present formal analysis as a generic toolkit with numerous usage models in the digital design process

SCORPIO: A 36-Core Research Chip Demonstrating Snoopy Coherence on a Scalable Mesh NoC with In-Network Ordering

URL to conference programIn the many-core era, scalable coherence and on-chip interconnects are crucial for shared memory processors. While snoopy coherence is common in small multicore systems, directory-based coherence is the de facto choice for scalability to many cores, as snoopy relies on ordered interconnects which do not scale. However, directory-based coherence does not scale beyond tens of cores due to excessive directory area overhead or inaccurate sharer tracking. Prior techniques supporting ordering on arbitrary unordered networks are impractical for full multicore chip designs. We present SCORPIO, an ordered mesh Network-on-Chip(NoC) architecture with a separate fixed-latency, bufferless network to achieve distributed global ordering. Message delivery is decoupled from the ordering, allowing messages to arrive in any order and at any time, and still be correctly ordered. The architecture is designed to plug-and-play with existing multicore IP and with practicality, timing, area, and power as top concerns. Full-system 36 and 64-core simulations on SPLASH-2 and PARSEC benchmarks show an average application run time reduction of 24.1% and 12.9%, in comparison to distributed directory and AMD HyperTransport coherence protocols, respectively. The SCORPIO architecture is incorporated in an 11 mm-by- 13 mm chip prototype, fabricated in IBM 45nm SOI technology, comprising 36 Freescale e200 Power Architecture TM cores with private L1 and L2 caches interfacing with the NoC via ARM AMBA, along with two Cadence on-chip DDR2 controllers. The chip prototype achieves a post synthesis operating frequency of 1 GHz (833 MHz post-layout) with an estimated power of 28.8 W (768 mW per tile), while the network consumes only 10% of tile area and 19 % of tile power.United States. Defense Advanced Research Projects Agency (DARPA UHPC grant at MIT (Angstrom))Center for Future Architectures ResearchMicroelectronics Advanced Research Corporation (MARCO)Semiconductor Research Corporatio

Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era

Due to the exceedingly high integration density of VLSI circuits and the resulting high power density, thermal integrity became a major challenge. One way to tackle this problem is Dark silicon. Dark silicon is the amount of circuitry in a chip that is forced to switch off to insure thermal integrity of the system and prevent permanent thermal-related faults. In many-core systems, the presence of Dark Silicon adds new design constraints, in general, and on the communication fabric of such systems, in particular. This is due to the fact that system-level thermal-management systems tend to increase the distance between high activity cores to insure better thermal balancing and integrity. Consequently, a designing dilemma is created where a compromise has to be made between interconnect performance and power consumption. This study proposes a hybrid wire and surface-wave interconnect (SWI) based Network-on-Chip (NoC) to address the dark silicon challenge. Through efficient utilization of one-hop cross the chip communication SWI links, the proposed architecture is able to offer an efficient and scalable communication platform in terms of performance, power, and thermal impact. As a result, evaluations of the proposed architecture compared to baseline architecture under dark silicon scenarios show reduction in maximum temperature by 15°C, average delay up to 73.1%, and energy-saving up to ~3X. This study explores the promising potential of the proposed architecture in extending the utilization wall for current and future many-core systems in dark silicon era

Achieving Functional Correctness in Large Interconnect Systems.

In today's semi-conductor industry, large chip-multiprocessors and systems-on-chip are being developed, integrating a large number of components on a single chip. The sheer size of these designs and the intricacy of the communication patterns they exhibit have propelled the development of network-on-chip (NoC) interconnects as the basis for the communication infrastructure in these systems. Faced with the interconnect's growing size and complexity, several challenges hinder its effective validation. During the interconnect's development, the functional verification process relies heavily on the use of emulation and post-silicon validation platforms. However, detecting and debugging errors on these platforms is a difficult endeavour due to the limited observability, and in turn the low verification capabilities, they provide. Additionally, with the inherent incompleteness of design-time validation efforts, the potential of design bugs escaping into the interconnect of a released product is also a concern, as these bugs can threaten the viability of the entire system. This dissertation provides solutions to enable the development of functionally correct interconnect designs. We first address the challenges encountered during design-time verification efforts, by providing two complementary mechanisms that allow emulation and post-silicon verification frameworks to capture a detailed overview of the functional behaviour of the interconnect. Our first solution re-purposes the contents of in-flight traffic to log debug data from the interconnect's execution. This approach enables the validation of the interconnect using synthetic traffic workloads, while attaining over 80% observability of the routes followed by packets and capturing valuable debugging information. We also develop an alternative mechanism that boosts observability by taking periodic snapshots of execution, thus extending the verification capabilities to run both synthetic traffic and real-application workloads. The collected snapshots enhance detection and debugging support, and they provide observability of over 50% of packets and reconstructs at least half of each of their routes. Moreover, we also develop error detection and recovery solutions to address the threat of design bugs escaping into the interconnect's runtime operation. Our runtime techniques can overcome communication errors without needing to store replicate copies of all in-flight packets, thereby achieving correctness at minimal area costsPhDComputer Science and EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/116741/1/rawanak_1.pd

Interconnects architectures for many-core era using surface-wave communication

PhD ThesisNetworks-on-chip (NoCs) is a communication paradigm that has emerged aiming to address on-chip communication challenges and to satisfy interconnection demands for chip-multiprocessors (CMPs). Nonetheless, there is continuous demand for even higher computational power, which is leading to a relentless downscaling of CMOS technology to enable the integration of many-cores. However, technology downscaling is in favour of the gate nodes over wires in terms of latency and power consumption. Consequently, this has led to the era of many-core processors where power consumption and performance are governed by inter-core communications rather than core computation. Therefore, NoCs need to evolve from being merely metalbased implementations which threaten to be a performance and power bottleneck for many-core efficiency and scalability. To overcome such intensified inter-core communication challenges, this thesis proposes a novel interconnect technology: the surface-wave interconnect (SWI). This new RF-based on-chip interconnect has notable characteristics compared to cutting-edge on-chip interconnects in terms of CMOS compatibility, high speed signal propagation, low power dissipation, and massive signal fan-out. Nonetheless, the realization of the SWI requires investigations at different levels of abstraction, such as the device integration and RF engineering levels. The aim of this thesis is to address the networking and system level challenges and highlight the potential of this interconnect. This should encourage further research at other levels of abstraction. Two specific system-level challenges crucial in future many-core systems are tackled in this study, which are cross-the-chip global communication and one-to-many communication. This thesis makes four major contributions towards this aim. The first is reducing the NoC average-hop count, which would otherwise increase packet-latency exponentially, by proposing a novel hybrid interconnect architecture. This hybrid architecture can not only utilize both regular metal-wire and SWI, but also exploits merits of both bus and NoC architectures in terms of connectivity compared to other general-purpose on-chip interconnect architectures. The second contribution addresses global communication issues by developing a distance-based weighted-round-robin arbitration (DWA) algorithm. This technique prioritizes global communication to be send via SWI short-cuts, which offer more efficient power dissipation and faster across-the-chip signal propagation. Results obtained using a cycleaccurate simulator demonstrate the effectiveness of the proposed system architecture in terms of significant power reduction, considervii able average delay reduction and higher throughput compared to a regular NoC. The third contribution is in handling multicast communications, which are normally associated with traffic overload, hotspots and deadlocks and therefore increase, by an order of magnitude the power consumption and latency. This has been achieved by proposing a novel routing and centralized arbitration schemes that exploits the SWI0s remarkable fan-out features. The evaluation demonstrates drastic improvements in the effectiveness of the proposed architecture in terms of power consumption ( 2-10x) and performance ( 22x) but with negligible hardware overheads ( 2%). The fourth contribution is to further explore multicast contention handling in a flexible decentralized manner, where original techniques such as stretch-multicast and ID-tagging flow control have been developed. A comparison of these techniques shows that the decentralized approach is superior to the centralized approach with low traffic loads, while the latter outperforms the former near and after NoC saturation

Design and implementation of in-network coherence

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2013.Title as it appears in MIT Commencement Exercises program, June 2013: Design and implementation of in-network coherence. Cataloged from PDF version of thesis.Includes bibliographical references (p. 101-104).CMOS technology scaling has enabled increasing transistor density on chip. At the same time, multi-core processors that provide increased performance, vis-a'-vis power efficiency, have become prevalent in a power constrained environment. The shared memory model is a predominant paradigm in such systems, easing programmability and increasing portability. However with memory being shared by an increasing number of cores, a scalable coherence mechanism is imperative for these systems. Snoopy coherence has been a favored coherence scheme owing to its high performance and simplicity. However there are few viable proposals to extend snoopy coherence to unordered interconnects - specifically, modular packet-switched interconnects that have emerged as a scalable solution to the communication challenges in the CMP era. This thesis proposes a distributed in-network global ordering scheme that enables snoopy coherence on unordered interconnects. The proposed scheme is realized on a two-dimensional mesh interconnection network, referred to as OMNI (Ordered Mesh Network Interconnect). OMNI is an enabling solution for the SCORPIO processor prototype developed at MIT - a 36-core chip multi-processor supporting snoopy coherence, and fabricated in a commercial 45nm technology. OMNI is shown to be effective, reducing runtime by 36% in comparison to directory and Hammer coherence protocol implementations. The OMNI network achieves an operating frequency of 833 MHz post-layout, occupies 10% of the chip area, and consumes less than 100mW of power.by Suvinay Subramanian.S.M