4 research outputs found

    Feature Extraction for image super-resolution using finite rate of innovation principles

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    To understand a real-world scene from several multiview pictures, it is necessary to find the disparities existing between each pair of images so that they are correctly related to one another. This process, called image registration, requires the extraction of some specific information about the scene. This is achieved by taking features out of the acquired images. Thus, the quality of the registration depends largely on the accuracy of the extracted features. Feature extraction can be formulated as a sampling problem for which perfect re- construction of the desired features is wanted. The recent sampling theory for signals with finite rate of innovation (FRI) and the B-spline theory offer an appropriate new frame- work for the extraction of features in real images. This thesis first focuses on extending the sampling theory for FRI signals to a multichannel case and then presents exact sampling results for two different types of image features used for registration: moments and edges. In the first part, it is shown that the geometric moments of an observed scene can be retrieved exactly from sampled images and used as global features for registration. The second part describes how edges can also be retrieved perfectly from sampled images for registration purposes. The proposed feature extraction schemes therefore allow in theory the exact registration of images. Indeed, various simulations show that the proposed extraction/registration methods overcome traditional ones, especially at low-resolution. These characteristics make such feature extraction techniques very appropriate for applications like image super-resolution for which a very precise registration is needed. The quality of the super-resolved images obtained using the proposed feature extraction meth- ods is improved by comparison with other approaches. Finally, the notion of polyphase components is used to adapt the image acquisition model to the characteristics of real digital cameras in order to run super-resolution experiments on real images

    Time-Interleaved Analog-to-Digital-Converters: Modeling, Blind Identification and Digital Correction of Frequency Response Mismatches

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    Analog-to-digital-conversion enables utilization of digital signal processing (DSP) in many applications today such as wireless communication, radar and electronic warfare. DSP is the favored choice for processing information over analog signal processing (ASP) because it can typically offer more flexibility, computational power, reproducibility, speed and accuracy when processing and extracting information. Software defined radio (SDR) receiver is one clear example of this, where radio frequency waveforms are converted into digital form as close to the antenna as possible and all the processing of the information contained in the received signal is extracted in a configurable manner using DSP. In order to achieve such goals, the information collected from the real world signals, which are commonly analog in their nature, must be converted into digital form before it can be processed using DSP in the respective systems. The common trend in these systems is to not only process ever larger bandwidths of data but also to process data in digital format at ever higher processing speeds with sufficient conversion accuracy. So the analog-to-digital-converter (ADC), which converts real world analog waveforms into digital form, is one of the most important cornerstones in these systems.The ADC must perform data conversion at higher and higher rates and digitize ever-increasing bandwidths of data. In accordance with the Nyquist-Shannon theorem, the conversion rate of the ADC must be suffcient to accomodate the BW of the signal to be digitized, in order to avoid aliasing. The conversion rate of the ADC can in general be increased by using parallel ADCs with each ADC performing the sampling at mutually different points in time. Interleaving the outputs of each of the individual ADCs provides then a higher digitization output rate. Such ADCs are referred to as TI-ADC. However, the mismatches between the ADCs cause unwanted spurious artifacts in the TI-ADC’s spectrum, ultimately leading to a loss in accuracy in the TI-ADC compared to the individual ADCs. Therefore, the removal or correction of these unwanted spurious artifacts is essential in having a high performance TI-ADC system.In order to remove the unwanted interleaving artifacts, a model that describes the behavior of the spurious distortion products is of the utmost importance as it can then facilitate the development of efficient digital post-processing schemes. One major contribution of this thesis consists of the novel and comprehensive modeling of the spurious interleaving mismatches in different TI-ADC scenarios. This novel and comprehensive modeling is then utilized in developing digital estimation and correction methods to remove the mismatch induced spurious artifacts in the TI-ADC’s spectrum and recovering its lost accuracy. Novel and first of its kind digital estimation and correction methods are developed and tested to suppress the frequency dependent mismatch spurs found in the TI-ADCs. The developed methods, in terms of the estimation of the unknown mismatches, build on statistical I/Q signal processing principles, applicable without specifically tailored calibration signals or waveforms. Techniques to increase the analog BW of the ADC are also analyzed and novel solutions are presented. The interesting combination of utilizing I/Q downconversion in conjunction with TI-ADC is examined, which not only extends the TI-ADC’s analog BW but also provides flexibility in accessing the radio spectrum. Unwanted spurious components created during the ADC’s bandwidth extension process are also analyzed and digital correction methods are developed to remove these spurs from the spectrum. The developed correction techniques for the removal of the undesired interleaving mismatch artifacts are validated and tested using various HW platforms, with up to 1 GHz instantaneous bandwidth. Comprehensive test scenarios are created using measurement data obtained from HW platforms, which are used to test and evaluate the performance of the developed interleaving mismatch estimation and correction schemes, evidencing excellent performance in all studied scenarios. The findings and results presented in this thesis contribute towards increasing the analog BW and conversion rate of ADC systems without losing conversion accuracy. Overall, these developments pave the way towards fulfilling the ever growing demands on the ADCs in terms of higher conversion BW, accuracy and speed

    Feature Extraction for Image Super-resolution using Finite Rate of Innovation Principles

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    To understand a real-world scene from several multiview pictures, it is necessary to find the disparities existing between each pair of images so that they are correctly related to one another., This process. called image registration, reguires the extraction of some specific information about the scene. This is achieved by taking features out of the acquired imaqes. Thus, the quality of the, registration depends largely on the accuracy of the extracted features. Feature extraction can be formulated as a sampling problem for which perfect reconstruction of the, desired features is wanted. The recent sampling theory for signals with finite rate of innovation (FR/), and the B-spline theory offer an appropriate new framework for the extraction of features in real, images. This thesis first focuses on extending the sampling theory for FRI signals to a multichannel, case and then presents exact sampling results for two different types of image features used for, registration: moments and edges. In the first part, it is shown that the geometric moments of an observed scene can be retrieved exactly from sampled images and used as global features for registration. The second part describes how edges can also be retrieved perfectly from sampled images for registration purposes. The proposed feature extraction schemes therefore allow in theory the exact registration of images. Indeed, various simulations show that the proposed extraction/registration methods overcome traditional ones, especially at low-resolution. These characteristics make such feature extraction techniques very appropriate for applications like image super-resolution for which a very precise registration is needed. The quality of the superresolved images obtained using the proposed feature extraction methods is improved by comparison with other approaches. Finally, the notion of polyphase components is used to adapt the imaqe acquisition model to the characteristics of real digital cameras in order to run super-resolution experiments on real images

    Design and debugging of multi-step analog to digital converters

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    With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process
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