On Regularity and Integrated DFM Metrics

Transistor geometries are well into the nanometer regime, keeping with Moore's Law. With this scaling in geometry, problems not significant in the larger geometries have come to the fore. These problems, collectively termed variability, stem from second-order effects due to the small geometries themselves and engineering limitations in creating the small geometries. The engineering obstacles have a few solutions which are yet to be widely adopted due to cost limitations in deploying them. Addressing and mitigating variability due to second-order effects comes largely under the purview of device engineers and to a smaller extent, design practices. Passive layout measures that ease these manufacturing limitations by regularizing the different layout pitches have been explored in the past. However, the question of the best design practice to combat systematic variations is still open. In this work we explore considerations for the regular layout of the exclusive-OR gate, the half-adder and full-adder cells implemented with varying degrees of regularity. Tradeoffs like complete interconnect unidirectionality, and the inevitable introduction of vias are qualitatively analyzed and some factors affecting the analysis are presented. Finally, results from the Calibre Critical Feature Analysis (CFA) of the cells are used to evaluate the qualitative analysis

Layout regularity metric as a fast indicator of process variations

Integrated circuits design faces increasing challenge as we scale down due to the increase of the effect of sensitivity to process variations. Systematic variations induced by different steps in the lithography process affect both parametric and functional yields of the designs. These variations are known, themselves, to be affected by layout topologies. Design for Manufacturability (DFM) aims at defining techniques that mitigate variations and improve yield. Layout regularity is one of the trending techniques suggested by DFM to mitigate process variations effect. There are several solutions to create regular designs, like restricted design rules and regular fabrics. These regular solutions raised the need for a regularity metric. Metrics in literature are insufficient for different reasons; either because they are qualitative or computationally intensive. Furthermore, there is no study relating either lithography or electrical variations to layout regularity. In this work, layout regularity is studied in details and a new geometrical-based layout regularity metric is derived. This metric is verified against lithographic simulations and shows good correlation. Calculation of the metric takes only few minutes on 1mm x 1mm design, which is considered fast compared to the time taken by simulations. This makes it a good candidate for pre-processing the layout data and selecting certain areas of interest for lithographic simulations for faster throughput. The layout regularity metric is also compared against a model that measures electrical variations due to systematic lithographic variations. The validity of using the regularity metric to flag circuits that have high variability using the developed electrical variations model is shown. The regularity metric results compared to the electrical variability model results show matching percentage that can reach 80%, which means that this metric can be used as a fast indicator of designs more susceptible to lithography and hence electrical variations

Resolution Enhancement Techniques (RET) for Immersion Lithography

Ph.DDOCTOR OF PHILOSOPH

Miniaturized Transistors

What is the future of CMOS? Sustaining increased transistor densities along the path of Moore's Law has become increasingly challenging with limited power budgets, interconnect bandwidths, and fabrication capabilities. In the last decade alone, transistors have undergone significant design makeovers; from planar transistors of ten years ago, technological advancements have accelerated to today's FinFETs, which hardly resemble their bulky ancestors. FinFETs could potentially take us to the 5-nm node, but what comes after it? From gate-all-around devices to single electron transistors and two-dimensional semiconductors, a torrent of research is being carried out in order to design the next transistor generation, engineer the optimal materials, improve the fabrication technology, and properly model future devices. We invite insight from investigators and scientists in the field to showcase their work in this Special Issue with research papers, short communications, and review articles that focus on trends in micro- and nanotechnology from fundamental research to applications

Power Management and SRAM for Energy-Autonomous and Low-Power Systems

We demonstrate the two first-known, complete, self-powered millimeter-scale computer systems. These microsystems achieve zero-net-energy operation using solar energy harvesting and ultra-low-power circuits. A medical implant for monitoring intraocular pressure (IOP) is presented as part of a treatment for glaucoma. The 1.5mm3 IOP monitor is easily implantable because of its small size and measures IOP with 0.5mmHg accuracy. It wirelessly transmits data to an external wand while consuming 4.7nJ/bit. This provides rapid feedback about treatment efficacies to decrease physician response time and potentially prevent unnecessary vision loss. A nearly-perpetual temperature sensor is presented that processes data using a 2.1μW near-threshold ARM°R Cortex- M3TM μP that provides a widely-used and trusted programming platform. Energy harvesting and power management techniques for these two microsystems enable energy-autonomous operation. The IOP monitor harvests 80nW of solar power while consuming only 5.3nW, extending lifetime indefinitely. This allows the device to provide medical information for extended periods of time, giving doctors time to converge upon the best glaucoma treatment. The temperature sensor uses on-demand power delivery to improve low-load dc-dc voltage conversion efficiency by 4.75x. It also performs linear regulation to deliver power with low noise, improved load regulation, and tight line regulation. Low-power high-throughput SRAM techniques help millimeter-scale microsystems meet stringent power budgets. VDD scaling in memory decreases energy per access, but also decreases stability margins. These margins can be improved using sizing, VTH selection, and assist circuits, as well as new bitcell designs. Adaptive Crosshairs modulation of SRAM power supplies fixes 70% of parametric failures. Half-differential SRAM design improves stability, reducing VMIN by 72mV. The circuit techniques for energy autonomy presented in this dissertation enable millimeter-scale microsystems for medical implants, such as blood pressure and glucose sensors, as well as non-medical applications, such as supply chain and infrastructure monitoring. These pervasive sensors represent the continuation of Bell’s Law, which accurately traces the evolution of computers as they become smaller, more numerous, and more powerful. The development of millimeter-scale massively-deployed ubiquitous computers ensures the continued expansion and profitability of the semiconductor industry. NanoWatt circuit techniques will allow us to meet this next frontier in IC design.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/86387/1/grgkchen_1.pd

The Journal of Microelectronic Research 2009

https://scholarworks.rit.edu/meec_archive/1017/thumbnail.jp

Skybridge-3D-CMOS: A Fine-Grained Vertical 3D-CMOS Technology Paving New Direction for 3D IC

2D CMOS integrated circuit (IC) technology scaling faces severe challenges that result from device scaling limitations, interconnect bottleneck that dominates power and performance, etc. 3D ICs with die-die and layer-layer stacking using Through Silicon Vias (TSVs) and Monolithic Inter-layer Vias (MIVs) have been explored in recent years to generate circuits with considerable interconnect saving for continuing technology scaling. However, these 3D IC technologies still rely on conventional 2D CMOS’s device, circuit and interconnect mindset showing only incremental benefits while adding new challenges reliability issues, robustness of power delivery network design and short-channel effects as technology node scaling. Skybridge-3D-CMOS (S3DC) is a fine-grained 3D IC fabric that uses vertically-stacked gates and 3D interconnections composed on vertical nanowires to yield orders of magnitude benefits over 2D ICs. This 3D fabric fully uses the vertical dimension instead of relying on a multi-layered 2D mindset. Its core fabric aspects including device, circuit-style, interconnect and heat-extraction components are co-architected considering the major challenges in 3D IC technology. In S3DC, the 3D interconnections provide greater routing capacity in both vertical and horizontal directions compared to conventional 3D ICs, which eliminates the routability issue in conventional 3D IC technology while enabling ultra-high density design and significant benefits over 2D. Also, the improved vertical routing capacity in S3DC is beneficial for achieving robust and high-density power delivery network (PDN) design while conventional 3D IC has design issues in PDN design due to limited routing resource in vertical direction. Additionally, the 3D gate-all-around transistor incorporating with 3D interconnect in S3DC enables significant SRAM design benefits and good tolerance of process variation compared to conventional 3D IC technology as well as 2D CMOS. The transistor-level (TR-L) monolithic 3D IC (M3D) is the state-of-the-art monolithic 3D technology which shows better benefits than other M3D approaches as well as the TSV-based 3D IC approach. The S3DC is evaluated in large-scale benchmark circuits with comparison to TR-L M3D as well as 2D CMOS. Skybridge yields up to 3x lower power against 2D with no routing congestion in benchmark circuits while TR-L M3D only has up-to 22% power saving with severe routing congestions in the design. The PDN design in S3DC show