Towards Structural Testing of Superconductor Electronics

Many of the semiconductor technologies are already\ud facing limitations while new-generation data and\ud telecommunication systems are implemented. Although in\ud its infancy, superconductor electronics (SCE) is capable of\ud handling some of these high-end tasks. We have started a\ud defect-oriented test methodology for SCE, so that reliable\ud systems can be implemented in this technology. In this\ud paper, the details of the study on the Rapid Single-Flux\ud Quantum (RSFQ) process are presented. We present\ud common defects in the SCE processes and corresponding\ud test methodologies to detect them. The (measurement)\ud results prove that we are able to detect possible random\ud defects for statistical purposes in yield analysis. This\ud paper also presents possible test methodologies for RSFQ\ud circuits based on defect oriented testing (DOT)

LDSD II: Lisbon, May 1997

AbstractThe second meeting in our series — LDSD I was held in Singapore in 1995, brings together researchers active in the field of Low Dimensional Structures and Devices (LDSD). The conference will serve as a forum for open discusion of new developments in LDSD and to unite the broad range of physics and engineering disciplines that will determine the future of the electronics industry. We invite Papers in both fundamental and applied research with emphasis on growth technology, characterisation and applications of this new generation of electronic and opto electronic devices

Interfaces, modularity and ecosystem emergence: How DARPA modularized the semiconductor ecosystem

Scholars have identified the pivotal role that modularity plays in promoting innovation. Modularity affects industry structure by breaking up the value chain along technical interfaces, thereby allowing new entrants to specialize and innovate. Less well-understood is where modularity comes from. Firms seem to behave consistently with the theory in some settings, especially the information technology sector, but not in others, such as automobiles. Here we show how the government has a role to play in generating open interfaces needed for modularity, utilizing a case study of the semiconductor industry from 1970 to 1980. We show how the Defense Department\u27s support for this effort aligned with its mission-based interest in semiconductors. We thus contribute a new source of open standards to the modularity literature, as well as a new analytical perspective to the public research funding literature

Development and Packaging of Microsystems Using Foundry Services

Micro-electro-mechanical systems (MEMS) are a new and rapidly growing field of research. Several advances to the MEMS state of the art were achieved through design and characterization of novel devices. Empirical and theoretical model of polysilicon thermal actuators were developed to understand their behavior. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10(exp -3)/K. The sheet resistance of the MUMPs polysilicon layers was found to be dependent on linewidth due to presence or absence of lateral phosphorus diffusion. The functional integration of MEMS with CMOS was demonstrated through the design of automated positioning and assembly systems, and a new power averaging scheme was devised. Packaging of MEMS using foundry multichip modules (MCMs) was shown to be a feasible approach to physical integration of MEMS with microelectronics. MEMS test die were packaged using Micro Module Systems MCM-D and General Electric High Density Intercounect and Chip-on-Flex MCM foundries. Xenon difluoride (XeF2) was found to be an excellent post-packaging etchant for bulk micromachined MEMS. For surface micromachining, hydrofluoric acid (HF) can be used

Adapting Multichip Module Foundries for MEMS Packaging

Abstract Methods of packaging micro-electro-mechanical systems (MEM

Photonic Integrated Circuit (PIC) Device Structures: Background, Fabrication Ecosystem, Relevance to Space Systems Applications, and Discussion of Related Radiation Effects

Electronic integrated circuits are considered one of the most significant technological advances of the 20th century, with demonstrated impact in their ability to incorporate successively higher numbers transistors and construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled optical components, including such "building-block" structures as waveguides, MMIs, lasers, and optical ring resonators. The ability to construct electronic and photonic components on a single microsystems platform offers transformative potential for the development of technologies in fields including communications, biomedical device development, autonomous navigation, and chemical and atmospheric sensing. Developing on-chip systems that provide new avenues for integration and replacement of bulk optical and electro-optic components also reduces size, weight, power and cost (SWaP-C) limitations, which are important in the selection of instrumentation for specific flight projects. The number of applications currently emerging for complex photonics systems-particularly in data communications-warrants additional investigations when considering reliability for space systems development. This Body of Knowledge document seeks to provide an overview of existing integrated photonics architectures; the current state of design, development, and fabrication ecosystems in the United States and Europe; and potential space applications, with emphasis given to associated radiation effects and reliability

Evolution of Integrated MEMS Design Methodology

Abstract -The long term impact of MEMS technology will be in its ability to integrate novel sensing and actuation functionality on traditional computing and communication devices enabling the ubiquitous digital computer to interact with the world around it. The design and verification of such integrated systems will occur at the system level, driven primarily by the application [1]. Therefore application-driven system level design methodologies are needed to ease the integration of the digital area to the real world using mixed area technologies

Complex VLSI Feature Comparison for Commercial Microelectronics Verification

Shortcomings in IC verification make for glaring vulnerabilities in the form of hardware backdoors, or extraneous operation modes that allow unauthorized, undetected access. The DARPA TRUST program addressed the need for verification of untrusted circuits using industry-standard and custom software. The process developed under TRUST and implemented at the AFRL Mixed Signal Design Center has not been tested using real-world circuits outside of the designated TRUST test cases. This research demonstrates the potential of applying software designed for TRUST test articles on microchips from questionable sources. A specific process is developed for both transistor-level library cell verification and gate-level circuit verification. The relative effectiveness and scalability of the process are assessed

Impact of Technology Spreading on MEMS design Robustness

International audienc