Photonic integration enabling new multiplexing concepts in optical board-to-board and rack-to-rack interconnects

New broadband applications are causing the datacenters to proliferate, raising the bar for higher interconnection speeds. So far, optical board-to-board and rack-to-rack interconnects relied primarily on low-cost commodity optical components assembled in a single package. Although this concept proved successful in the first generations of optical-interconnect modules, scalability is a daunting issue as signaling rates extend beyond 25 Gb/s. In this paper we present our work towards the development of two technology platforms for migration beyond Infiniband enhanced data rate (EDR), introducing new concepts in board-to-board and rack-to-rack interconnects. The first platform is developed in the framework of MIRAGE European project and relies on proven VCSEL technology, exploiting the inherent cost, yield, reliability and power consumption advantages of VCSELs. Wavelength multiplexing, PAM-4 modulation and multi-core fiber (MCF) multiplexing are introduced by combining VCSELs with integrated Si and glass photonics as well as BiCMOS electronics. An in-plane MCF-to-SOI interface is demonstrated, allowing coupling from the MCF cores to 340x400 nm Si waveguides. Development of a low-power VCSEL driver with integrated feed-forward equalizer is reported, allowing PAM-4 modulation of a bandwidth-limited VCSEL beyond 25 Gbaud. The second platform, developed within the frames of the European project PHOXTROT, considers the use of modulation formats of increased complexity in the context of optical interconnects. Powered by the evolution of DSP technology and towards an integration path between inter and intra datacenter traffic, this platform investigates optical interconnection system concepts capable to support 16QAM 40GBd data traffic, exploiting the advancements of silicon and polymer technologies

A 160Gb/s (4x40) WDM O-band Tx subassembly using a 4-ch array of silicon rings co-packaged with a SiGe BiCMOS IC driver

We present a 400 (8×50) Gb/s-capable RM-based Si-photonic WDM O-band TxRx with 1.17nm channel spacing for high-speed optical interconnects and demonstrate successful 50Gb/s-NRZ TxRx operation achieving a ~4.5dB Tx extinction ratio under 2.15Vpp drive

High Input/output Density Optoelectronic Probe Card For Wafer-level Test Of Electrical And Optical Interconnect Components, Methods Of Fabrication, And Methods Of Use

Optoelectronic probe cards, methods of fabrication, and methods of use, are disclosed. Briefly described, one exemplary embodiment includes an optoelectronic probe card adapted to test an electrical quality and an optical quality of an optoelectronic structure under test having electrical and optical components.Georgia Tech Research Corporatio

Limits on Fundamental Limits to Computation

An indispensable part of our lives, computing has also become essential to industries and governments. Steady improvements in computer hardware have been supported by periodic doubling of transistor densities in integrated circuits over the last fifty years. Such Moore scaling now requires increasingly heroic efforts, stimulating research in alternative hardware and stirring controversy. To help evaluate emerging technologies and enrich our understanding of integrated-circuit scaling, we review fundamental limits to computation: in manufacturing, energy, physical space, design and verification effort, and algorithms. To outline what is achievable in principle and in practice, we recall how some limits were circumvented, compare loose and tight limits. We also point out that engineering difficulties encountered by emerging technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl

The rising role of photonics in today's data centres

In recent years there has been a rapid growth in demand for ultra high speed data transmission with end users expecting fast, high bandwidth network access. This growth has put data centres under increasing pressure to provide greater data throughput and ever increasing data rates while at the same time improving the quality of data handling in terms of reduced latency, increased scalability and improved channel speed for users. However, data networks are becoming increasingly difficult to scale to meet this growing demand using current well established CMOS technology and architectures. As a result electronic bottlenecks are becoming apparent despite improvements in data management. The inter-related issues of electronic scalability, power consumption, copper interconnect bandwidth and the limited speed of CMOS electronics will be discussed; and the tremendous potential of optical fibre based networks to provide the necessary bandwidth will be illustrated. In addition, some applications of photonics to alleviate speed, throughput and latency issues in data networks will be discussed. Finally, progress in the form of a novel and highly scalable optical interconnect will be reviewed

Characterization of optical interconnects

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2000.Includes bibliographical references (p. 72-75).Interconnect has become a major issue in deep sub-micron technology. Even with copper and low-k dielectrics, parasitic effects of interconnects will eventually impede advances in integrated electronics. One technique that has the potential to provide a paradigm shift is optics. This project evaluates the feasibility of optical interconnects for distributing data and clock signals. In adopting this scheme, variation is introduced by the detector, the waveguides, and the optoelectronic circuit, which includes device, power supply and temperature variations. We attempt to characterize the effects of the aforementioned sources of variation by designing a baseline optoelectronic circuitry and fabricating a test chip which consists of the circuitry and detectors. Simulations are also performed to supplement the effort. The results are compared with the performance of traditional metal interconnects. The feasibility of optical interconnects is found to be sensitive to the optoelectronic circuitry used. Variation effects from the devices and operating conditions have profound impact on the performance of optical interconnects since they introduce substantial skew and delay in the otherwise ideal system.by Shiou Lin Sam.S.M