Computing the entire area/power consumption versus delay tradeoff curve for gate sizing with a piecewise linear simulator

The gate sizing problem is the problem of finding load drive capabilities for all gates in a given Boolean network such, that a given delay limit is kept, and the necessary cost in terms of active area usage and/or power consumption is minimal. This paper describes a way to obtain the entire cost versus delay tradeoff curve of a combinational logic circuit in an efficient way. Every point on the resulting curve is the global optimum of the corresponding gate sizing problem. The problem is solved by mapping it onto piecewise linear models in such a way, that a piecewise linear (circuit) simulator can do the job. It is shown that this setup is very efficient, and can produce tradeoff curves for large circuits (thousands of gates) in a few minutes. Benchmark results for the entire set of MCNC '91 two-level examples are give

Feasible delay bound definition

11th International Conference on Very Large Scale Integration ofSystems-on-Chip (VLSI-SOC'Ol) December 3-5, 2001, Montpellier, FranceInternational audienceMinimizing the number of iterations when satisfying performance constraints in IC design is of fundamental importance to limit the design iterations. We present a method to determine the feasibility of delay constraint imposed on circuit path. From a layout oriented study of the path delay distribution, we show how to obtain the upper and lower bounds of the delay of combinatorial paths. Then we characterise these bounds and present a method to determine, , the average weighted loading factor allowing to satisfy the delay constraint. Example of application is given on different ISCAS circuits

Concurrent optimization strategies for high-performance VLSI circuits

In the next generation of VLSI circuits, concurrent optimizations will be essential to achieve the performance challenges. In this dissertation, we present techniques for combining traditional timing optimization techniques to achieve a superior performance;The method of buffer insertion is used in timing optimization to either increase the driving power of a path in a circuit, or to isolate large capacitive loads that lie on noncritical or less critical paths. The procedure of transistor sizing selects the sizes of transistors within a circuit to achieve a given timing specification. Traditional design techniques perform these two optimizations as independent steps during synthesis, even though they are intimately linked and performing them in alternating steps is liable to lead to suboptimal solutions. The first part of this thesis presents a new approach for unifying transistor sizing with buffer insertion. Our algorithm achieve from 5% to 49% area reduction compared with the results of a standard transistor sizing algorithm;The next part of the thesis deals with the problem of collapsing gates for technology mapping. Two new techniques are proposed. The first method, the odd-level transistor replacement (OTR) method, performs technology mapping without the restriction of a fixed library size, and maps a circuit to a virtual library of complex static CMOS gates. The second technique, the Static CMOS/PTL method, uses a mix of static CMOS and pass transistor logic (PTL) to realize the circuit, using the relation between PTL and binary decision diagrams. The methods are very efficient and can handle all ISCAS\u2785 benchmark circuits in minutes. On average, it was found that the OTR method gave 40%, and the Static/PTL gave 50% delay reductions over SIS, with substantial area savings;Finally, we extend the technology mapping work to interleave it with placement in a single optimization. Conventional methods that perform these steps separately will not be adequate for next-generation circuits. Our approach presents an integrated solution to this problem, and shows an average of 28.19%, and a maximum of 78.42% improvement in the delay over a method that performs the two optimizations in separate steps

Knowledge creation and visualisation by using trade-off curves to enable set-based concurrent engineering

The increased international competition forces companies to sustain and improve market share through the production of a high quality product in a cost effective manner and in a shorter time. Set‑based concurrent engineering (SBCE), which is a core element of lean product development approach, has got the potential to decrease time‑to‑market as well as enhance product innovation to be produced in good quality and cost effective manner. A knowledge‑based environment is one of the important requ irements for a successful SBCE implementation. One way to provide this environment is the use of trade‑off curves (ToC). ToC is a tool to create and visualise knowledge in the way to understand the relationships between various conflicting design parame ters to each other. This paper presents an overview of different types of ToCs and the role of knowledge‑based ToCs in SBCE by employing an extensive literature review and industrial field study. It then proposes a process of generating and using knowledg e‑based ToCs in order to create and visualise knowledge to enable the following key SBCE activities: (1) Identify the feasible design space, (2) Generate set of conceptual design solutions, (3) Compare design solutions, (4) Narrow down the design sets, (5) Achieve final optimal design solution. Finally a hypothetical example of a car seat structure is presented in order to provide a better understanding of using ToCs. This example shows that ToCs are effective tools to be used as a knowledge sou rce at the early stages of product development process

Development of a 5V Digital Cell Library for use with the Peregrine Semiconductor Silicon-on-Sapphire Process

The scope of the thesis work presented here is to develop a standard digital cell library operable at 5V of power supply and up to the temperatures of 125C using Peregrine 0.5m2 3.3V CMOS process. Peregrine 0.5m process was selected as a result of its availability via commercial foundry at moderate cost radiation and high temperature tolerant properties. Testing data was obtained showing no measurable gate tunneling at gate voltages below 8.5V and no source to drain avalanche below 5.5V ensuring safe operation below the 5V design corners of 5.5V. Device geometries are selected to meet drive current requirement of 1mA and acceptable Ion/Ioff ratios at high temperature. Layouts for cells, schematic, symbolic and abstract views were generated. Timing, power and area characterization data is realized in several formats compatible with Cadence and Synopsys synthesizer, place & route and simulation tools. A test chip for delay chains with single input and multi-input combinatorial gates were designed and fabricated as a part of the validation on silicon. Measured data at room temperature is well in agreement with SignalStorm's data. At 125C, delay chains performed faster in silicon by up to 25% as compared with simulated data obtained using typical model. Device characteristics for rn and rp device are obtained and percentage variations in their Id-Vd characteristics with models are calculated. Variation in test data for the test chip as compared to the simulated data is observed to be consistent with the device current variation plotted across process corners. Adherence of the targeted design specifications (from simulation) with the actual measured values verifies the cell library's functionality, timing and power parameters.School of Electrical & Computer Engineerin

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Variability-Aware VLSI Design Automation For Nanoscale Technologies

As technology scaling enters the nanometer regime, design of large scale ICs gets more challenging due to shrinking feature sizes and increasing design complexity. Aggressive scaling causes significant degradation in reliability, increased susceptibility to fabrication and environmental randomness and increased dynamic and leakage power dissipation. In this work, we investigate these scaling issues in large scale integrated systems. This dissertation proposes to develop variability-aware design methodologies by proposing design analysis, design-time optimization, post-silicon tunability and runtime-adaptivity based optimization techniques for handling variability. We discuss our research in the area of variability-aware analysis, specifically focusing on the problem of statistical timing analysis. The first technique presents the concept of error budgeting that achieves significant runtime speedups during statistical timing analysis. The second work presents a general framework for non-linear non-Gaussian statistical timing analysis considering correlations. Further, we present our work on design-time optimization schemes that are applicable during physical synthesis. Firstly, we present a buffer insertion technique that considers wire-length uncertainty and proposes algorithms to perform probabilistic buffer insertion. Secondly, we present a stochastic optimization framework based on Monte-Carlo technique considering fabrication variability. This optimization framework can be applied to problems that can be modeled as linear programs without without imposing any assumptions on the nature of the variability. Subsequently, we present our work on post-silicon tunability based design optimization. This work presents a design management framework that can be used to balance the effort spent on pre-silicon (through gate sizing) and post-silicon optimization (through tunable clock-tree buffers) while maximizing the yield gains. Lastly, we present our work on variability-aware runtime optimization techniques. We look at the problem of runtime supply voltage scaling for dynamic power optimization, and propose a framework to consider the impact of variability on the reliability of such designs. We propose a probabilistic design synthesis technique where reliability of the design is a primary optimization metric

Low-Power and Error-Resilient VLSI Circuits and Systems.

Efficient low-power operation is critically important for the success of the next-generation signal processing applications. Device and supply voltage have been continuously scaled to meet a more constrained power envelope, but scaling has created resiliency challenges, including increasing timing faults and soft errors. Our research aims at designing low-power and robust circuits and systems for signal processing by drawing circuit, architecture, and algorithm approaches. To gain an insight into the system faults due to supply voltage reduction, we researched the two primary effects that determine the minimum supply voltage (VMIN) in Intel’s tri-gate CMOS technology, namely process variations and gate-dielectric soft breakdown. We determined that voltage scaling increases the timing window that sequential circuits are vulnerable. Thus, we proposed a new hold-time violation metric to define hold-time VMIN, which has been adopted as a new design standard. Device scaling increases soft errors which affect circuit reliability. Through extensive soft error characterization using two 65nm CMOS test chips, we studied the soft error mechanisms and its dependence on supply voltage and clock frequency. This study laid the foundation of the first 65nm DSP chip design for a NASA spaceflight project. To mitigate such random errors, we proposed a new confidence-driven architecture that effectively enhances the error resiliency of deeply scaled CMOS and post-CMOS circuits. Designing low-power resilient systems can effectively leverage application-specific algorithmic approaches. To explore design opportunities in the algorithmic domain, we demonstrate an application-specific detection and decoding processor for multiple-input multiple-output (MIMO) wireless communication. To enhance the receive error rate for a robust wireless communication, we designed a joint detection and decoding technique by enclosing detection and decoding in an iterative loop to enhance both interference cancellation and error reduction. A proof-of-concept chip design was fabricated for the next-generation 4x4 256QAM MIMO systems. Through algorithm-architecture optimizations and low-power circuit techniques, our design achieves significant improvements in throughput, energy efficiency and error rate, paving the way for future developments in this area.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/110323/1/uchchen_1.pd

MOCAST 2021

The 10th International Conference on Modern Circuit and System Technologies on Electronics and Communications (MOCAST 2021) will take place in Thessaloniki, Greece, from July 5th to July 7th, 2021. The MOCAST technical program includes all aspects of circuit and system technologies, from modeling to design, verification, implementation, and application. This Special Issue presents extended versions of top-ranking papers in the conference. The topics of MOCAST include:Analog/RF and mixed signal circuits;Digital circuits and systems design;Nonlinear circuits and systems;Device and circuit modeling;High-performance embedded systems;Systems and applications;Sensors and systems;Machine learning and AI applications;Communication; Network systems;Power management;Imagers, MEMS, medical, and displays;Radiation front ends (nuclear and space application);Education in circuits, systems, and communications

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems