12 research outputs found
Interconnect Challenges and Carbon Nanotube as Interconnect in Nano VLSI Circuits
This chapter discusses about the behavior of Carbon Nanotube (CNT) different structures which can be used as interconnect in Very Large Scale (VLSI) circuits in nanoscale regime. Also interconnect challenges in VLSI circuits which lead to use CNT as interconnect instead of Cu, is reviewed. CNTs are classified into three main types including Single-walled Carbon Nanotube (SWCNT), CNT Bundle, and Multi-walled Carbon Nanotube (MWCNT). Because of extremely high quantum resistance of a SWCNT which is about 6.45 kΩ, rope or bundle of CNTs are used which consist of parallel CNTs in order to overcome the high delay time due to the high intrinsic (quantum) resistance. Also MWCNTs which consist of parallel shells, present much less delay time with respect to SWCNTs, for the application as interconnects. In this chapter, first a short discussion about interconnect challenges in VLSI circuits is presented. Then the repeater insertion technique for the delay reduction in the global interconnects will be studied. After that, the parameters and circuit model of a CNT will be discussed. Then a brief review about the different structures of CNT interconnects including CNT bundle and MWCNT will be presented. At the continuation, the time domain behavior of a CNT bundle interconnect in a driver-CNT bundle-load configuration will be discussed and analyzed. In this analysis, CNT bundle is modeled as a transmission line circuit model. At the end, a brief study of stability analysis in CNT interconnects will be presented
Impact of Bundle Structure on Performance of on-Chip CNT Interconnects
CNTs are proposed as a promising candidate against copper in deep submicron IC interconnects. Still this technology is in its infancy. Most available literatures on performance predictions of CNT interconnects, have focused only on interconnect geometries using segregated CNTs. Yet during the manufacturing phase, CNTs are obtained usually as a mixture of single-walled and multi-walled CNTs (SWCNTs and MWCNTs). Especially in case of SWCNTs; it is usually available as a mixture of both Semi conducting CNTs and metallic CNTs. This paper attempts to answer whether segregation is inevitable before using them to construct interconnects. This paper attempt to compare the performance variations of bundled CNT interconnects, where bundles are made of segregated CNTs versus mixed CNTs, for future technology nodes using electrical model based analysis. Also a proportionate mixing of different CNTs has been introduced so as to yield a set of criteria to aid the industry in selection of an appropriate bundle structure for use in a specific application with optimum performance. It was found that even the worst case performance of geometries using a mixture of SWCNTs and MWCNTs was better than copper. These results also reveal that, for extracting optimum performance vide cost matrix, the focus should be more on diameter controlled synthesis than on segregation
Carbon nanotubes as interconnect for next generation network on chip
Multi-core processors provide better performance when compared with their single-core equivalent. Recently, Networks-on-Chip (NoC) have emerged as a communication methodology for multi core chips. Network-on-Chip uses packet based communication for establishing a communication path between multiple cores connected via interconnects. Clock frequency, energy consumption and chip size are largely determined by these interconnects. According to the International Technology Roadmap for Semiconductors (ITRS), in the next five years up to 80% of microprocessor power will be consumed by interconnects. In the sub 100nm scaling range, interconnect behavior limits the performance and correctness of VLSI systems. The performance of copper interconnects tend to get reduced in the sub 100nm range and hence we need to examine other interconnect options. Single Wall Carbon Nanotubes exhibit better performance in sub 100nm processing technology due to their very large current carrying capacity and large electron mean free paths. This work suggests using Single Wall Carbon Nanotubes (SWCNT) as interconnects for Networks-on-Chip as they consume less energy and gives more throughput and bandwidth when compared with traditional Copper wires
Solid State Circuits Technologies
The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book
Interconnects architectures for many-core era using surface-wave communication
PhD ThesisNetworks-on-chip (NoCs) is a communication paradigm that has
emerged aiming to address on-chip communication challenges and
to satisfy interconnection demands for chip-multiprocessors (CMPs).
Nonetheless, there is continuous demand for even higher computational
power, which is leading to a relentless downscaling of CMOS
technology to enable the integration of many-cores. However, technology
downscaling is in favour of the gate nodes over wires in terms
of latency and power consumption. Consequently, this has led to the
era of many-core processors where power consumption and performance
are governed by inter-core communications rather than core
computation. Therefore, NoCs need to evolve from being merely metalbased
implementations which threaten to be a performance and power
bottleneck for many-core efficiency and scalability.
To overcome such intensified inter-core communication challenges,
this thesis proposes a novel interconnect technology: the surface-wave
interconnect (SWI). This new RF-based on-chip interconnect has notable
characteristics compared to cutting-edge on-chip interconnects
in terms of CMOS compatibility, high speed signal propagation, low
power dissipation, and massive signal fan-out. Nonetheless, the realization
of the SWI requires investigations at different levels of abstraction,
such as the device integration and RF engineering levels. The aim
of this thesis is to address the networking and system level challenges
and highlight the potential of this interconnect. This should
encourage further research at other levels of abstraction. Two specific
system-level challenges crucial in future many-core systems are tackled
in this study, which are cross-the-chip global communication and
one-to-many communication.
This thesis makes four major contributions towards this aim. The
first is reducing the NoC average-hop count, which would otherwise
increase packet-latency exponentially, by proposing a novel hybrid
interconnect architecture. This hybrid architecture can not only utilize
both regular metal-wire and SWI, but also exploits merits of
both bus and NoC architectures in terms of connectivity compared to
other general-purpose on-chip interconnect architectures. The second
contribution addresses global communication issues by developing
a distance-based weighted-round-robin arbitration (DWA) algorithm.
This technique prioritizes global communication to be send via SWI
short-cuts, which offer more efficient power dissipation and faster
across-the-chip signal propagation. Results obtained using a cycleaccurate
simulator demonstrate the effectiveness of the proposed
system architecture in terms of significant power reduction, considervii
able average delay reduction and higher throughput compared to a
regular NoC. The third contribution is in handling multicast communications,
which are normally associated with traffic overload, hotspots
and deadlocks and therefore increase, by an order of magnitude the
power consumption and latency. This has been achieved by proposing
a novel routing and centralized arbitration schemes that exploits
the SWI0s remarkable fan-out features. The evaluation demonstrates
drastic improvements in the effectiveness of the proposed architecture
in terms of power consumption ( 2-10x) and performance ( 22x) but
with negligible hardware overheads ( 2%). The fourth contribution is
to further explore multicast contention handling in a flexible decentralized
manner, where original techniques such as stretch-multicast
and ID-tagging flow control have been developed. A comparison of
these techniques shows that the decentralized approach is superior
to the centralized approach with low traffic loads, while the latter
outperforms the former near and after NoC saturation