Fog computing, applications , security and challenges, review

The internet of things originates a world where on daily basis objects can join the internet and interchange information and in addition process, store, gather them from the nearby environment, and effectively mediate on it. A remarkable number of services might be imagined by abusing the internet of things. Fog computing which is otherwise called edge computing was introduced in 2012 as a considered is a prioritized choice for the internet of things applications. As fog computing extend services of cloud near to the edge of the network and make possible computations, communications, and storage services in proximity to the end user. Fog computing cannot only provide low latency, location awareness but also enhance real-time applications, quality of services, mobility, security and privacy in the internet of things applications scenarios. In this paper, we will summarize and overview fog computing model architecture, characteristic, similar paradigm and various applications in real-time scenarios such as smart grid, traffic control system and augmented reality. Finally, security challenges are presented

Radiation safety based on the sky shine effect in reactor

In the reactor operation, neutrons and gamma rays are the most dominant radiation. As protection, lead and concrete shields are built around the reactor. However, the radiation can penetrate the water shielding inside the reactor pool. This incident leads to the occurrence of sky shine where a physical phenomenon of nuclear radiation sources was transmitted panoramic that extends to the environment. The effect of this phenomenon is caused by the fallout radiation into the surrounding area which causes the radiation dose to increase. High doses of exposure cause a person to have stochastic effects or deterministic effects. Therefore, this study was conducted to measure the radiation dose from sky shine effect that scattered around the reactor at different distances and different height above the reactor platform. In this paper, the analysis of the radiation dose of sky shine effect was measured using the experimental metho

Demystifying the Characteristics of 3D-Stacked Memories: A Case Study for Hybrid Memory Cube

Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally associated with memories. A practical 3D-stacked memory is Hybrid Memory Cube (HMC), which provides significant access bandwidth and low power consumption in a small area. Although several studies have taken advantage of the novel architecture of HMC, its characteristics in terms of latency and bandwidth or their correlation with temperature and power consumption have not been fully explored. This paper is the first, to the best of our knowledge, to characterize the thermal behavior of HMC in a real environment using the AC-510 accelerator and to identify temperature as a new limitation for this state-of-the-art design space. Moreover, besides bandwidth studies, we deconstruct factors that contribute to latency and reveal their sources for high- and low-load accesses. The results of this paper demonstrates essential behaviors and performance bottlenecks for future explorations of packet-switched and 3D-stacked memories.Comment: EEE Catalog Number: CFP17236-USB ISBN 13: 978-1-5386-1232-

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Exploring New Computing Paradigms for Data-Intensive Applications

L'abstract è presente nell'allegato / the abstract is in the attachmen