Particle detection experiment for Applications Technology Satellite 1 /ATS-1/ Final report

Applications technology satellite particle detection experiment for measuring energy spectra of earth magnetic fiel

Proceedings of the 1977 NASA/ISHM Microelectronics Conference

Current and future requirements for research, development, manufacturing and education in the field of hybrid microelectronic technology were discussed

In-flight maintenance study Final report

Sample system analysis, MF requirements, redesign, and packaging desig

Maintainability Design Criteria for Packaging of Spacecraft Replaceable Electronic Equipment Final Report

Maintainability design criteria for packaging of spacecraft replaceable electronic equipmen

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions

Visual Inspection Algorithms for Printed Circuit Board Patterns A SURVEY

The importance of the inspection process has been magnified by the requirements of the modern manufacturing environment. In electronics mass-production manufacturing facilities, an attempt is often made to achieve 100 % quality assurance of all parts, subassemblies, and finished goods. A variety of approaches for automated visual inspection of printed circuits have been reported over the last two decades. In this survey, algorithms and techniques for the automated inspection of printed circuit boards are examined. A classification tree for these algorithms is presented and the algorithms are grouped according to this classification. This survey concentrates mainly on image analysis and fault detection strategies, these also include the state-of-the-art techniques. Finally, limitations of current inspection systems are summarized

Design, processing and testing of LSI arrays hybrid microelectronics task

Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed

Extreme ultraviolet and X-ray spectroheliograph for OSO-H

A complex scientific instrument was designed, fabricated, tested, and calibrated for launch onboard OSO-H. This instrument consisted of four spectroheliographs and an X-ray polarimeter. The instrument is designed to study solar radiation at selected wavelengths in the X-ray and the extreme ultraviolet ranges, make observations at the H-alpha wavelength, and measure the degree of polarization of X-ray emissions