Design of Adiabatic MTJ-CMOS Hybrid Circuits

Low-power designs are a necessity with the increasing demand of portable devices which are battery operated. In many of such devices the operational speed is not as important as battery life. Logic-in-memory structures using nano-devices and adiabatic designs are two methods to reduce the static and dynamic power consumption respectively. Magnetic tunnel junction (MTJ) is an emerging technology which has many advantages when used in logic-in-memory structures in conjunction with CMOS. In this paper, we introduce a novel adiabatic hybrid MTJ/CMOS structure which is used to design AND/NAND, XOR/XNOR and 1-bit full adder circuits. We simulate the designs using HSPICE with 32nm CMOS technology and compared it with a non-adiabatic hybrid MTJ/CMOS circuits. The proposed adiabatic MTJ/CMOS full adder design has more than 7 times lower power consumtion compared to the previous MTJ/CMOS full adder

CMOS Terahertz Metamaterial Based 64 × 64 Bolometric Detector Arrays

We present two terahertz detectors composed of microbolometer sensors (vanadium oxide and silicon pn diode) and metamaterial absorbers monolithically integrated into a complementary metal oxide semiconductor (CMOS) process. The metamaterial absorbers were created using the metal-dielectric-metal layers of a commercial CMOS technology resulting in low-cost terahertz detectors. The scalability of this technology was used to form a 64 × 64 pixel terahertz focal plane array

Development of high-performances monolithic CMOS detectors for space applications

This paper describes the development of a 750x750 pixels CMOS image sensor for star tracker applications. A first demonstrator of such a star tracker called SSM star tracker built around a 512x512 detector has been recently developed and proves the feasibility of such instrument. In order to take fully advantage of the CMOS image sensor step, the 750x750 device called SSM CMOS detector which will take part of the final star tracker, can be considered as a major technical breakthrough that gives a decisive advantage in terms of on satellite implementation cost and flexibility (sensor mass and power consumption minimisation, electronics and architecture flexibility). Indeed, built using the 0.5μm Alcatel Microelectronics standard CMOS technology, the SSM CMOS detector will feature on-chip temperature sensor and on-chip sequencer. In order to evaluate the radiation tolerance of such manufacturing technology, a radiation campaign that contains studies of total dose and latch-up effects has been led on a specific test vehicle

Switched-Current Chaotic Neurons

The Letter presents two nonlinear CMOS current-mode circuits that implement neuron soma equations for chaotic neural networks. They have been fabricated in a double-metal, single-poly 1.6µm CMOS technology. The neuron soma circuits use a novel, highly accurate CMOS circuit strategy to realise piecewise-linear characteristics in the current-mode domain. Their prototypes obtain reduced area and low voltage power supply (down to 3V) with a clock frequency of 500 kHz

Fully CMOS Memristor Based Chaotic Circuit

This paper demonstrates the design of a fully CMOS chaotic circuit consisting of only DDCC based memristor and inductance simulator. Our design is composed of these active blocks using CMOS 0.18 µm process technology with symmetric ±1.25 V supply voltages. A new single DDCC+ based topology is used as the inductance simulator. Simulation results verify that the design proposed satisfies both memristor properties and the chaotic behavior of the circuit. Simulations performed illustrate the success of the proposed design for the realization of CMOS based chaotic applications

Characterisation of AMS H35 HV-CMOS monolithic active pixel sensor prototypes for HEP applications

Monolithic active pixel sensors produced in High Voltage CMOS (HV-CMOS) technology are being considered for High Energy Physics applications due to the ease of production and the reduced costs. Such technology is especially appealing when large areas to be covered and material budget are concerned. This is the case of the outermost pixel layers of the future ATLAS tracking detector for the HL-LHC. For experiments at hadron colliders, radiation hardness is a key requirement which is not fulfilled by standard CMOS sensor designs that collect charge by diffusion. This issue has been addressed by depleted active pixel sensors in which electronics are embedded into a large deep implantation ensuring uniform charge collection by drift. Very first small prototypes of hybrid depleted active pixel sensors have already shown a radiation hardness compatible with the ATLAS requirements. Nevertheless, to compete with the present hybrid solutions a further reduction in costs achievable by a fully monolithic design is desirable. The H35DEMO is a large electrode full reticle demonstrator chip produced in AMS 350 nm HV-CMOS technology by the collaboration of Karlsruher Institut f\"ur Technologie (KIT), Institut de F\'isica d'Altes Energies (IFAE), University of Liverpool and University of Geneva. It includes two large monolithic pixel matrices which can be operated standalone. One of these two matrices has been characterised at beam test before and after irradiation with protons and neutrons. Results demonstrated the feasibility of producing radiation hard large area fully monolithic pixel sensors in HV-CMOS technology. H35DEMO chips with a substrate resistivity of 200$\Omega$ cm irradiated with neutrons showed a radiation hardness up to a fluence of $10^{15}$n$_{eq}$cm$^{-2}$ with a hit efficiency of about 99% and a noise occupancy lower than $10^{-6}$ hits in a LHC bunch crossing of 25ns at 150V

Analog IC Design at the University of Twente

This article describes some recent research results from the IC Design group of the University of Twente, located in Enschede, The Netherlands.\ud \ud Our research focuses on analog CMOS circuit design with emphasis on high frequency and broadband circuits. With the trend of system integration in mind, we try to develop new circuit techniques that enable the next steps in system integration in nanometer CMOS technology. Our research funding comes from industry, as well as from governmental organizations. We aim to find fundamental solutions for practical problems of integrated circuits realized in industrial Silicon technologies.\ud \ud CMOS IC technology is dictated by optimal cost and performance of digital circuits and is certainly not optimized for nice analog behavior. As analog designers, we do not have the illusion to be able to change the CMOS technology, so we have to "live with it" and solve the problems by design. In this article several examples will be shown, where problematic analog behavior, such as noise and distortion, can be tackled with new circuit design techniques. These circuit techniques are developed in such a way that they do benefit from the modern technology and thus enable further integration. This way we can improve various analog building blocks for wireless, wire-line and optical communication. Below some examples are given.\ud \u

High-temperature Complementary Metal Oxide Semiconductors (CMOS)

The results of an investigation into the possibility of using complementary metal oxide semiconductor (CMOS) technology for high temperature electronics are presented. A CMOS test chip was specifically developed as the test bed. This test chip incorporates CMOS transistors that have no gate protection diodes; these diodes are the major cause of leakage in commercial devices